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Ming Hai Li

from Midland, TX
Age ~41
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Also known as:
Ming H Li, Hai Ming Li, Ming H Lai, Li H Ming, Hai Liming, Li Minghai
Related to:
Min LiJiaying Li, 50Guizhu Li, 56Hang Liyi, 69Nai Zhou Li, 45Zhi Li, 61Tony Tang, 31Chuanhua H Tang, 60Lixia LiYuanhua Li, 69Hui Rong Tang, 55Kong L Tang, 57Juan Zheng Li, 37Dong Liming, 43Ruiqing XieMing Z Liu, 44Mei Y TangJianchu Zhang, 43Ming Xie Liming, 56Chu Liming, 52Jane Li
Connected to:
Ai Q Li, 64Ai H Li, 81Aida Li, 67Aijun Li, 65Aiwen Q Li, 56Aiyan Li, 61Alan Li, 80Alice Li, 46Alida Li, 59Alisha Li, 31

Ming Li Phones & Addresses

  • Midland, TX
  • Philadelphia, PA
  • Lindenwold, NJ
  • North Richland Hills, TX
  • Dallas, TX
  • New York, NY
  • Camden, NJ
  • Winnsboro, SC

Professional Records

License Records

Ming Li

Address:
PO Box 619119, Dallas, TX 75261
License #:
A4440970
Category:
Airmen

Lawyers & Attorneys

Ming Li Photo 1

Ming Li - Lawyer

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Address:
Yingda Law Firm
(390) 711-1386 (Office)
Licenses:
New York - Currently registered 2012
Education:
The Sydney Law School

Medicine Doctors

Ming Li Photo 2

Ming O. Li

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Specialties:
Endocrinology, Diabetes & Metabolism
Work:
Pacific Endocrinology Diabetes Health Center
55 N 13 St, San Jose, CA 95112
(408) 993-8764 (phone), (408) 993-8765 (fax)
Education:
Medical School
Capital Univ of Med Scis, Training Ctr of Gen Prac, Beijing City, China
Graduated: 1982
Conditions:
Diabetes Mellitus (DM)
Disorders of Lipoid Metabolism
Hyperthyroidism
Hypothyroidism
Metabolic Syndrome
Languages:
Chinese
English
Description:
Dr. Li graduated from the Capital Univ of Med Scis, Training Ctr of Gen Prac, Beijing City, China in 1982. She works in San Jose, CA and specializes in Endocrinology, Diabetes & Metabolism. Dr. Li is affiliated with Regional Medical Center Of San Jose.
Ming Li Photo 3

Ming Li

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Specialties:
Endocrinology, Diabetes & Metabolism
Work:
Carl T Hayden VA Medical Center Endocrinology
650 E Indian School Rd, Phoenix, AZ 85012
(602) 277-5551 (phone), (602) 200-6004 (fax)
Education:
Medical School
Beijing Med Univ, Beijing City, Beijing, China
Graduated: 1996
Languages:
English
Description:
Dr. Li graduated from the Beijing Med Univ, Beijing City, Beijing, China in 1996. He works in Phoenix, AZ and specializes in Endocrinology, Diabetes & Metabolism. Dr. Li is affiliated with Carl T Hayden VA Medical Center.
Ming Li Photo 4

Ming Dong Li

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Specialties:
Acupuncturist
Work:
UCLA Medical GroupUCLA Center East West Medicine
2336 Santa Monica Blvd STE 301, Santa Monica, CA 90404
(310) 998-9118 (phone), (310) 829-9318 (fax)
Languages:
English
Spanish
Description:
Dr. Li works in Santa Monica, CA and specializes in Acupuncturist. Dr. Li is affiliated with Ronald Reagan UCLA Medical Center and Santa Monica UCLA Medical Center.
Ming Li Photo 5

