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Eugene T Fitzgibbons

from San Clemente, CA
Age ~80

Eugene Fitzgibbons Phones & Addresses

  • 7 Via Adelia, San Clemente, CA 92672 (949) 276-6907 (949) 361-8986
  • Goleta, CA
  • Mammoth Lakes, CA
  • Orange, CA

Business Records

Name / Title
Company / Classification
Phones & Addresses
Eugene Timothy Fitzgibbons
President
Seek Thermal
Electrical/Electronic Manufacturing · Camera and Photographic Supply Stores · Ret Cameras/Photography Supplies · Business Services at Non-Commercial Site · Coml Physical Research Mfg Analytical Instr · Commercial Physical Research
6489 Calle Real SUITE E, Santa Barbara, CA 93117

Publications

Us Patents

Method For Fabricating A Sealed-Cavity Microstructure

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US Patent:
6596117, Jul 22, 2003
Filed:
Apr 17, 2001
Appl. No.:
09/836785
Inventors:
Kenneth Maxwell Hays - Santa Ana CA
Alan Glenn Bisignano - Fountain Valley CA
Eugene Timothy Fitzgibbons - San Clemente CA
Assignee:
DRS Sensors Targeting Systems, Inc. - Anaheim CA
International Classification:
H01L 300
US Classification:
156251, 156292, 2503384, 257704, 257787
Abstract:
The present invention provides a sealed-cavity miscrostructure and an associated method for manufacturing the microstructure. Specifically, the microstructure of the present invention includes first and second wafers that are positioned relative to one another so as to form a cavity between the wafers. The microstructure further includes a seal between the first and second wafers and surrounding the cavity to create a pressure seal for the cavity. This seal allows the cavity of the microstructure to be maintained at a predetermined pressure different from that of the atmosphere outside the cavity. Importantly, the microstructure of the present invention further includes a structrual bond between the first and second wafers that structurally intergrates the first and second wafers. The structural bond renders the microstructure more rugged such that the microstructure can withstand expansion, vibrational, and shock stresses experienced by the microstructure during subsequent manufacturing and use. In one additional embodiment, the microstructure is a microbolometer that includes in addition to the seal and structural bond, a radiation detector suspended in the cavity.

Interface Device For Extending Camcorder Use Over The Electromagnetic Spectrum

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US Patent:
7050107, May 23, 2006
Filed:
Jul 13, 2001
Appl. No.:
09/905006
Inventors:
Jeffrey D. Frank - Santa Barbara CA, US
Jeffrey Lynn Heath - Santa Barbara CA, US
Eugene Timothy Fitzgibbons - Goleta CA, US
Assignee:
Indigo Systems Corporation - Goleta CA
International Classification:
H04N 5/225
US Classification:
348375, 348372
Abstract:
An interface device connects a camcorder to a camera operating in the non-visible electromagnetic spectrum to form a portable unitary system. The interface device provides a mechanical connection between the camcorder and the camera. A video cable carries video image data from the camera to the camcorder. A control connection additionally may be provided between the camcorder and the camera through the interface device, to allow the camera to be controlled through controls on the camcorder itself. A power connection may be provided between the camcorder and the camera through the interface device, to allow the camera to draw power from the camcorder.

Sealed-Cavity Microstructure And Microbolometer And Associated Fabrication Methods

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US Patent:
62522299, Jun 26, 2001
Filed:
Jul 10, 1998
Appl. No.:
9/113472
Inventors:
Kenneth Maxwell Hays - Santa Ana CA
Alan Glenn Bisignano - Fountain Valley CA
Eugene Timothy Fitzgibbons - San Clemente CA
Assignee:
Boeing North American, Inc. - Seal Beach CA
International Classification:
H01L 310203
US Classification:
2503384
Abstract:
A sealed-cavity microstructure and an associated method for manufacturing the microstructure. Specifically, the microstructure includes first and second wafers that are positioned relative to one another so as to form a cavity between the wafers. The microstructure further includes a seal between the first and second wafers and surrounding the cavity to create a pressure seal for the cavity. This seal allows the cavity of the microstructure to be maintained at a predetermined pressure different from that of the atmosphere outside the cavity. Importantly, the microstructure further includes a structural bond between the first and second wafers that structurally integrates the first and second wafers. The structural bond renders the microstructure more rugged such that the microstructure can withstand expansion, vibrational, and shock stresses experienced by the microstructure during subsequent manufacturing and use. In one additional embodiment, the microstructure is a microbolometer that includes in addition to the seal and structural bond, a radiation detector suspended in the cavity.

Pixel Structure Having A Bolometer With Spaced Apart Absorber And Transducer Layers And An Associated Fabrication Method

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US Patent:
63071940, Oct 23, 2001
Filed:
Jun 7, 1999
Appl. No.:
9/326937
Inventors:
Eugene T. Fitzgibbons - San Clemente CA
Assignee:
The Boeing Company - Seattle WA
International Classification:
H01L 2700
US Classification:
2502081
Abstract:
A pixel structure is provided that has a substrate and a bolometer disposed upon the substrate that includes a transducer and an absorber that have been spaced apart from each other and from the substrate so as to permit the transducer and the absorber to be separately optimized. For example, the absorption characteristics of the bolometer can be maximized, while concurrently minimizing the thermal loss to the substrate. While the absorber is spaced from the transducer, the absorber is in thermal contact with the transducer such that radiation absorbed by the absorber also heats the transducer. In this regard, the bolometer also includes a thermally conductive post extending from the transducer to the absorber. Since the transducer has an electrical resistance that varies in response to changes in the temperature of the transducer, heating of the transducer in response to the absorption of radiation by the absorber causes the electrical resistance of the transducer to correspondingly vary in a predetermined manner. By measuring the change in electrical resistance of the transducer, such as by passing a known current therethrough, a precise measurement of the radiation absorbed by the absorber can be determined.
Eugene T Fitzgibbons from San Clemente, CA, age ~80 Get Report