Inventors:
- Detroit MI, US
Song HE - Troy MI, US
Arianna T. MORALES - Bloomfield Hills MI, US
Assignee:
GM GLOBAL TECHNOLOGY OPERATIONS LLC - Detroit MI
International Classification:
B21D 26/057
B21D 53/88
Abstract:
A cover for integrated power electronics (IPE), the cover including a first sheet, a second sheet bonded to the first sheet by at least one joining point in a perimeter region, a cavity defined between the bonded first sheet and second sheet, wherein the perimeter region seals the cavity, and a filler material disposed within the cavity.