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Vu L Vo

from San Jose, CA
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Also known as:
Vu Long Vo, Vu Giang Long, Long Giang Vu, Long M Vu, Mytuong Long Vu, Terry Long Vu, Giang V Long, Giang Vo, Thanh Vo Giang, Long Mvu
Related to:
Vu LongKhiem Vo, 59Steven L Vo, 58
Connected to:
Aimy T Vo, 36Alice Vo, 70Allen Vo, 59Amijane O Vo, 57Anna T Vo, 43Arnold B Vo, 28Au T Vo, 38Barbara N Vo, 28Ca V Vo, 40Chinh Q Vo, 50

Vu Vo Phones & Addresses

  • San Jose, CA
  • Monte Sereno, CA
  • Anchorage, AK
  • Richmond, CA

Work

Company: San jose state univeristy - San Jose, CA Aug 2014 Position: Hugs for the soul campaign

Education

School / High School: SAN JOSE STATE UNIVERSITY- San Jose, CA 2012 Specialities: Bachelor of Science Degree: Business Administration in MARKETING

Resumes

Resumes

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Location:
United States
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Vu Vo San Jose, CA

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Work:
San Jose State Univeristy
San Jose, CA
Aug 2014 to Dec 2014
Hugs for the Soul Campaign
San Jose State Univeristy
San Jose, CA
Aug 2014 to Dec 2014
We Dog Care
San Jose State University
San Jose, CA
Aug 2013 to Dec 2013
Recommendation App
De Anza College Dinning Service
Cupertino, CA
Sep 2008 to Jul 2010
Student Supervisor
Education:
SAN JOSE STATE UNIVERSITY
San Jose, CA
2012 to 2014
Bachelor of Science Degree: Business Administration in MARKETING
DE ANZA COLLEGE
Cupertino, CA
2008 to 2012
Associate in Arts: Liberal Arts in Business and Computer Information System Emphasis

Business Records

Name / Title
Company / Classification
Phones & Addresses
Vu Hoang Vo
President
SUNRISE NOODLE HOUSE, INC
1741 Sageland Dr, San Jose, CA 95131

Publications

Us Patents

Printed Circuit Board Sensor Mounting And Alignment

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US Patent:
20110242776, Oct 6, 2011
Filed:
Apr 12, 2010
Appl. No.:
12/758642
Inventors:
Derek J. DiCarlo - San Jose CA, US
Vu T. Vo - Salinas CA, US
Gregory A. Fosnes - Redwood City CA, US
Assignee:
Apple Inc. - Cupertino CA
International Classification:
H05K 7/00
H05K 13/04
US Classification:
361760, 29854
Abstract:
Sensors modules adapted to be mounted to a motherboard under challenging conditions by using automated manufacturing processes are disclosed. A sensor module can include a sensor mounted to a sensor PCB, a connector coupled to the sensor and having a plurality of guide pins extending therefrom in a vulnerable manner, with the guide pins being adapted to be inserted into guide pin holes on an associated motherboard, and a disposable carrier adapted to hold the connector and protect the guide pins thereof prior to mounting. The disposable carrier is removed from the sensor module before the sensor module is mounted directly to a motherboard by press-fitting the guide pins into guide pin holes on the motherboard and soldering connections thereto in an automated surface mounting operation. Disposable carrier protected sensor modules can be stored and processed in a tray or tape-and-reel automated manufacturing system.

Stacked Printed Circuit Board Packages

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US Patent:
20180092213, Mar 29, 2018
Filed:
Sep 20, 2017
Appl. No.:
15/710579
Inventors:
- Cupertino CA, US
Meng Chi Lee - Los Altos CA, US
Derek J. Walters - San Jose CA, US
Ian A. Spraggs - San Francisco CA, US
Flynn P. Carson - Redwood City CA, US
Shakti S. Chauhan - Cupertino CA, US
Daniel W. Jarvis - Sunnyvale CA, US
David A. Pakula - San Francisco CA, US
Jun Zhai - Cupertino CA, US
Michael V. Yeh - Cupertino CA, US
Alex J. Crumlin - San Jose CA, US
Dennis R. Pyper - San Jose CA, US
Amir Salehi - Los Gatos CA, US
Vu T. Vo - Salinas CA, US
Gregory N. Stephens - San Jose CA, US
International Classification:
H05K 1/18
H05K 1/02
H05K 1/11
H05K 3/00
H05K 3/34
Abstract:
The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.

Stacked Circuit Board Architecture In An Electronic Device

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US Patent:
20180084636, Mar 22, 2018
Filed:
Sep 21, 2017
Appl. No.:
15/712071
Inventors:
- Cupertino CA, US
Daniel W. JARVIS - Sunnyvale CA, US
Gregory N. STEPHENS - Sunnyvale CA, US
Ian A. SPRAGGS - San Francisco CA, US
Vu Thanh VO - Salinas CA, US
Amir SALEHI - Los Gatos CA, US
Dennis R. PYPER - Cupertino CA, US
Alex J. CRUMLIN - San Jose CA, US
Corey S. PROVENCHER - Santa Clara CA, US
Derek J. WALTERS - San Jose CA, US
Michael V. YEH - Cupertino CA, US
International Classification:
H05K 1/02
H05K 1/14
Abstract:
A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

Low-Profile Space-Efficient Shielding For Sip Module

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US Patent:
20160270213, Sep 15, 2016
Filed:
Feb 11, 2016
Appl. No.:
15/041033
Inventors:
- Cupertino CA, US
Vu T. Vo - Cupertino CA, US
Wyeman Chen - Fremont CA, US
Chang Liu - San Jose CA, US
Dennis R. Pyper - San Jose CA, US
Steven Patrick Cardinali - Sunnyvale CA, US
Lan Hoang - San Jose CA, US
Siddharth Nangia - San Francisco CA, US
Meng Chi Lee - Los Altos CA, US
Takayoshi Katahira - Cupertino CA, US
Assignee:
Apple Inc. - Cupertino CA
International Classification:
H05K 1/02
H05K 1/11
H05K 1/18
Abstract:
Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.
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Vu L Vo from San Jose, CA Get Report