Jim Li

6636651, Oct 21, 2003

Jun 8, 2001

09/877736

Jim W. Li - Fremont CA

Koncent Communication, Inc. - Fujian

G02B 627

385 11, 385 15

Four-port optical circulators and apparatus employing such optical circulators are disclosed. The circulators utilize various arrangements of birefringent elements, polarization rotators and non-reciprocal polarization rotators to route optical signals from a first input/output (I/O) port to a second I/O port, from the second I/O port to a third I/O port, from the third I/O port to a fourth, and from the fourth I/O port to the first I/O port. The number of components and their configuration may be varied depending upon requirements of optical isolation, port configuration, manufacturability, yield and cost. Four-port circulators may be incorporated into an apparatus with optical signal conditioners, such as chirped fiber gratings, wavelength converters or optical amplifiers, optically coupled to one or more of the input/output ports. Alternatively, the circulators may be incorporated into a bidirectional add/drop apparatus with bandpass filters coupled to two of the input/output ports.

7235150, Jun 26, 2007

Jul 23, 2004

10/898537

William K. Bischel - Menlo Park CA, US
David K. Wagner - San Jose CA, US
Harald Guenther - Los Gatos CA, US
Simon J. Field - Palo Alto CA, US
Markus P. Hehlen - Los Gatos CA, US
Richard B. Tompane - Los Altos CA, US
Andrew T. Ryan - Sunnyvale CA, US
C. Geoffrey Fanning - Hillsboro OR, US
Jim W. Li - Fremont CA, US
Nina D. Morozova - San Jose CA, US

Gemfire Corporation - Fremont CA

B32B 37/10

156212, 156300, 156299, 156298, 156297

An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

7244738, Jul 17, 2007

Jul 2, 2004

10/884768

Terrence Joseph Connolly - Redwood City CA, US
Paul Francis Keitz - Redwood City CA, US
Eun Kyung Lee - San Jose CA, US
Jim Li - San Jose CA, US
Francisco Javier Lopez-Tapia - Union City CA, US
Patrick Finbar McGarry - Mountain View CA, US
Chris Richard Melville - Palo Alto CA, US
Dov Nitzan - San Jose CA, US
Counde O'Yang - Sunnyvale CA, US
Fernando Padilla - Fremont CA, US
Klaus Kurt Weinhardt - San Francisco CA, US

Roche Palo Alto LLC - Palo Alto CA

A61K 31/517
A01N 43/54
C07D 239/72
A61K 31/549
C07D 417/02
C07D 285/26

5142663, 5142662, 544287

Compounds represented by Formula I:.

7450161, Nov 11, 2008

Dec 2, 2004

11/003824

Chen Feng - Bothell WA, US
Jim Li - San Jose CA, US

MagnaChip Semiconductor Ltd. - Cheongju-si

H04N 9/73

3482241, 3482231, 3482271, 3482301, 2502081, 250216

Systems, computer readable media and methods for digital processing of images captured by a sensor to enhance intensity uniformity of the images. The sensor captures an image of a white light source. Then, using the captured image, a compensation factor for each pixel of the image sensor is calculated and stored in a memory. Next, an actual image is captured by the image sensor. Subsequently, the signal intensity of each pixel is modified using the corresponding compensation factor to enhance the uniformity of the actual image.

7456878, Nov 25, 2008

May 11, 2005

11/128104

Qun Sun - Cupertino CA, US
Hui Tian - Cupertino CA, US
Chen Feng - Bothell WA, US
Jim Li - San Jose CA, US

MagnaChip Semiconductor Ltd. - Cheongju-si

H04N 5/217
H04N 5/335
H04N 3/14
H04N 9/083
G06K 9/00

348241, 348273, 348294, 382167

The present invention is directed at method of designing a Color Filter Arrays (CFA) for CMOS image sensors under the effects of crosstalk for optimal color reproduction. Instead of a focus on lowering crosstalk, a novel method of designing color filter spectral responses to compensate for the effect of crosstalk at the color imaging system level is proposed. As part of this method, a color reproduction model for CMOS and CCD image sensor under the effect of crosstalk is also proposed.

7508430, Mar 24, 2009

Feb 18, 2005

11/061349

Remzi Oten - Santa Clara CA, US
Jim Li - San Jose CA, US

Magnachip Semiconductor, Ltd. - Cheongju-si

H04N 9/64
H04N 5/00
G06K 9/38

348242, 348615, 348621, 382272

A method for reducing the row noise from complementary metal oxide semiconductor (CMOS) image sensor by using a local offset correction is disclosed. The method operates on sensor with and without a Color Filter Array (CFA) before any interpolation is applied and estimates the local offset by comparing the rows in a local window. The method also reduces the pixel-to-pixel noise while reducing the row noise.

7564489, Jul 21, 2009

Feb 18, 2005

11/060856

Remzi Oten - Santa Clara CA, US
Jim Li - San Jose CA, US

Crosstek Capital, LLC - Wilmington DE

H04N 5/217
H04N 1/38

348241, 358463

A method for reducing the row noise from complementary metal oxide semiconductor (CMOS) image sensor by using average values from sub-regions of the shielded pixels. The method operates on sensor with and without a Color Filter Array (CFA) before any interpolation is applied and estimates the local offset by subtracting out outliers and averaging the averages of sub-regions in the shielded pixels. The method also reduces the pixel-to-pixel noise while reducing the row noise.

7653109, Jan 26, 2010

Jun 25, 2007

11/768150

William K. Bischel - Menlo Park CA, US
David K. Wagner - San Jose CA, US
Harald Guenther - Los Gatos CA, US
Simon J. Field - Palo Alto CA, US
Markus P. Hehlen - Los Gatos CA, US
Richard B. Tompane - Los Altos CA, US
Andrew T. Ryan - Sunnyvale CA, US
C. Geoffrey Fanning - Hillsboro OR, US
Jim W. Li - Fremont CA, US
Nina D. Morozova - San Jose CA, US

Gemfire Corporation - Fremont CA

H01S 5/00

372 5012, 156212

An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.