US Patent:
20230084538, Mar 16, 2023
Inventors:
- Cupertino CA, US
Annie Manuja - Sunnyvale CA, US
Christopher D. Guichet - Mountain View CA, US
Erik G. de Jong - San Francisco CA, US
Jorge L. Rivera Espinoza - San Jose CA, US
Patrick J. Crowley - San Jose CA, US
Steven C. Roach - Martinez CA, US
Venkatesh Rajendran - San Jose CA, US
William C. Lukens - San Francisco CA, US
Woojin Jung - San Mateo CA, US
Yue Chen - San Jose CA, US
Zhiwei Gu - Cupertino CA, US
Derek Iwamoto - Sunnyvale CA, US
Siddharth Nangia - San Francisco CA, US
Scott D. Morrison - Austin TX, US
Kevin A. Klenk - Sunnyvale CA, US
Neeloy Roy - San Francisco CA, US
International Classification:
H01Q 1/24
H01Q 1/22
H01Q 9/04
H01Q 1/52
Abstract:
A wireless communication system may include an electronic device having a wireless communication module. The wireless communication module may include an antenna radiating element on a first surface, a ground ring surrounding the antenna radiating element on the first surface, and a radio component mounted to a second surface. The wireless communication module may be incorporated into a system package that also includes other components. Encapsulation material may cover the wireless communication module and other components. A shielding material may cover the encapsulation material and be coupled to the ground ring. An opening in the shielding material may be aligned with the antenna radiating element. If desired, the wireless communication system may include external equipment having a wireless communication module communicatively coupled to the wireless communication module to convey firmware testing, debugging, restore, and/or other data.