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Mark Allen Finkle

from Tracy, CA
Age ~72
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Also known as:
Mark A Finkle, Mark Candice Finkle, Mark A Park, Mark Sinkle, Mark Finkel
Phone and address:
2784 Redbridge Rd, Tracy, CA 95377
Related to:
Seon Hwa Park, 52Jason Lee, 50Sunmi Cabral, 57Kyong P SunJonathan Park, 62
Connected to:
Barbara J Finkle, 71Billy R Finklea, 74Catherine F Finklea, 85Catherine A Finkle, 53Doreen Finkle, 59Edward Finkle, 80Gwendolyn V Finklea, 64Irene A Finkle, 101Jessica Finklea, 37Jessica M Finkle, 45

Mark Finkle Phones & Addresses

  • 2784 Redbridge Rd, Tracy, CA 95377
  • Fremont, CA
  • Goleta, CA
  • Bentonville, AR
  • Benton, AR

Work

Company: Invenios inc - Santa Barbara, CA Aug 2006 Position: Senior mechanical engineer

Education

School / High School: College of San Mateo- San Mateo, CA 1970 Specialities: AA

Resumes

Resumes

Mark Finkle Photo 1

Owner

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Industry:
Computer Networking
Work:
Ssi Data Systems
Owner
Skills:
Sales Process
Team Building
Sales Management
New Business Development
Negotiation
Selling
Sales
Customer Satisfaction
Marketing
Customer Service
Customer Retention
Sales Operations
Automotive
Marketing Strategy
Account Management
Crm
Recruiting
Seo
Leadership Development
Wireless Networking
Team Leadership
E Commerce
Strategic Planning
Process Improvement
Email Marketing
Leadership
Management
Firearns
Mark Finkle Photo 2

Senior Mechanical Engineer

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Location:
1103 Cedarwood Loop, San Ramon, CA 94582
Industry:
Mechanical Or Industrial Engineering
Work:
Checkpoint Technologies
Senior Mechanical Engineer
Alta Devices
Senior Mechanical Engineer
Tesla Oct 2015 - Jun 2018
Staff Mechanical Engineer at Tesla Motors
Cepheid Nov 1, 2013 - Sep 1, 2015
Mechanical Design Automation
Mechanical Design Automation Engineering Leaders In the Santa Barbara California Area Jul 2013 - Mar 2014
Founder || Mechanical Design Automation Engineer
Education:
College of San Mateo
Associates, Associate of Arts, Engineering
Skills:
Automation
Manufacturing
Engineering
Mechanical Engineering
Autocad
Product Development
Microsoft Office
Product Design
Engineering Management
Semiconductors
R&D
Solidworks
Design For Manufacturing
Research
Testing
Design of Experiments
Lean Manufacturing
Manufacturing Engineering
Research and Development
Large Assemblies
Solid Modeling
Electro Mechanical Design
Design of Experiments
Sheet Metal
Computer Aided Design
Machine Design
Electro Mechanical
Interests:
Photography
Mark Finkle Photo 3

Mark Finkle Goleta, CA

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Work:
Invenios Inc
Santa Barbara, CA
Aug 2006 to Jul 2013
SENIOR MECHANICAL ENGINEER
Millennium Automation
Fremont, CA
Sep 1999 to Aug 2006
DIRECTOR OF ENGINEERING
Unmanned Solutions Inc
Fremont, CA
Jun 1982 to May 1999
VICE PRESIDENT OF ENGINEERING AND ONE OF TWO PRINCIPALS
Intel Corporation
Santa Clara, CA
May 1977 to Jun 1982
MECHANICAL ENGINEER
Education:
College of San Mateo
San Mateo, CA
1970 to 1972
AA

Business Records

Name / Title
Company / Classification
Phones & Addresses
Mark Finkle
Chief Fina, Chief Financial Offi
KAPOW TECHNOLOGIES, INC
Whol Computers/Peripherals
15211 Laguna Cyn Rd, Irvine, CA 92618
260 Sheridan Ave, Palo Alto, CA 94306
206 Sheridan Ave, Palo Alto, CA 94306
(800) 805-0828, (650) 646-6000, (650) 617-0263, (650) 646-6003

Publications

Us Patents

Room Temperature Glass-To-Glass, Glass-To-Plastic And Glass-To-Ceramic/Semiconductor Bonding

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US Patent:
20130112650, May 9, 2013
Filed:
Nov 8, 2011
Appl. No.:
13/291956
Inventors:
Raymond Miller Karam - Santa Barbara CA, US
Georges Roussos - San Jose CA, US
Mark Finkle - Goleta CA, US
Daniella M. Harvey - Santa Barbara CA, US
Assignee:
INVENIOS - Santa Barbara CA
International Classification:
C23F 1/00
B32B 37/06
US Classification:
216 13, 1562728, 1563798
Abstract:
A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Method And Apparatus For The Automatic Folding Of Floppy Disc Storage Envelopes

