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Bo Li

from Foster City, CA
Age ~39
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Related to:
Lei Wang, 47Chung S Li, 57Peggy L Lee, 53Fei Li, 48Lichen Hsu, 61Man G Wu, 53David J Holdych, 50Kenneth S Lee, 54Li Q Wang, 68Tienli Liu, 48Fengchiao Chung, 63Bo Qian, 48Erice H Liu, 44Zhengwei Li, 43
Connected to:
Ai Q Li, 64Ai H Li, 81Aida Li, 67Aijun Li, 65Aiwen Q Li, 56Aiyan Li, 61Alan Li, 80Alice Li, 46Alida Li, 59Alisha Li, 31

Bo Li Phones & Addresses

  • Foster City, CA
  • Quincy, MA
  • El Cerrito, CA
  • Madison, WI

Professional Records

Lawyers & Attorneys

Bo Li Photo 1

Bo Li - Lawyer

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Address:
(917) 815-6970 (Office)
Licenses:
New York - Currently registered 2004
Education:
New York University School of Law
Bo Li Photo 2

Bo Li - Lawyer

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Address:
The People's Bank of China-Monetary Policy Dept-II
(106) 619-4318 (Office)
Licenses:
New York - Currently registered 2000
Education:
Harvard Law School
Bo Li Photo 3

Bo Li - Lawyer

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Address:
Fulbright & Jaworski LLP
(713) 651-5151 (Office)
Licenses:
New York - Currently registered 2011
Education:
The Pennsylvania State U. The Dickinson School of

Resumes

Resumes

Bo Li Photo 4

Bo Li

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Work:
Shinetech Technologies

Sep 2009 to Sep 2010
Job positioniPhone Software Engineer
Bokan Technologies

Mar 2009 to Sep 2009
Job positioniPhone app developer
Samsung Communication R&D center

Sep 2008 to Dec 2008
Job positionLinux Software Engineer
Education:
Hanyang University
Sep 2010 to 2000
Ph.D
Beijing University of Posts and Telecommunications
Sep 2006 to Apr 2009
MSc
Chongqing University of Posts and Telecommunications
Sep 2002 to Jul 2006
B.S
Bo Li Photo 5

Bo Li

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Work:
Disney

2014 to 2000
concept illustration for game production intern
Scribble Pad Studios Pre-Vis Concept Art

Apr 2014 to May 2014
Scribble Pad Studios Pre-Vis Concept Art

May 2013 to May 2014
Scribble Pad Studios Pre-Vis Concept Art

2012 to 2014
Visual Development, Environment Design
Scribble Pad Studios Pre-Vis Concept Art

Jan 2013 to Apr 2013
Mashiyu Entertainment

2011 to 2011
Freelance environmental concept design, comic book, book cover
2010 to 2011
Vasoon Animation Co, Ltd

2008 to 2009
Bo Li Photo 6

Bo Li

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Work:
CCIT Clemson

Sep 2014 to 2000
Front End Developer
Clemson University

Jan 2014 to Aug 2014
iOS Developer
Intel Ltd. Co

Jan 2012 to May 2013
Software Developer
Education:
Clemson University
Aug 2013 to Dec 2014
M.S. in Computer Science
University of Science and Technology of China
Aug 2010 to May 2012
M.S. in Software Engineering
Bo Li Photo 7

Bo Li Boston, MA

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Work:
Northeastern University

May 2011 to 2000
Research Assistant
Northeastern University
Boston, MA
Sep 2008 to Dec 2011
Research Assistant
Northeastern University
Boston, MA
Sep 2008 to Dec 2010
Research Assistant
Sichuan University
Chengdu China
Sep 2005 to Jul 2008
Research Assistant
Education:
Sichuan University
Chengdu, CN
Jul 2008
Master in Material Engineering
Sichuan University
Chengdu, China
2001 to 2005
BS in Polymer Engineering
Northeastern University
Boston, MA
Ph.D. in Mechanical Engineering

