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Sharathchandra Somayaji

from Santa Clara, CA
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Also known as:
Somaya Sharathchandra
Related to:
Veronica Ann Batton, 74Dorothy J Ash, 98Sharathchandr SomayajiManasa Somayaji, 42
Connected to:
Krishna K Somayajula, 48Mahesh S Somayaji, 41Srinivas S Somayajula, 42Sriram Somayajula, 52Andrea R Somberg, 44Claude F Somberg, 88Jesse S Somberg, 47Matthew Somberg, 46Merle G Somberg, 75Rajagopal V Sombhotla, 45

Sharathchandra Somayaji Phones & Addresses

  • Santa Clara, CA
  • Sunnyvale, CA
  • Phoenix, AZ
  • Los Angeles, CA
  • Glendale, CA
  • Palo Alto, CA

Work

Company: Intuitive surgical Aug 2012 Address: Sunnyvale,CA Position: Npi manager, instruments

Education

Degree: M.S School / High School: Stanford University Specialities: Mechanical Engineering

Skills

Medical Devices • Product Development • Cross Functional Team Leadership • Manufacturing • Design Control • Engineering • R&D • Design of Experiments • Project Management • Product Design • Design For Manufacturing • Failure Mode and Effects Analysis • Leadership • Management • Fmea • Iso 13485 • Research and Development • Validation

Languages

English

Industries

Medical Devices

Resumes

Resumes

Sharathchandra Somayaji Photo 1

Director, Npi Engineering

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Location:
600 Hudson Dr, Santa Clara, CA 95051
Industry:
Medical Devices
Work:
Intuitive Surgical - Sunnyvale,CA since Aug 2012
NPI manager, Instruments
Intuitive Surgical since Aug 2010
Sr. Manufacturing Engineer
St. Jude Medical - CRMD Aug 2006 - May 2009
Hardware Design Engineer
Applied Materials Aug 2004 - Aug 2006
Mechanical Engineer
Stanford University Sep 2003 - Jun 2004
Teaching Assistant
Education:
Stanford University
M.S, Mechanical Engineering
Skills:
Medical Devices
Product Development
Cross Functional Team Leadership
Manufacturing
Design Control
Engineering
R&D
Design of Experiments
Project Management
Product Design
Design For Manufacturing
Failure Mode and Effects Analysis
Leadership
Management
Fmea
Iso 13485
Research and Development
Validation
Languages:
English

Publications

Us Patents

Method Of Proximity Pin Manufacture

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US Patent:
20070246839, Oct 25, 2007
Filed:
Apr 21, 2006
Appl. No.:
11/408465
Inventors:
Harald Herchen - Los Altos CA, US
Sharathchandra Somayaji - Sunnyvale CA, US
Brian Lue - Mountain View CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
H01L 23/52
US Classification:
257784000
Abstract:
A method and apparatus related to a substrate support structure are provided. In accordance with one embodiment of the present invention, a method for manufacturing a substrate support structure including proximity pins and apparatus for supporting a substrate inside a semiconductor processing equipment are provided. The method includes providing a plate assembly comprising a plate and a plate surface and forming a plurality of recessed regions in the plate surface. Additionally, the method includes filling the recessed regions with a bonding material including epoxy material and placing a plurality of support members into the epoxy-coated recessed regions. The method further includes pushing the support members with a flat plate held up from the surface by shims to provide a uniform local height of the support members, followed by a curing step to fix the supporting members to the recessed regions.

Composite Heater And Chill Plate

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US Patent:
20070251456, Nov 1, 2007
Filed:
Apr 27, 2006
Appl. No.:
11/414730
Inventors:
Harald Herchen - Los Altos CA, US
Sharathchandra Somayaji - Sunnyvale CA, US
Tetsuya Ishikawa - Saratoga CA, US
Brian Lue - Mountain View CA, US
Assignee:
APPLIED MATERIALS, INC., A Delaware corporation - Santa Clara CA
International Classification:
C23C 16/00
US Classification:
118724000
Abstract:
An integrated system for baking and chilling wafers includes a heater for heating a wafer to an elevated temperature, a chiller for cooling the wafer, and a shuttle operatively connected to the heater and the chiller for transferring the wafer between the heater and the chiller. The chiller further includes a low thermal mass wafer support for providing support to a bottom surface of a wafer and a chill plate coupled to the low thermal mass wafer support for cooling the wafer. The low thermal mass wafer support has a higher thermal conductivity in the plane parallel to the bottom surface of the wafer than in the direction perpendicular to the bottom surface of the wafer. The low thermal mass wafer support can further include a plurality of proximity pins for supporting the wafer.

Methods And Systems For Performing Real-Time Wireless Temperature Measurement For Semiconductor Substrates

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US Patent:
20080097714, Apr 24, 2008
Filed:
Mar 21, 2007
Appl. No.:
11/689384
Inventors:
Sharathchandra Somayaji - Sunnyvale CA, US
Christopher L. Beaudry - San Jose CA, US
David Quach - San Jose CA, US
Assignee:
SOKUDO CO., LTD. - Kyoto
International Classification:
G01K 7/16
G01K 15/00
US Classification:
702 99, 702130, 702133
Abstract:
A monitor device includes a substrate and a plurality of temperature sensors disposed in the substrate. The monitor device also includes a processor coupled to the substrate and adapted to receive one or more signals from the plurality of temperature sensors. The processor is further adapted to convert the one or more received signals into one or more converted signals. The monitor device further includes a transceiver coupled to the substrate and adapted to receive the one or more converted signals. The transceiver is further adapted to transmit one or more output signals to an external receiver.

Devices And Methods For Crimp Interface For Cable Tension Sensor

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US Patent:
20220401171, Dec 22, 2022
Filed:
Jun 15, 2022
Appl. No.:
17/840859
Inventors:
- Sunnyvale CA, US
Jason MIAO - Sunnyvale CA, US
David I. MOREIRA RIDSDALE - Saratoga CA, US
Harsukhdeep S. RATIA - Foster City CA, US
Sharathchandra SOMAYAJI - Santa Clara CA, US
Zhou YE - Santa Clara CA, US
Assignee:
Intuitive Surgical Operations, Inc. - Sunnyvale CA
International Classification:
A61B 34/00
G01L 5/10
G01L 1/22
A61B 34/35
Abstract:
A medical device comprises an end effector, a mechanical structure, a connector, and a force sensor unit. The connector extends from a drive component of the mechanical structure to the end effector. Motion of the drive component produces a tension force within the connector, which is associated with an end effector torque or force exerted by the end effector. The force sensor unit comprises a body, and the body is coupled in-line with the connector so that strain in the connector is imparted to the body. A strain sensor measures the strain on the body as an indication of strain in the connector, which is an indication of torque or force at the end effector. The connector may be continuous, and coupled to the body with a slack relief portion of the connector within the body. Alternatively, the connector may be discontinuous and coupled to opposite ends of the body.
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Sharathchandra Somayaji from Santa Clara, CA Get Report