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Zhizhong Tang

from Gilbert, AZ
Age ~46
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Also known as:
Shushing Tang, Zhi Zhong Tang, Tang Zhizhong
Related to:
Nelia T HernandezIsrael H Cardenas, 83Maggie Wang, 73Susan Lin, 78Jinyu Wang, 53Jing Wang, 61Shushing Tang
Connected to:
Alan Tang, 50Albert M Tang, 81Alexandria T Tang, 52Alexis R Tang, 29An Tang, 65Andes Y Tang, 63Ang Y Tang, 65Angie M Tang, 57Anh Q Tang, 57Antonia T Tang, 37

Zhizhong Tang Phones & Addresses

  • Gilbert, AZ
  • Phoenix, AZ
  • Palo Alto, CA
  • Glendale, AZ
  • Casa Grande, AZ
  • Mesa, AZ
  • San Tan Valley, AZ
  • Apache Junction, AZ
  • San Carlos, CA
  • Tempe, AZ
  • Chandler, AZ
  • Redmond, WA
  • Burlingame, CA

Resumes

Resumes

Zhizhong Tang Photo 1

Zhizhong Tang

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Location:
Phoenix, AZ
Industry:
Semiconductors
Work:
Intel - Phoenix, Arizona Area since Aug 2010
Senior Packaging Engineer
Education:
Arizona State University 2005 - 2010
Ph.D., Material Science and Engineering Huazhong University of Science and Technology 1996 - 2003
M.E., B.E., Material Engineering/Mechanical Engineering
Skills:
Semiconductors
Thin Films
Failure Analysis
Design of Experiments
Characterization
Materials Science
Afm
Powder X Ray Diffraction
Cvd
Scanning Electron Microscopy
Jmp
Device Characterization
Nanotechnology
Silicon
Photolithography
Mems
Sputtering
Semiconductor Process
Etching
Process Integration
Cmos
Chemical Vapor Deposition
Interests:
Economic Empowerment
Travelling
Soccer
Education
Environment
Sports
Human Rights
Languages:
English
Mandarin
Certifications:
Lean Sigma-6 Green Belt
Intel Corporation
Zhizhong Tang Photo 2

Zhizhong Tang

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Location:
United States

Publications

Us Patents

Sintered Heat Spreaders With Inserts

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US Patent:
20190027379, Jan 24, 2019
Filed:
Nov 16, 2015
Appl. No.:
15/767126
Inventors:
- Santa Clara CA, US
Aravindha R. Antoniswamy - Phoenix AZ, US
Thomas J. Fitzgerald - Phoenix AZ, US
Nikunj P. Patel - Cary NC, US
Syadwad Jain - Chandler AZ, US
Zhizhong Tang - Tempe AZ, US
Shrenik Kothari - Phoenix AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21/48
H01L 23/367
H01L 23/373
H01L 23/544
H01L 23/42
Abstract:
Disclosed herein are embodiments of sintered heat spreaders with inserts and related devices and methods. In some embodiments, a heat spreader may include: a frame including aluminum and a polymer binder; an insert disposed in the frame, wherein the insert has a thermal conductivity higher than a thermal conductivity of the frame; and a recess having at least one sidewall formed by the frame. The polymer binder may be left over from sintering frame material and insert material to form the heat spreader.

Containers For Holding And Dispensing Stacks Of Electronic Device Components

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US Patent:
20180002101, Jan 4, 2018
Filed:
Jul 1, 2016
Appl. No.:
15/201372
Inventors:
- Santa Clara CA, US
Pan GU - Chandler AZ, US
Bassam M. Ziadeh - Laveen AZ, US
Michael Garcia - Chandler AZ, US
Zhizhong Tang - Tempe AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
B65D 83/08
B65D 85/62
Abstract:
A container assembly and system for dispensing a stack of electronic device components includes an elongated tube having a cavity configured to contain a stack of said components. The tube has a dispensing end opposite an access end and a dispenser opening sized to dispense the electronic device components. The access end has an access opening sized to allow entry of a press to push the stack upwardly. A retainer is positioned proximate the access end to engage a last component in the stack and prevent it from exiting the tube through the access opening. The retainer may include a plurality of retainers. The retainer(s) can be a pair of retainers, four retainers, a chamfer formed in the tube, a perimeter insert, and/or a slidable panel. A method of making and a method of dispensing are provided.

