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Winston Y Su

from Saratoga, CA
Age ~48
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Also known as:
Winston Yin Chia Su, Winston Yin-Chia Su, Winston Yinchia Te Su, Winston Vin Chia Su, Winston V Su, Yin-Chia Su Winston, Su Winston
Related to:
Steven H Kiser, 73Cybele T Chang, 52Paula L Willson, 53Nicole Winston, 45Hillary Berbeco, 59
Connected to:
Baolei Su, 66Beihan Su, 52Bogong Su, 86Bowei Su, 31Bryan J Su, 39Carrie J Su, 39Ching-Hua Su, 70Chunming M Su, 54Danielle Su, 31Daqing S Su, 54

Winston Su Phones & Addresses

  • Saratoga, CA
  • 20275 Northglen Sq, Cupertino, CA 95014 (408) 517-1040
  • 2081 Colusa Way, San Jose, CA 95130
  • Berkeley, CA
  • Mountain View, CA
  • Burlingame, CA
  • Stanford, CA
  • Alhambra, CA
  • 4725 Heathview Dr, San Jose, CA 95130

Work

Company: Cooley, Godward, Kronish LLP Address: 3175 Hanover St, Palo Alto, CA 94304 Specialities: Business - 100%

Education

Degree: JD - Juris Doctor School / High School: University of California at Berkeley, Boalt Hall School of Law

Ranks

Licence: California - Active Date: 2008

Professional Records

Lawyers & Attorneys

Winston Su Photo 1

Winston Y Su, Palo Alto CA - Lawyer

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Address:
Cooley, Godward, Kronish LLP
3175 Hanover St, Palo Alto, CA 94304
(650) 843-5193 (Office), (650) 843-5193 (Office)
Licenses:
California - Active 2008
Education:
University of California at Berkeley, Boalt Hall School of Law
Degree - JD - Juris Doctor - Law
Graduated - 2008
Stanford University
Degree - MS
Graduated - 2000
Stanford University
Degree - BS - Bachelor of Science
Graduated - 1999
Specialties:
Business - 100%
Associations:
State Bar of California - Member

Business Records

Name / Title
Company / Classification
Phones & Addresses
Winston Su
Associate
COOLEY GODWARD KRONISH LLP
Legal Services Office
101 California St FL 5, San Francisco, CA 94111
101 California St, Fl5, San Francisco, CA 94111
(415) 693-2000, (415) 693-2222, (415) 693-2076, (415) 693-2170

Publications

Us Patents

Method And Apparatus For Chemical Mechanical Polishing

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US Patent:
6558236, May 6, 2003
Filed:
Jun 26, 2001
Appl. No.:
09/893214
Inventors:
Timothy James Donohue - Menlo Park CA
Declan Liam Brett - Santa Clara CA
Gopalakrishna B. Prabhu - Sunnyvale CA
Winston Y. Su - Mountain View CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
B24B 100
US Classification:
451 41, 451 36, 451285, 451307, 451530
Abstract:
Generally, a method and apparatus for polishing a substrate is provided. In one embodiment, an apparatus for polishing a substrate includes a polishing material having a fluid disposed thereon. The polishing material has a plurality of elements extending from a backing. The fluid that fills the entire volume between the elements comprising the polishing material has a viscosity between about 100 to about 10,000 centipoises. The fluid allows generation of a hydrostatic force that ensures the full and completed envelopment of fluid surrounding the fixed abrasive elements when polishing, thus substantially reducing the deformation of the elements, resulting in extended polishing material life.

Methods And Compositions For Chemical Mechanical Polishing Substrates

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US Patent:
20060088976, Apr 27, 2006
Filed:
Oct 22, 2004
Appl. No.:
10/971561
Inventors:
Garrett Sin - San Jose CA, US
Winston Su - Cupertino CA, US
Sidney Huey - Fremont CA, US
International Classification:
H01L 21/76
US Classification:
438424000
Abstract:
Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate comprising a dielectric material and polysilicon material disposed thereon, polishing the polysilicon material with a high topography selective polishing composition, and polishing the polysilicon material with a material selective composition.

Methods And Compositions For Chemical Mechanical Polishing Substrates

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US Patent:
20060088999, Apr 27, 2006
Filed:
Nov 14, 2005
Appl. No.:
11/274378
Inventors:
Garrett Sin - San Jose CA, US
Winston Su - Cupertino CA, US
Sidney Huey - Fremont CA, US
International Classification:
H01L 21/302
US Classification:
438689000
Abstract:
Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate comprising a dielectric material and polysilicon material disposed thereon, polishing the polysilicon material with a high topography selective polishing composition, and polishing the polysilicon material with a material selective composition.
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Winston Y Su from Saratoga, CA, age ~48 Get Report