Chong Li Phones & Addresses
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2046 Clement St, San Francisco, CA 94121 (415) 668-1984
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West Columbia, SC
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Columbia, SC
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Lexington, SC
Business Records
Name / Title
Company / Classification
Phones & Addresses
Owner
Chong's Barber & Beauty Shop
Beauty Shop
Beauty Shop
1335 Grant Ave, San Francisco, CA 94133
(415) 956-6878
(415) 956-6878
STYLE 88, INC
Publications
Us Patents
Combination Parallel Path Heatsink And Emi Shield
View pageUS Patent:
20180348827, Dec 6, 2018
Filed:
Jul 23, 2018
Appl. No.:
16/042804
Inventors:
- Cupertino CA, US
Vinh H. Diep - Palo Alto CA, US
Brian L. Chuang - Menlo Park CA, US
Judith C. Segura - San Francisco CA, US
Frank F. Liang - San Jose CA, US
Leanne Bach Lien T. Ly - San Jose CA, US
Kevin Z. Lo - Belmont CA, US
Po W. Chiu - Campbell CA, US
Lukose Ninan - Foster City CA, US
Chong Li - Fremont CA, US
Vinh H. Diep - Palo Alto CA, US
Brian L. Chuang - Menlo Park CA, US
Judith C. Segura - San Francisco CA, US
Frank F. Liang - San Jose CA, US
Leanne Bach Lien T. Ly - San Jose CA, US
Kevin Z. Lo - Belmont CA, US
Po W. Chiu - Campbell CA, US
Lukose Ninan - Foster City CA, US
Chong Li - Fremont CA, US
Assignee:
Apple Inc. - Cupertino CA
International Classification:
G06F 1/20
H05K 1/02
H05K 7/20
H05K 9/00
H05K 1/02
H05K 7/20
H05K 9/00
Abstract:
Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
Combination Parallel Path Heatsink And Emi Shield
View pageUS Patent:
20170071074, Mar 9, 2017
Filed:
Sep 4, 2015
Appl. No.:
14/846526
Inventors:
- Cupertino CA, US
Vinh H. Diep - Palo Alto CA, US
Brian L. Chuang - Menlo Park CA, US
Judith C. Segura - San Francisco CA, US
Frank F. Liang - San Jose CA, US
Leanne Bach Lien T. Ly - San Jose CA, US
Kevin Z. Lo - Belmont CA, US
Po W. Chiu - Campbell CA, US
Lukose Ninan - Foster City CA, US
Chong Li - Fremont CA, US
Vinh H. Diep - Palo Alto CA, US
Brian L. Chuang - Menlo Park CA, US
Judith C. Segura - San Francisco CA, US
Frank F. Liang - San Jose CA, US
Leanne Bach Lien T. Ly - San Jose CA, US
Kevin Z. Lo - Belmont CA, US
Po W. Chiu - Campbell CA, US
Lukose Ninan - Foster City CA, US
Chong Li - Fremont CA, US
International Classification:
H05K 7/20
G06F 1/20
H05K 9/00
G06F 1/20
H05K 9/00
Abstract:
Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.