Foam Composite

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US Patent:
20180005917, Jan 4, 2018
Filed:
Jun 29, 2016
Appl. No.:
15/197440
Inventors:
Zhizhong Tang - Chandler AZ, US
Syadwad Jain - Chandler AZ, US
Wei Hu - Chandler AZ, US
Michael A. Schroeder - Chandler AZ, US
Rajen S. Sidhu - Portland OR, US
Carl L. Deppisch - Chandler AZ, US
Patrick Nardi - Scottsdale AZ, US
Kelly P. Lofgreen - Phoenix AZ, US
International Classification:
H01L 23/373
F28F 21/08
F28F 21/02
F28F 21/04
F28D 15/02
H01L 23/498
F28F 13/00
F28D 21/00
Abstract:
Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

Integrated Heat Spreader Having Electromagnetically-Formed Features

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US Patent:
20170186628, Jun 29, 2017
Filed:
Dec 23, 2015
Appl. No.:
14/998122
Inventors:
- Santa Clara CA, US
Thomas John Fitzgerald - Phoenix AZ, US
Kumaran Murugesan Chakravarthy - Chandler AZ, US
Syadwad Jain - Chandler AZ, US
Wei Hu - Chandler AZ, US
Zhizhong Tang - Tempe AZ, US
International Classification:
H01L 21/48
H01L 23/367
F28F 21/08
H01L 23/373
Abstract:
Integrated heat spreaders having electromagnetically-formed features, and semiconductor packages incorporating such integrated heat spreaders, are described. In an example, an integrated heat spreader includes a top plate flattened using an electromagnetic forming process. Methods of manufacturing integrated heat spreaders having electromagnetically-formed features are also described.

Paste Thermal Interface Materials

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US Patent:
20140264820, Sep 18, 2014
Filed:
Mar 13, 2013
Appl. No.:
13/801882
Inventors:
Wei Hu - Chandler AZ, US
Zhizhong Tang - Tempe AZ, US
Syadwad Jain - Chandler AZ, US
Rajen S. Sidhu - Chandler AZ, US
International Classification:
H01L 23/373
US Classification:
257713, 438122, 252 71
Abstract:
Embodiments of the present disclosure describe techniques and configurations for paste thermal interface materials (TIMs) and their use in integrated circuit (IC) packages. In some embodiments, an IC package includes an IC component, a heat spreader, and a paste TIM disposed between the die and the heat spreader. The paste TIM may include particles of a metal material distributed through a matrix material, and may have a bond line thickness, after curing, of between approximately 20 microns and approximately 100 microns. Other embodiments may be described and/or claimed.

Molded Heat Spreaders

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US Patent:
20140264821, Sep 18, 2014
Filed:
Mar 15, 2013
Appl. No.:
13/836407
Inventors:
Zhizhong Tang - Tempe AZ, US
Syadwad Jain - Chandler AZ, US
Paul R. Start - Chandler AZ, US
International Classification:
H01L 23/367
F28F 3/00
B29C 39/10
US Classification:
257713, 164108, 164 761, 264261, 165185
Abstract:
Embodiments of the present disclosure describe techniques and configurations for molded heat spreaders. In some embodiments, a heat spreader includes a first insert having a first face and a first side, the first face positioned to form a bottom surface of a first cavity, and a second insert having a second face and a second side, the second face positioned to form a bottom surface of a second cavity. The second cavity may have a depth that is different from a depth of the first cavity. The heat spreader may further include a molding material disposed between the first and second inserts and coupled with the first side and the second side, the molding material forming at least a portion of a side wall of the first cavity and at least a portion of a side wall of the second cavity. Other embodiments may be described and/or claimed.
Control profile
Zhizhong Tang from Gilbert, AZ, age ~46 Get Report