Xuan Li Phones & Addresses
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San Jose, CA
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Sunnyvale, CA
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Issaquah, WA
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Sammamish, WA
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Rochester, NY
Business Records
Name / Title
Company / Classification
Phones & Addresses
President
Kix Studio
Business Services at Non-Commercial Site · Nonclassifiable Establishments
Business Services at Non-Commercial Site · Nonclassifiable Establishments
39149 Guardino Dr, Fremont, CA 94538
9084 Drake Mdw Way, Elk Grove, CA 95624
9084 Drake Mdw Way, Elk Grove, CA 95624
Publications
Us Patents
Differentiable Rasterizer For Vector Font Generation And Editing
View pageUS Patent:
20210248432, Aug 12, 2021
Filed:
Feb 12, 2020
Appl. No.:
16/788781
Inventors:
- San Jose CA, US
Zhifei Zhang - San Jose CA, US
Xuan Li - Philadelphia PA, US
Matthew Fisher - San Jose CA, US
Hailin Jin - San Jose CA, US
Zhifei Zhang - San Jose CA, US
Xuan Li - Philadelphia PA, US
Matthew Fisher - San Jose CA, US
Hailin Jin - San Jose CA, US
International Classification:
G06K 15/02
Abstract:
Systems and methods provide for generating glyph initiations using a generative font system. A glyph variant may be generated based on an input vector glyph. A plurality of line segments may be approximated using a differentiable rasterizer with the plurality of line segments representing the contours of the glyph variant. A bitmap of the glyph variant may then be generated based on the line segments. The image loss between the bitmap and a rasterized representation of a vector glyph may be calculated and provided to the generative font system. Based on the image loss, a refined glyph variant may be provided to a user.
Contiguous Event Seating Across Temporal Ticketing Intervals
View pageUS Patent:
20180357572, Dec 13, 2018
Filed:
Jun 13, 2017
Appl. No.:
15/621820
Inventors:
- Seattle WA, US
Xuan Li - Bellevue WA, US
Steve L. Huynh - Seattle WA, US
Patrick R. Schultz - Sammamish WA, US
Xuan Li - Bellevue WA, US
Steve L. Huynh - Seattle WA, US
Patrick R. Schultz - Sammamish WA, US
International Classification:
G06Q 10/02
Abstract:
A ticketing system allows a group of people to purchase individual tickets for an event and sit together even though the tickets are purchased separately. The ticketing system is able to encumber a block of seats and provide a block identifier that allows subsequent purchasers to purchase seats within the block of seats if they provide the block identifier. The block of seats is encumbered for an encumbrance duration, which may be established, or updated, based upon the popularity, or changing popularity, of the event.
Generating And Routing Notifications Of Extracted Email Content
View pageUS Patent:
20170308533, Oct 26, 2017
Filed:
Apr 21, 2016
Appl. No.:
15/134748
Inventors:
- Mountain View CA, US
Xuan Li - Sunnyvale CA, US
Weizhen Wang - San Jose CA, US
Yu Zheng - Milpitas CA, US
Xuan Li - Sunnyvale CA, US
Weizhen Wang - San Jose CA, US
Yu Zheng - Milpitas CA, US
International Classification:
G06F 17/30
H04L 12/58
G06F 17/30
H04L 12/58
G06F 17/30
H04L 12/58
G06F 17/30
H04L 12/58
G06F 17/30
Abstract:
In various example embodiments, a system and method for generating and routing notifications of content extracted from emails are presented. A member's interest in a specific email among a set of emails are determined based on a relevance score. Content from the specific email are extracted, the content being identified as primary information and secondary information. A notification is generated comprising of the vital content extracted from the specific email. Presentation of the primary information is caused, the primary information being associated with the notification according to a ranked order, the ranked order being based on the relevance score. In response to a member action, presentation of the secondary information is caused, the secondary information being associated with the notification.
Bluetooth Low Energy Frequency Offset And Modulation Index Estimation
View pageUS Patent:
20170187562, Jun 29, 2017
Filed:
Dec 23, 2015
Appl. No.:
14/757821
Inventors:
- Santa Clara CA, US
Jinyong Lee - Fremont CA, US
Xuan Steven Li - Cupertino CA, US
Aiguo Yan - San Jose CA, US
Jinyong Lee - Fremont CA, US
Xuan Steven Li - Cupertino CA, US
Aiguo Yan - San Jose CA, US
International Classification:
H04L 27/26
H04B 17/20
H04W 4/00
H04L 27/32
H04B 17/20
H04W 4/00
H04L 27/32
Abstract:
A Bluetooth Low Energy (BLE) device, having a demodulator configured to translate in-phase and quadrature components of a received BLE signal into a differential phase signal; an estimator configured to estimate a frequency offset of the differential phase signal; and a detector configured to detect information in the differential phase signal corrected by the estimated frequency offset.