Business Records

Name / Title
Company / Classification
Phones & Addresses
Bo Li
Owner
China-US Pinky Promise Consulting LLC
Business Consulting Services
25 Cor Stone Way, Madison, WI 53711
Bo Li
Lipedia, LLC
Business Application Analysis & Implemen · Nonclassifiable Establishments
41616 Marigold Dr, Fremont, CA 94539
Bo Li
IFER SOLON II, LLC
Bo Li
SOLON FINANCIAL GROUP, LLC
Bo Li
IFER SOLON, LLC
Bo Li
T.E.M. INTERNATIONAL, INC
Bo Li
US-CHINA CULTURE & BUSINESS ASSOCIATION, LTD
Bo Li
President
3 I Systems Corp
Business Services

Publications

Isbn (Books And Publications)

International Symposium on Grassland Management in the Mongolian Plateau

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Author

Bo Li

ISBN #

7810158619

Us Patents

Organic Compositions

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US Patent:
6740685, May 25, 2004
Filed:
May 30, 2002
Appl. No.:
10/158548
Inventors:
Bo Li - San Jose CA
Paul G. Apen - San Jose CA
Kreisler S. Lau - Sunnyvale CA
Edward J. Sullivan - Campbell CA
Assignee:
Honeywell International Inc. - Morristown NJ
International Classification:
C08J 902
US Classification:
521 52, 521 77
Abstract:
The present invention provides a composition comprising (a) thermosetting component comprising: (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where E, Q, G, h, l, j, and w are as set forth below and (b) porogen that bonds to thermosetting component (a). Preferably, the porogen is selected from the group consisting of unsubstituted polynorbornene, substituted polynorbornene, polycaprolactone, unsubstituted polystyrene, substituted polystyrene, polyacenaphthylene homopolymer, and polyacenaphthylene copolymer. Preferably, the present compositions may be used as dielectric substrate in microchips, multichip modules, laminated circuit boards, or printed wiring boards.

Low Dielectric Constant Materials With Improved Thermo-Mechanical Strength And Processability

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US Patent:
6987147, Jan 17, 2006
Filed:
Oct 1, 2002
Appl. No.:
10/263204
Inventors:
Kreisler Lau - Sunnyvale CA, US
Bo Li - Campbell CA, US
Boris Korolev - San Jose CA, US
Edward Sullivan - Daly City CA, US
Ruslan Zherebin - Daly City CA, US
Assignee:
Honeywell International Inc. - Morristown NJ
International Classification:
C08G 65/30
C08G 65/38
C08F 8/00
US Classification:
525132, 525149, 525152, 525534, 528 86, 528125, 528185, 528219, 528220
Abstract:
A polymeric network comprises a plurality of monomers that include a cage compound with at least three arms, wherein at least one of the arms has two or more branches, and wherein each of the branches further comprises a reactive group. Monomers in contemplated polymeric networks are covalently coupled to each other via the reactive groups. Particularly contemplated cage compounds include adamantane and diamantane, and especially contemplated branched arms comprise ortho-bis(phenylethynyl)phenyl. Especially contemplated polymeric networks have a dielectric constant of no more than 3. 0, and are formed on the surface of a substrate.

Organic Compositions

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US Patent:
6998178, Feb 14, 2006
Filed:
Apr 2, 2003
Appl. No.:
10/404644
Inventors:
Paul G. Apen - San Jose CA, US
William B. Bedwell - San Jose CA, US
Nancy Iwamoto - San Diego CA, US
Boris A. Korolev - San Jose CA, US
Kreisler S. Lau - Sunnyvale CA, US
Bo Li - San Jose CA, US
Ananth Naman - San Jose CA, US
Assignee:
Honeywell International Inc. - Morristown NJ
International Classification:
B32B 9/04
US Classification:
428447, 528396, 528397, 525 50
Abstract:
The present invention provides a composition comprising:.

Method And Apparatus For Managing Network Resources For Externally Authenticated Users

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US Patent:
7010600, Mar 7, 2006
Filed:
Jun 29, 2001
Appl. No.:
09/895534
Inventors:
Ranjan Prasad - Fremont CA, US
Ramprasad Golla - San Jose CA, US
Serge Zloto - San Mateo CA, US
Bo Li - Campbell CA, US
Assignee:
Cisco Technology, Inc. - San Jose CA
International Classification:
G06F 15/173
US Classification:
709225, 709229, 709223
Abstract:
A method is disclosed for managing network resources in multiple administrative domains. According to the method, a user is authenticated in a first administrative domain. A token is generated for the user that identifies the user as being assigned a role. The token is configured to identify the user by the role to a component of a second administrative domain. When the user requests a resource of the second administrative domain, its component examines the token and the role to determine whether to grant access to the resource. As a result, the second administrative domain may grant the user access to its resources without re-authenticating the user in the second administrative domain.

