Inventors:
David Haas - Westfield NJ, US
Chengzeng Xu - Tewksbury MA, US
Mavyn McAuliffe - Waltham MA, US
Scott Zimmerman - Baskingridge NJ, US
Laura Miller - Mount Airy NC, US
Meifang Qin - Branchburg NJ, US
Baopei Xu - Wakefield MA, US
Richard Pommer - Trabuco Canyon CA, US
International Classification:
B32B027/02
B32B017/02
B32B009/00
B32B033/00
US Classification:
428/041800, 442/164000, 442/415000, 442/180000
Abstract:
This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.