Anchoring Structure Of Fine Pitch Bva
View pageUS Patent:
20170117243, Apr 27, 2017
Filed:
Oct 24, 2016
Appl. No.:
15/332533
Inventors:
- San Jose CA, US
Gabriel Z. Guevara - San Jose CA, US
Xuan Li - Santa Clara CA, US
Cyprian Emeka Uzoh - San Jose CA, US
Guilian Gao - San Jose CA, US
Liang Wang - Milpitas CA, US
Gabriel Z. Guevara - San Jose CA, US
Xuan Li - Santa Clara CA, US
Cyprian Emeka Uzoh - San Jose CA, US
Guilian Gao - San Jose CA, US
Liang Wang - Milpitas CA, US
International Classification:
H01L 23/00
H01L 21/56
H01L 23/31
H01L 21/56
H01L 23/31
Abstract:
A microelectronic package can include a substrate having a first surface and a second surface opposite therefrom, the substrate having a first conductive element at the first surface, and a plurality of wire bonds, each of the wire bonds having a base electrically connected to a corresponding one of the first conductive elements and having a tip remote from the base, each wire bond having edge surfaces extending from the tip toward the base. The microelectronic package can also include an encapsulation having a major surface facing away from the first surface of the substrate, the encapsulation having a recess extending from the major surface in a direction toward the first surface of the substrate, the tip of a first one of the wire bonds being disposed within the recess, and an electrically conductive layer overlying an inner surface of the encapsulation exposed within the recess, the electrically conductive layer overlying and electrically connected with the tip of the first one of the wire bonds.
Wafer-Level Packaging Using Wire Bond Wires In Place Of A Redistribution Layer
View pageUS Patent:
20170069591, Mar 9, 2017
Filed:
Nov 21, 2016
Appl. No.:
15/357553
Inventors:
- San Jose CA, US
Tu Tam Vu - San Jose CA, US
Bongsub Lee - Mountain View CA, US
Kyong-Mo Bang - Fremont CA, US
Xuan Li - Santa Clara CA, US
Long Huynh - Santa Clara CA, US
Gabriel Z. Guevara - San Jose CA, US
Akash Agrawal - San Jose CA, US
Willmar Subido - San Jose CA, US
Laura Wills Mirkarimi - Sunol CA, US
Tu Tam Vu - San Jose CA, US
Bongsub Lee - Mountain View CA, US
Kyong-Mo Bang - Fremont CA, US
Xuan Li - Santa Clara CA, US
Long Huynh - Santa Clara CA, US
Gabriel Z. Guevara - San Jose CA, US
Akash Agrawal - San Jose CA, US
Willmar Subido - San Jose CA, US
Laura Wills Mirkarimi - Sunol CA, US
Assignee:
Invensas Corporation - San Jose CA
International Classification:
H01L 23/00
H01L 25/065
H01L 21/78
H01L 25/10
H01L 23/31
H01L 21/56
H01L 25/065
H01L 21/78
H01L 25/10
H01L 23/31
H01L 21/56
Abstract:
An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.
Wafer-Level Packaging Using Wire Bond Wires In Place Of A Redistribution Layer
View pageUS Patent:
20160322326, Nov 3, 2016
Filed:
Apr 30, 2015
Appl. No.:
14/701049
Inventors:
- San Jose CA, US
Tu Tam VU - San Jose CA, US
Bongsub LEE - Mountain View CA, US
Kyong-Mo BANG - Fremont CA, US
Xuan LI - Santa Clara CA, US
Long HUYNH - Santa Clara CA, US
Gabriel Z. GUEVARA - San Jose CA, US
Akash AGRAWAL - San Jose CA, US
Willmar SUBIDO - Garland TX, US
Laura Wills MIRKARIMI - Sunol CA, US
Tu Tam VU - San Jose CA, US
Bongsub LEE - Mountain View CA, US
Kyong-Mo BANG - Fremont CA, US
Xuan LI - Santa Clara CA, US
Long HUYNH - Santa Clara CA, US
Gabriel Z. GUEVARA - San Jose CA, US
Akash AGRAWAL - San Jose CA, US
Willmar SUBIDO - Garland TX, US
Laura Wills MIRKARIMI - Sunol CA, US
Assignee:
INVENSAS CORPORATION - San Jose CA
International Classification:
H01L 23/00
H01L 21/78
H01L 21/56
H01L 23/31
H01L 25/065
H01L 21/78
H01L 21/56
H01L 23/31
H01L 25/065
Abstract:
An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.