Yun Qin Li

6421254, Jul 16, 2002

Jul 13, 2001

09/903699

Lakshminarasimha Krishnapura - Delray Beach FL
Yun Li - Boca Raton FL
Moises Behar - Boca Raton FL
Dan Fuoco - Boca Raton FL
Bill Ahearn - Boca Raton FL

Silicon Bandwidth Inc. - Fremont CA

H05K 700

361820, 361760, 361761, 361764, 361767, 361783, 174 521, 174 524, 257723, 257724

A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

6475832, Nov 5, 2002

Sep 13, 2001

09/950702

Lakshminarasimha Krishnapura - Delray Beach FL
Yun Li - Boca Raton FL

Silicon Bandwidth, Inc. - Fremont CA

H01L 2144

438116, 438110, 438123

A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.

6709891, Mar 23, 2004

Aug 30, 2002

10/231347

Lakshminarasimha Krishnapura - Delray Beach FL
Yun Li - Boca Raton FL

Silicon Bandwidth Inc. - San Jose CA

H01L 2144

438110, 438116, 438125

A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.

20020176238, Nov 28, 2002

Jul 15, 2002

10/194074

Stanford Crane - Boca Raton FL, US
Lakshminarasimha Krishnapura - Delray Beach FL, US
Yun Li - Boca Raton FL, US
Moises Behar - Boca Raton FL, US
Dan Fuoco - Boca Raton FL, US
Bill Ahearn - Boca Raton FL, US

The Panda Project, Inc.

H01R009/00

361/772000

A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

20080167288, Jul 10, 2008

Feb 15, 2008

12/070310

Yun Long Li - Wilmington DE, US
Jincong Zhuo - Marcus Hook PA, US
David Burns - Philadelphia PA, US
Wanqing Yao - Kennett Square PA, US
Ravi Kumar Jalluri - Avondale PA, US

Lncyte Corporation - Wilmington DE

A61K 31/397
C07D 221/00
A61K 31/4523
C07D 295/00
A61K 31/5377
A61P 17/00
A61P 37/00
A61P 29/00
A61K 31/496
C07D 209/02
A61K 31/403
C07D 213/02
A61K 31/44
C07D 221/02
A61K 31/435
C07D 241/36
A61K 31/498
C07D 207/00
A61K 31/541
A61P 9/00
A61K 31/40
C07D 215/00
A61K 31/47
A61P 35/00
A61P 19/02
C07D 205/02

51421018, 546194, 514318, 544129, 5142355, 546187, 514316, 544360, 51425301, 546208, 514326, 548469, 514415, 546314, 514354, 546112, 514299, 544349, 514249, 548530, 514423, 546152, 514314, 544121, 5142358, 548953, 544 60, 5142278

The present invention provides compounds of the formula:its enantiomers, diastereomers, racemic mixtures thereof, prodrugs, crystalline forms, non-crystalline forms, amorphous forms thereof, solvates thereof, metabolites thereof, and pharmaceutically acceptable salts, wherein the ring A substituent groups are fully defined in the following disclosure. The compounds of formula are inhibitors of metalloproteases such as matrix metalloproteases and sheddases, and are useful in treating diseases such as rheumatoid arthritis, psoriasis, neoplastic diseases, allergies and all those diseases wherein inhibition of MMPs is desirable.

20130004983, Jan 3, 2013

Dec 6, 2010

13/513600

Hiroaki Matsunami - Durham NC, US
Yun Li - Philadelphia PA, US

C12N 5/071
C12Q 1/02

435 29, 435369

The present invention relates to polypeptides capable of modulating odorant receptor activation. In particular, the present invention provides polypeptides (e.g., type 3 muscarinic actetylcholine receptor M3) capable of enhancing odorant receptor activation. The present invention further provides assays for the detection of ligands specific for various odorant receptors. Additionally, the present invention provides methods of screening for polypeptide polymorphisms and mutations associated with odorant receptor activation (e.g., polymorphisms and mutations associated with muscarinic actetylcholine receptor polypeptides (e.g., M1, M2 M3, M4, M5)), as well as methods of screening for therapeutic agents, ligands, and modulators of such proteins.

62662465, Jul 24, 2001

Jan 18, 2000

9/484047

Stanford W. Crane - Boca Raton FL
Lakshminarasimha Krishnapura - Delray Beach FL
Yun Li - Boca Raton FL
Moises Behar - Boca Raton FL
Dan Fuoco - Boca Raton FL
Bill Ahearn - Boca Raton FL

Silicon Bandwidth, Inc. - Fremont CA

H05K 720

361704

A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

63072580, Oct 23, 2001

Dec 22, 1998

9/218180

Stanford W. Crane - Boca Raton FL
Lakshminarasimha Krishnapura - Delray Beach FL
Yun Li - Boca Raton FL

Silicon Bandwidth, Inc. - Fremont CA

H01L 2302

257680

A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.