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US Patent:
44472188, May 8, 1984
Filed:
Jan 6, 1981
Appl. No.:
6/222897
Inventors:
Dieter A. Bertsch - Fremont CA
Mark A. Finkle - Santa Clara CA
James D. Fishman - Santa Clara CA
International Classification:
B32B 304
US Classification:
493251
Abstract:
Presented is a method and apparatus for the substantial automatic folding of flat pre-cut blanks of sheet material to form storage envelopes for floppy or rigid disc storage devices. The machine includes a pedestal formed in part by an electromagnet associated with a clamp plate that constitutes an Armature to retain the sheet material immovable during the folding operation. Additionally, there are provided three rams each associated with a pivotal shoe for folding selected portions of the flat sheet, and reciprocable glue dispensing means are provided for dispensing glue at the appropriate time, in an appropriate amount, and in an appropriate location. The mechanical aspects of the apparatus are connected to and controlled by a computer that scans the functions of the machine to determine if the machine is operating properly and signals the operator through an alphanumeric display panel if there is a malfunction in the apparatus.

Method And Apparatus For Folding Polymeric Sheet Material And Flexible Disk Jackets Made Thereby

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US Patent:
46016899, Jul 22, 1986
Filed:
Mar 12, 1984
Appl. No.:
6/588059
Inventors:
Mark A. Finkle - Fremont CA
James D. Fishman - Pleasanton CA
Assignee:
Unmanned Solutions, Inc. - Fremont CA
International Classification:
B31B 136
US Classification:
493251
Abstract:
An improved method of warm folding polymeric sheet material and apparatus for accomplishing the method. The method involves applying conductive heat to both sides of the material prior to folding and is accomplished in steps including: (a) positioning the sheet material; (b) positioning a mandrel plate so as to define a fold line for the sheet material; (c) positioning an exterior heater against the material along the fold line; (d) positioning an interior heater element against the material opposite the exterior heater; (e) and (f) applying preselected amounts of heat to the fold line area through the heaters; (g) retracting the interior heater; (h) mechanically folding the sheet material along a fold line; and (i) annealing the fold by applying additional heat through the exterior heater. The process may also be augmented by adding additional steps. The primary use of the invention is in folding polyvinyl chloride jackets for use in enclosing floppy disks.

Room Temperature Glass-To-Glass, Glass-To-Plastic And Glass-To-Ceramic/Semiconductor Bonding

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US Patent:
20190232569, Aug 1, 2019
Filed:
Apr 8, 2019
Appl. No.:
16/378440
Inventors:
- Santa Barbara CA, US
Georges Roussos - San Jose CA, US
Mark Finkle - Goleta CA, US
Daniella M. Harvey - Santa Barbara CA, US
International Classification:
B29C 65/16
B23K 26/244
B29C 65/00
B23K 37/04
C03B 23/203
B29C 65/78
B23K 26/211
B23K 26/32
B23K 26/0622
B23K 26/082
C03C 27/00
B23K 26/324
B01L 3/00
B23K 26/08
B23K 26/046
B23K 26/03
B32B 37/06
Abstract:
A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Automatic Stator Wire Lead Routing

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US Patent:
20180138771, May 17, 2018
Filed:
Nov 16, 2017
Appl. No.:
15/814534
Inventors:
- Palo Alto CA, US
Mark Finkle - Tracy CA, US
Christopher James Whelan - San Jose CA, US
Patrick David Hunter - San Mateo CA, US
Nicholas Andrew Parrotta - Fremont CA, US
Tal Fix - Palo Alto CA, US
Assignee:
Tesla, Inc. - Palo Alto CA
International Classification:
H02K 3/32
H02K 3/52
Abstract:
An apparatus for automatically routing a wire lead of a stator from a first position to a second position includes a base assembly to receive the stator. A clamp assembly is mounted on the base assembly to hold the wire lead in the first position. An arbor rotates the wire lead. The arbor has a holder to hold the wire lead. An end effector grips and moves the wire lead. A controller moves the end effector to grip the wire lead at the first position and to couple the wire lead with the arbor. Further, the controller rotates the arbor to rotate the wire lead along the circumference of the stator by a pre-determined angle. The controller moves the end effector to grip the wire lead held by the holder, and to move the wire lead to the second position.

Room Temperature Glass-To-Glass, Glass-To-Plastic And Glass-To-Ceramic/Semiconductor Bonding

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US Patent:
20170008223, Jan 12, 2017
Filed:
Sep 23, 2016
Appl. No.:
15/275187
Inventors:
- Santa Barbara CA, US
Georges Roussos - San Jose CA, US
Mark Finkle - Goleta CA, US
Daniella M. Harvey - Santa Barbara CA, US
International Classification:
B29C 65/16
B29C 65/00
C03B 23/203
B01L 3/00
B23K 26/0622
B23K 26/08
B23K 26/211
B23K 26/324
B29C 65/78
B23K 26/046
Abstract:
A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.
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Mark Allen Finkle from Tracy, CA, age ~72 Get Report