Xuan C Li

20210248432, Aug 12, 2021

Feb 12, 2020

16/788781

- San Jose CA, US
Zhifei Zhang - San Jose CA, US
Xuan Li - Philadelphia PA, US
Matthew Fisher - San Jose CA, US
Hailin Jin - San Jose CA, US

G06K 15/02

Systems and methods provide for generating glyph initiations using a generative font system. A glyph variant may be generated based on an input vector glyph. A plurality of line segments may be approximated using a differentiable rasterizer with the plurality of line segments representing the contours of the glyph variant. A bitmap of the glyph variant may then be generated based on the line segments. The image loss between the bitmap and a rasterized representation of a vector glyph may be calculated and provided to the generative font system. Based on the image loss, a refined glyph variant may be provided to a user.

20170308533, Oct 26, 2017

Apr 21, 2016

15/134748

- Mountain View CA, US
Xuan Li - Sunnyvale CA, US
Weizhen Wang - San Jose CA, US
Yu Zheng - Milpitas CA, US

G06F 17/30
H04L 12/58
G06F 17/30
H04L 12/58
G06F 17/30

In various example embodiments, a system and method for generating and routing notifications of content extracted from emails are presented. A member's interest in a specific email among a set of emails are determined based on a relevance score. Content from the specific email are extracted, the content being identified as primary information and secondary information. A notification is generated comprising of the vital content extracted from the specific email. Presentation of the primary information is caused, the primary information being associated with the notification according to a ranked order, the ranked order being based on the relevance score. In response to a member action, presentation of the secondary information is caused, the secondary information being associated with the notification.

20170187562, Jun 29, 2017

Dec 23, 2015

14/757821

- Santa Clara CA, US
Jinyong Lee - Fremont CA, US
Xuan Steven Li - Cupertino CA, US
Aiguo Yan - San Jose CA, US

H04L 27/26
H04B 17/20
H04W 4/00
H04L 27/32

A Bluetooth Low Energy (BLE) device, having a demodulator configured to translate in-phase and quadrature components of a received BLE signal into a differential phase signal; an estimator configured to estimate a frequency offset of the differential phase signal; and a detector configured to detect information in the differential phase signal corrected by the estimated frequency offset.

20170117243, Apr 27, 2017

Oct 24, 2016

15/332533

- San Jose CA, US
Gabriel Z. Guevara - San Jose CA, US
Xuan Li - Santa Clara CA, US
Cyprian Emeka Uzoh - San Jose CA, US
Guilian Gao - San Jose CA, US
Liang Wang - Milpitas CA, US

H01L 23/00
H01L 21/56
H01L 23/31

A microelectronic package can include a substrate having a first surface and a second surface opposite therefrom, the substrate having a first conductive element at the first surface, and a plurality of wire bonds, each of the wire bonds having a base electrically connected to a corresponding one of the first conductive elements and having a tip remote from the base, each wire bond having edge surfaces extending from the tip toward the base. The microelectronic package can also include an encapsulation having a major surface facing away from the first surface of the substrate, the encapsulation having a recess extending from the major surface in a direction toward the first surface of the substrate, the tip of a first one of the wire bonds being disposed within the recess, and an electrically conductive layer overlying an inner surface of the encapsulation exposed within the recess, the electrically conductive layer overlying and electrically connected with the tip of the first one of the wire bonds.

20170069591, Mar 9, 2017

Nov 21, 2016

15/357553

- San Jose CA, US
Tu Tam Vu - San Jose CA, US
Bongsub Lee - Mountain View CA, US
Kyong-Mo Bang - Fremont CA, US
Xuan Li - Santa Clara CA, US
Long Huynh - Santa Clara CA, US
Gabriel Z. Guevara - San Jose CA, US
Akash Agrawal - San Jose CA, US
Willmar Subido - San Jose CA, US
Laura Wills Mirkarimi - Sunol CA, US

Invensas Corporation - San Jose CA

H01L 23/00
H01L 25/065
H01L 21/78
H01L 25/10
H01L 23/31
H01L 21/56

An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.

20160322326, Nov 3, 2016

Apr 30, 2015

14/701049

- San Jose CA, US
Tu Tam VU - San Jose CA, US
Bongsub LEE - Mountain View CA, US
Kyong-Mo BANG - Fremont CA, US
Xuan LI - Santa Clara CA, US
Long HUYNH - Santa Clara CA, US
Gabriel Z. GUEVARA - San Jose CA, US
Akash AGRAWAL - San Jose CA, US
Willmar SUBIDO - Garland TX, US
Laura Wills MIRKARIMI - Sunol CA, US

INVENSAS CORPORATION - San Jose CA

H01L 23/00
H01L 21/78
H01L 21/56
H01L 23/31
H01L 25/065

An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.