Ming Jia Li

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Specialties:
Internal Medicine
Work:
Ohio State University Hospital Medicine
320 W 10 Ave STE M112, Columbus, OH 43210
(614) 293-7499 (phone), (614) 366-2360 (fax)
Languages:
English
Description:
Dr. Li works in Columbus, OH and specializes in Internal Medicine. Dr. Li is affiliated with Nationwide Childrens Hospital and Ohio State University Wexner Medical Center.
Ming Li Photo 6

Ming Li

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Ming Li Photo 7

Ming Li

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Business Records

Name / Title
Company / Classification
Phones & Addresses
Ming Li
Director
VC02 Little Tokyo, Inc
3103 Canongate Dr, Arlington, TX 76015
Ming Li
President, Director
MINUTEFOOD, INC
3103 Canongate Dr, Arlington, TX 76015
2200 S 10 St #VC01, McAllen, TX 78503
Ming Li
DIRECTOR, Director
TEXAS CHAPTER OF THE CHINESE ASSOCIATION FOR SCIEN
Membership Organization
627 Sword Brg Dr, The Colony, TX 75056
878 High Mdw Rd, Frisco, TX 75034
Ming Li
Director
Texas Chapter of The Chinese Association for Science and Technology(Cast-Tx)
Membership Organization
627 Sword Brg Dr, Frisco, TX 75056
Ming Li
Director, President
MYGALAXY LIMITED COMPANY
Commercial Physical Research
3801 Mattison Ave #B, Fort Worth, TX 76107
3712 Bradford Crk Dr, Fort Worth, TX 76116
Ming Li
Principal
Lotus Decor
Whol Homefurnishings
1216 Bridgeway Ln, Allen, TX 75013
Ming Li
GLOBAL PROCESS CONTROLS, INC
Ming Wen Li
BAMBOO HOUSE LEE INC

Publications

Us Patents

Method For Forming Controlled Voids In Interlevel Dielectric

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US Patent:
59603119, Sep 28, 1999
Filed:
Aug 14, 1997
Appl. No.:
8/911291
Inventors:
Abha R. Singh - Carrollton TX
Artur P. Balasinski - Scottsdale AZ
Ming M. Li - Plano TX
Assignee:
STMicroelectronics, Inc. - Carrollton TX
International Classification:
H01L 21469
US Classification:
438623
Abstract:
A method of forming a thick interlevel dielectric layer containing sealed voids, formed in a controlled manner, over a substantially planar surface in semiconductor device structure, and the semiconductor structure formed according to such a method. The sealed voids are used to reduce interlevel capacitance. A plurality of metal signal lines are formed over a globally planarized insulator. A thick layer of first conformal interlevel dielectric is deposited over the metal signal lines and over the intermetal spacings formed between the metal signal lines. Because of the thickness, flow properties, and manner of deposition of the interlevel dielectric and the aspect ratio the intermetal spacings, voids are formed in the first conformal interlevel dielectric, in the intermetal spacings. This interlevel dielectric is then etched or polished back to the desired thickness, which exposes the voids in the wider intermetal spacings, but does not expose voids in the narrower intermetal spacings. An etchback may be chosen so that all voids are exposed.

Method For Forming Controlled Voids In Interlevel Dielectric

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US Patent:
58474641, Dec 8, 1998
Filed:
Sep 27, 1995
Appl. No.:
8/534669
Inventors:
Abha R. Singh - Carrollton TX
Artur P. Balasinski - Scottsdale AZ
Ming M. Li - Plano TX
Assignee:
SGS-Thomson Microelectronics, Inc. - Carrollton TX
International Classification:
H01L 2348
H01L 2352
H01L 2940
US Classification:
257752
Abstract:
A method of forming a thick interlevel dielectric layer containing sealed voids formed in a controlled manner, over a substantially planar surface in semiconductor device structure, and the semiconductor structure formed according to such a method. The sealed voids are used to reduce interlevel capacitance. A plurality of metal signal lines are formed over a globally planarized insulator. A thick layer of first conformal interlevel dielectric is deposited over the metal signal lines and over the intermetal spacings formed between the metal signal lines. Because of the thickness, flow properties, and manner of deposition of the interlevel dielectric and the aspect ratio the intermetal spacings, voids are formed in the first conformal interlevel dielectric, in the intermetal spacings. This interlevel dielectric is then etched or polished back to the desired thickness, which exposes the voids in the wider intermetal spacings, but does not expose voids in the narrower intermetal spacings. An etchback may be chosen so that all voids are exposed.

