US Patent:
20200181407, Jun 11, 2020
Inventors:
- Golden CO, US
Joshua John MAJOR - Kittredge CO, US
Kevin Scott BENNION - Littleton CO, US
Sreekant Venkat Jagannath NARUMANCHI - Littleton CO, US
Paul Philip PARET - Thornton CO, US
Gilberto MORENO - Thornton CO, US
Justine Emily COUSINEAU - Lakewood CO, US
International Classification:
C08L 79/08
H01L 23/00
H01L 23/373
H01L 25/065
Abstract:
Disclosed herein are power electronics modules that include a polyimide film. For example, the power electronics modules described herein utilize polyimide film as a substrate and are capable of three-dimensional (3D) heat removal of semiconductors.