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Zonghui Su

from San Jose, CA
Age ~38
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Also known as:
Su Zonghui
Phone and address:
1058 Pear Orchard Dr, San Jose, CA 95131
Related to:
Yongqing SuSu Zonghui
Connected to:
Baolei Su, 66Beihan Su, 52Bogong Su, 86Bowei Su, 31Bryan J Su, 39Carrie J Su, 39Ching-Hua Su, 70Chunming M Su, 54Danielle Su, 31Daqing S Su, 54

Zonghui Su Phones & Addresses

  • 1058 Pear Orchard Dr, San Jose, CA 95131
  • Jersey City, NJ
  • Pittsburgh, PA

Work

Company: Applied materials Nov 2014 Position: Mechanical engineer

Education

Degree: Doctorates, Doctor of Philosophy School / High School: Carnegie Mellon University 2009 to 2014 Specialities: Engineering, Mechanical Engineering, Philosophy

Skills

Heat Transfer • Fabrication • Semiconductors • Back End Processing • Matlab • Mathematica • Photolithography • Cvd • Pvd • Autocad • C • C++ • Ansys • Thermodynamics • Optical Microscopy • Ug • Sem • Afm • Xrd • Powder X Ray Diffraction • Finite Element Analysis • Mechanical Product Design • Solidworks • Ptc Pro/Engineer • Thermal Management • Ptc Creo • Modeling • Simulations

Languages

Mandarin • English

Interests

Thermal Testing and Management • Product Development • Environment • Education • Led • Mechanical Design • Science and Technology • Fea • Health

Industries

Mechanical Or Industrial Engineering

Resumes

Resumes

Zonghui Su Photo 1

Mechanical Engineer

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Location:
San Francisco, CA
Industry:
Mechanical Or Industrial Engineering
Work:
Applied Materials
Mechanical Engineer
Flextronics Jun 2014 - Sep 2014
Mechanical Engineering Intern
Carnegie Mellon University Aug 2009 - May 2014
Research Assistant
Education:
Carnegie Mellon University 2009 - 2014
Doctorates, Doctor of Philosophy, Engineering, Mechanical Engineering, Philosophy Tsinghua University 2005 - 2009
Bachelors, Design
Skills:
Heat Transfer
Fabrication
Semiconductors
Back End Processing
Matlab
Mathematica
Photolithography
Cvd
Pvd
Autocad
C
C++
Ansys
Thermodynamics
Optical Microscopy
Ug
Sem
Afm
Xrd
Powder X Ray Diffraction
Finite Element Analysis
Mechanical Product Design
Solidworks
Ptc Pro/Engineer
Thermal Management
Ptc Creo
Modeling
Simulations
Interests:
Thermal Testing and Management
Product Development
Environment
Education
Led
Mechanical Design
Science and Technology
Fea
Health
Languages:
Mandarin
English
Zonghui Su Photo 2

Zonghui Su Pittsburgh, PA

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Work:
Malen Laboratory, Carnegie Mellon University

2009 to 2000
Research Assistant
Malen Laboratory, Carnegie Mellon University

2011 to 2013
TA Grader
Education:
Carnegie Mellon University
Pittsburgh, PA
Aug 2009 to Jan 2014
Ph.D. in Thermal transport
Carnegie Mellon University
2011
M.S. in Mechanical Engineering
Tsinghua University
2005 to 2009
B.S.E.
Skills:
Thermal, mechanical, fabrication, photolithography, energy, calibration, optical, Matlab, analysis, trouble shooting, superlattice, nano films, interface, instrumentation
Zonghui Su Photo 3

Zonghui Su San Jose, CA

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Work:
Multek, Flextronics

Jun 2014 to 2000
Mechanical Engineering Intern
Malen Laboratory, Carnegie Mellon University

Aug 2009 to May 2014
Research Assistant
Carnegie Mellon University

Aug 2009 to May 2011
Thermal management
Tsinghua University, Department of Precision Instruments and Machinery

Aug 2005 to Jun 2009
Tsinghua University

May 2008 to Aug 2008
Summer Design Engineer, Mechanical Drawing and Design
Student News Agency, Tsinghua University

Oct 2005 to Dec 2006
President
Metalworking Practice, Tsinghua University

May 2006 to Aug 2006
Summer Engineer
Education:
Carnegie Mellon University
Pittsburgh, PA
Aug 2009 to May 2014
Ph.D. in Thermal management

Publications

Us Patents

Critical Methodology In Vacuum Chambers To Determine Gap And Leveling Between Wafer And Hardware Components

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US Patent:
20180046088, Feb 15, 2018
Filed:
Aug 11, 2017
Appl. No.:
15/675101
Inventors:
- Santa Clara CA, US
Jianhua ZHOU - Campbell CA, US
Zonghui SU - San Jose CA, US
Juan Carlos ROCHA-ALVAREZ - San Carlos CA, US
Jeongmin LEE - Sunnyvale CA, US
Karthik Thimmavajjula NARASIMHA - San Francisco CA, US
Rick GILBERT - San Jose CA, US
Sang Heon PARK - Fremont CA, US
Abdul Aziz KHAJA - San Jose CA, US
Vinay PRABHAKAR - Cupertino CA, US
International Classification:
G03F 7/20
H01L 21/02
H01L 21/683
G03F 7/16
Abstract:
Implementations described herein generally relate to methods for leveling a component above a substrate. In one implementation, a test substrate is placed on a substrate support inside of a processing chamber. A component, such as a mask, is located above the substrate. The component is lowered to a position so that the component and the substrate are in contact. The component is then lifted and the particle distribution on the test substrate is reviewed. Based on the particle distribution, the component may be adjusted. A new test substrate is placed on the substrate support inside of the processing chamber, and the component is lowered to a position so that the component and the new test substrate are in contact. The particle distribution on the new test substrate is reviewed. The process may be repeated until a uniform particle distribution is shown on a test substrate.

Substrate Support Pedestal Having Plasma Confinement Features

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US Patent:
20170306494, Oct 26, 2017
Filed:
Jan 26, 2017
Appl. No.:
15/416295
Inventors:
- Santa Clara CA, US
Vijay D. PARKHE - San Jose CA, US
Jianhua ZHOU - Campbell CA, US
Jaeyong CHO - San Jose CA, US
Zheng John YE - Santa Clara CA, US
Zonghui SU - San Jose CA, US
Juan Carlos ROCHA-ALVAREZ - San Carlos CA, US
International Classification:
C23C 16/509
H01L 21/67
C23C 16/458
C23C 16/455
C23C 16/455
C23C 16/455
H01L 21/683
C23C 16/46
Abstract:
A method and apparatus for a heated substrate support pedestal is provided. In one embodiment, the heated substrate support pedestal includes a body comprising a ceramic material, a plurality of heating elements encapsulated within the body A stem is coupled to a bottom surface of the body. A plurality of heater elements, a top electrode and a shield electrode are disposed within the body. The top electrode is disposed adjacent a top surface of the body, while the shield electrode is disposed adjacent the bottom surface of the body. A conductive rod is disposed through the stem and is coupled to the top electrode.
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Zonghui Su from San Jose, CA, age ~38 Get Report