Inventors:
Jing Qi - Lake Zurich IL
Janice Danvir - Arlington Heights IL
Zhaojin Han - Lake Zurich IL
Prasanna Kulkarni - Schaumburg IL
Nadia Yala - Schaumburg IL
Robert Doot - Seattle WA
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 3300
Abstract:
A bumped semiconductor device ( ) exhibiting enhanced pattern recognition when illuminated in a machine vision system. The semiconductor device has a substantially coplanar array of solder bumps ( ) and a coating of underfill material ( ) on one face. A fluxing composition ( ) containing an image enhancing agent is selectively deposited over at least two of the solder bumps in the array to modify the optical characteristics of the solder bumps to cause the solder bumps to appear bright against the background of the underfill material when the semiconductor device is illuminated ( ) by selected wavelengths of light.