Wing N Ho

20120089793, Apr 12, 2012

Oct 11, 2010

12/901872

Shadab Nazar - Sunnyvale CA, US
Mainak Sen - Fremont CA, US
Wing L. Ho - Fremont CA, US
Ananda Shah - San Francisco CA, US

CISCO TECHNOLOGY, INC. - San Jose CA

G06F 12/00

711155, 711E12001

A memory device and related techniques are provided to modify data stored in the memory device without the need to send the data to an external device. A command is received at the memory device to modify data stored at a memory location in a memory array of the memory device. The command includes a value to be used for modifying the data. The memory device reads data from the memory location. The data read from the memory location is modified with modify circuit in the memory device based on the value obtained form the command to produce results data. The results data produced by the modify circuit is written back to the memory location. Since the memory device does not need to send the data read from the memory array off-chip to another device, referred to herein as a host device, to update the data, the input/output bandwidth of the bandwidth is substantially reduced, allowing for lower power memory device operation and reduced latency.

60114746, Jan 4, 2000

Apr 28, 1998

9/067333

Kevin R. Coffey - Fremont CA
Wing K. Ho - Boynton Beach FL
Richard L. Copeland - Boca Raton FL

Sensormatic Electronics Corporation - Boca Raton FL

G08B 1314

3405723

A single deactivation device is used to deactivate both harmonic type EAS markers and magnetomechanical type EAS markers. The deactivation device includes a housing, and a permanent magnet and a coil disposed within the housing. The coil is circular and is arranged concentrically with, and outside of, the permanent magnet. The permanent magnet forms a DC magnetic field for deactivating the harmonic type marker by magnetizing control elements thereof. The coil is driven to generate an AC magnetic field that deactivates the magnetomechanical type marker by degaussing a control element thereof. The maximum amplitude of the AC magnetic field is lower than the level of the DC magnetic field, and is substantially below the coercivity of the control elements of the harmonic type marker. The coercivity of the control element of the magnetomechanical type marker is low enough to be degaussed by the AC magnetic field.

20180154544, Jun 7, 2018

Jan 9, 2018

15/866411

- Santa Clara CA, US
Wing K. Ho - Cupertino CA, US

Intel Corporation - Santa Clara CA

B26F 3/12
G06F 1/16
B29L 31/34

Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.

20180007488, Jan 4, 2018

Jul 1, 2016

15/201201

Ronald Jeffrey Horowitz - Vallejo CA, US
Wing Chris Ho - Cupertino CA, US

H04S 7/00
G02B 27/00
H04R 5/04
G06F 3/01
G02B 27/01

Embodiments are directed to sound source rendering in a virtual reality (VR) system that executes an immersive virtual environment including at least one virtual sound source. A motion sensor to produces a measurement of a motion of the user, and an imaging sensor is used to produce an indication of at least one physical feature of the user relevant to sound perception. A sound rendering engine determines and applies a head-related transfer function (HRTF) based on the at least one physical feature of the user, and effects a source direction of sound from the at least one virtual sound source according to a frame of reference of the user based on the motion of the user.

20160279862, Sep 29, 2016

Mar 27, 2015

14/671760

- Santa Clara CA, US
Wing K. Ho - Cupertino CA, US

Intel Corporation - Santa Clara CA

B29C 65/48
B29C 65/02

Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.