Embedded Coil Assembly And Method Of Making

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US Patent:
20180336994, Nov 22, 2018
Filed:
Nov 10, 2017
Appl. No.:
15/809750
Inventors:
- Dallas TX, US
Benjamin Michael Sutton - Dallas TX, US
Ming Li - Dallas TX, US
International Classification:
H01F 27/28
H01F 27/32
H01F 17/04
H01F 41/12
H01F 41/04
H01F 17/00
H01F 27/02
H01F 17/06
Abstract:
An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

High-Frequency Antenna Structure With High Thermal Conductivity And High Surface Area

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US Patent:
20170347490, Nov 30, 2017
Filed:
May 24, 2016
Appl. No.:
15/162888
Inventors:
- Dallas TX, US
- Freising, DE
Ming Li - Plano TX, US
Yiqi Tang - Allen TX, US
International Classification:
H05K 7/20
H05K 1/02
H05K 13/00
Abstract:
A heat dissipating antenna comprised of a low-attenuating heat spreader bonded to a high frequency antenna or antenna array.An integrated circuit with a wireless integrated circuit chip, and a heat dissipating antenna coupled to the wireless integrated circuit chip. A method of forming a heat dissipating antenna.

Embedded Coil Assembly And Method Of Making

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US Patent:
20170294263, Oct 12, 2017
Filed:
Jun 27, 2017
Appl. No.:
15/634336
Inventors:
- Dallas TX, US
Benjamin Michael Sutton - Dallas TX, US
Ming Li - Dallas TX, US
International Classification:
H01F 27/28
H01F 41/12
H01F 17/06
H01F 27/32
H01F 41/04
Abstract:
An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

Embedded Coil Assembly And Method Of Making

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US Patent:
20160181003, Jun 23, 2016
Filed:
Dec 19, 2014
Appl. No.:
14/576904
Inventors:
- Dallas TX, US
Benjamin Michael Sutton - Dallas TX, US
Ming Li - Dallas TX, US
International Classification:
H01F 27/28
H01F 41/04
H01F 27/02
Abstract:
An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

Embedded Coil Assembly And Production Method

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US Patent:
20160181004, Jun 23, 2016
Filed:
Dec 19, 2014
Appl. No.:
14/576934
Inventors:
- Dallas TX, US
Benjamin Michael Sutton - Dallas TX, US
Ming Li - Dallas TX, US
International Classification:
H01F 27/28
H01F 41/12
H01F 41/04
Abstract:
An embodiment of coil assembly includes a laterally disposed ferrite ring having a central opening. A laterally disposed annular conductive member is positioned above the ferrite ring and has a plurality of spaced-apart circumferential segments. A plurality of bond wires are connected at opposite ends thereof to outer and inner portions of the plurality of spaced-apart circumferential segments. A layer of mold compound covers the ferrite ring and the bond wires.

Perfluoroalkyl Functionalized Polyacrylamide For Alcohol Resistant-Aqueous Film-Forming Foam (Ar-Afff) Formulation

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US Patent:
20150251035, Sep 10, 2015
Filed:
Sep 25, 2013
Appl. No.:
14/430905
Inventors:
- Neuhausen am Rheinfall, CH
Ming Li - Mansfield TX, US
International Classification:
A62D 1/02
C08G 63/688
Abstract:
New high molecular weight fluoropolymers (fluoropolymer surfactants) are provided that are useful in compositions for use as fire extinguishing concentrates. The fluoropolymers contain C-Cperfluoroalkyl groups, and substantially lack perfluoroalkyl groups containing more than 6 fluorine-substituted carbon atoms.
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Ming Hai Li from Midland, TX, age ~41 Get Report