Chen H Xu

6517893, Feb 11, 2003

Aug 28, 2001

09/941086

Joseph A. Abys - Warren NJ
Chonglun Fan - Bridgewater NJ
Brian T. Smith - Somerville NJ
Bruce F. Stacy - North Brunswick NJ
Chen Xu - New Providence NJ

Lucent Technologies Inc. - Murray Hill NJ

B05D 512

427 96, 427118, 427125, 427405

A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.

6534192, Mar 18, 2003

Sep 24, 1999

09/405368

Joseph A. Abys - Warren NJ
Chonglun Fan - Bridgewater NJ
Brian T. Smith - Somerville NJ
Bruce F. Stacy - North Brunswick NJ
Chen Xu - New Providence NJ

Lucent Technologies Inc. - Murray Hill NJ

H05K 109

428620, 428652, 428670, 428671, 428675, 174256

A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.

6542232, Apr 1, 2003

Jun 22, 2001

09/887826

Joseph A. Abys - Howell NJ
Michael L. Ammerman - Howell NJ
Alan Blair - Murray Hill NJ
Edward J. Kudrak - Morganville NJ
Chen Xu - New Providence NJ

Lucent Technologies Inc. - Murray Hill NJ

G01J 344

356301

In accordance with the invention, the quality of hard gold is determined by Raman vibrational spectroscopy. A sample of the hard gold is provided, a monochromatic light beam is directed onto the sample, and the frequency and intensity of the light scattered by the sample is analyzed for the vibrational frequencies of polymer molecules. Scattering frequencies offset from the initial beam frequency by about 2132 cm and about 2182 cm , for example, are indicative of high quality nickel-hardened gold.

8018316, Sep 13, 2011

May 11, 2007

11/747555

Flavio Pardo - New Providence NJ, US
Maria E. Simon - New Providence NJ, US
Brijesh Vyas - Warren NJ, US
Chen Xu - New Providence NJ, US

Alcatel Lucent - Paris

H01H 71/18
H01H 61/00

337123, 337132, 337139, 337141

A method comprising forming a structural element on a surface of a layer via an electroless plating of nickel or cobalt onto the surface, the layer being rigidly fixed to an underlying substrate. The method also comprises etching away a portion of the layer such that a part of the structural element is able to move with respect to the substrate.

8226807, Jul 24, 2012

Oct 20, 2008

12/254207

Joseph A. Abys - Warren NJ, US
Jingye Li - West Haven CT, US
Chen Xu - New Providence NJ, US

Enthone Inc. - West Haven CT

C25D 15/00
C25D 15/02

205109

There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.

20020185716, Dec 12, 2002

May 11, 2001

09/853800

Joseph Abys - Warren NJ, US
Chonglun Fan - Bridgewater NJ, US
Chen Xu - New Providence NJ, US
Yun Zhang - Warren NJ, US

H01L023/48
H01L023/52

257/677000, 257/761000, 257/762000

In accordance with the invention, a metal substrate is coated with a multilayer finish comprising a layer of tin or tin alloy and one or more outer metal layers. An optional metal underlayer may be disposed between the substrate and the tin. In an exemplary embodiment the metal substrate comprises copper alloy coated with a nickel underlayer, a layer of tin and an outer metal layer of palladium. The resulting structure is particularly useful as an electrical connector or lead frame.

20020192492, Dec 19, 2002

May 11, 2001

09/853799

Joseph Abys - Warren NJ, US
Chonglun Fan - Bridgewater NJ, US
Chen Xu - New Providence NJ, US
Yun Zhang - Warren NJ, US

B32B015/01

428/647000, 428/646000, 428/698000

In accordance with the invention, a metal substrate is coated with a layer of tin or tin alloy that is surface doped to inhibit the growth of tin whiskers. An optional metal underlayer may be disposed between the substrate and the tin. In an exemplary embodiment the metal substrate comprises copper alloy coated with a nickel underlayer and a layer of surface doped with gold or palladium tin. The doping inhibits whisker growth, and the resulting structure is particularly useful as an electrical connector or lead frame.

20030025182, Feb 6, 2003

Jun 22, 2001

09/887827

Joseph Abys - Warren NJ, US
Chonglun Fan - Bridgewater NJ, US
Chen Xu - New Providence NJ, US
Yun Zhang - Warren NJ, US

H01L023/495

257/666000, 257/677000

In accordance with a first aspect of the invention, a metal substrate is provided with a layer of tin or tin alloy that is coated under tensile stress to inhibit the growth of tin whiskers. The tensile stressed tin and tin alloy is preferably coated with a grain size larger than 1 micrometer. Advantageously the tin or tin alloy is coated on an underlayer chosen to maintain or generate the tensile stress state in the tin coating. The tensile stress inhibits whisker growth, and the resulting structure is particularly useful as a part of an electrical connector or lead frame. In a second aspect of the invention, the tensile stress of tin coatings is monitored to provide coatings of reduced tendency toward whisker growth.