System And Method For Providing A Marketing Presentation

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US Patent:
7028254, Apr 11, 2006
Filed:
Jan 13, 2000
Appl. No.:
09/483175
Inventors:
Chun R. Xia - Palo Alto CA, US
Yufeng Li - Santa Clara CA, US
Bo Li - Mountain View CA, US
Victor S. Zhu - Belmont CA, US
Yang Li - Fremont CA, US
Assignee:
PeopleSoft, Inc. - Plesanton CA
International Classification:
G06F 17/00
US Classification:
715513, 705 25, 705 27
Abstract:
According to an embodiment of the present invention, a web page can be dynamically created by a non-technical person. A technical person can set up a web page and incorporate marketing object containers. A non-technical person, such as a marketing person, then decides what marketing object to put into the various marketing object containers. Style templates, marketing campaigns, and various items associated with the campaigns may be used to create or change the web page. According to an embodiment of the present invention, these marketing object containers may be dynamically associated with different marketing object at different times.

Organic Compositions

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US Patent:
7049005, May 23, 2006
Filed:
May 30, 2002
Appl. No.:
10/160773
Inventors:
Paul G. Apen - San Jose CA, US
William B. Bedwell - San Jose CA, US
Nancy Iwamoto - Ramona CA, US
Boris A. Korolev - San Jose CA, US
Kreisler S. Lau - Sunnyvale CA, US
Bo Li - San Jose CA, US
Ananth Naman - San Jose CA, US
Assignee:
Honeywell International Inc. - Morristown NJ
International Classification:
B32B 9/04
US Classification:
428447, 528396, 528397, 525 50
Abstract:
The present invention provides a composition comprising:The present compositions may be used as a dielectric substrate material, etch stop, hardmask, or air bridge in microchips, multichip modules, laminated circuit boards, or printed wiring boards. The present composition may also be used as a passive coating for enveloping a completed wafer.

Organic Compositions

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US Patent:
7060204, Jun 13, 2006
Filed:
Apr 2, 2003
Appl. No.:
10/404047
Inventors:
Bo Li - San Jose CA, US
Nancy Iwamoto - San Diego CA, US
Boris Korolev - San Jose CA, US
Paul G. Apen - San Francisco CA, US
Kreisler Lau - Sunnyvale CA, US
John G. Sikonia - Bend OR, US
Ananth Naman - San Jose CA, US
Amauel Gebrebrhan - Mountain View CA, US
Nassrin Sleiman - Sunnyvale CA, US
Ruslan Zherebin - Daly City CA, US
Assignee:
Honeywell International Inc. - Morristown NJ
International Classification:
H01B 1/12
C08J 9/38
C08J 9/00
US Classification:
252511, 252500, 252 623, 521 52, 521 77, 525132
Abstract:
The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly(2-vinylnaphthalene), vinyl anthracene, polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.

Organic Compositions

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US Patent:
7141188, Nov 28, 2006
Filed:
May 30, 2002
Appl. No.:
10/158513
Inventors:
Bo Li - San Jose CA, US
Nancy Iwamoto - San Diego CA, US
Boris Korolev - San Jose CA, US
Paul G. Apen - San Jose CA, US
Kreisler Lau - Sunnyvale CA, US
John G. Sikonia - Bend OR, US
Ananth Naman - San Jose CA, US
Amauel Gebrebrhan - Mountain View CA, US
Nassrin Sleiman - Sunnyvale CA, US
Ruslan Zherebin - Daly City CA, US
Assignee:
Honeywell International Inc. - Morristown NJ
International Classification:
H01L 21/4763
H01B 3/22
C08F 8/00
C08J 9/02
US Classification:
252570, 252571, 252573, 252511, 521 52, 521 77, 525100, 525101, 525275, 257578
Abstract:
The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly(2-vinylnaphthalene), vinyl anthracene, polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.
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Bo Li from Foster City, CA, age ~39 Get Report