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Yuhao Te Sun

from Saratoga, CA
Age ~48

Yuhao Sun Phones & Addresses

  • 19961 Lannoy Ct, Saratoga, CA 95070
  • San Jose, CA
  • Winston Salem, NC
  • Sunnyvale, CA
  • Durham, NC
  • Fremont, CA
  • Hillsboro, OR
  • Portland, OR
  • Alameda, CA
  • Newark, CA

Work

Company: Trillion science Apr 2014 Position: Director

Education

School / High School: Columbia University Oct 2006 Specialities: Ph.D.

Skills

Polymers • DOE • Roll-to-roll • Laminations • Formulations • Adhesives • Packaging Materials • Early Access Program Managements

Resumes

Resumes

Yuhao Sun Photo 1

Manager, Field Application Engineering

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Location:
19961 Lannoy Ct, Saratoga, CA 95070
Industry:
Semiconductors
Work:
Siliconware Usa
Manager, Field Application Engineering

Thin Film Electronics Apr 2018 - Aug 2019
Staff Engineer

Thin Film Electronics Nov 1, 2015 - Apr 2018
Senior Process Engineer

Eoplex, Inc. Apr 2015 - Nov 2015
Senior Staff Engineer

Trillion Science Nov 2012 - Mar 2015
Manager and Director
Education:
Columbia University In the City of New York 2001 - 2006
Doctorates, Doctor of Philosophy, Chemical Engineering
East China University of Science and Technology 1994 - 2001
Bachelors, Bachelor of Science, Engineering
Skills:
Polymers
R&D
Characterization
Materials
Adhesives
Thin Films
Coatings
Formulation
Polymer Chemistry
Project Managers
Chemistry
Design of Experiments
Spectroscopy
Semiconductors
Uv/Vis
Packaging
Flip Chip
Die Attach
Languages:
English
Mandarin
Yuhao Sun Photo 2

Yuhao Sun

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Yuhao Sun Photo 3

Yuhao Sun Fremont, CA

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Work:
Trillion Science

Apr 2014 to 2000
Director

Trillion Science
Fremont, CA
Nov 2013 to Apr 2014
Sr. Manager

Trillion Science
Fremont, CA
Oct 2012 to Nov 2013
R&D Associate/Project Manager

Trillion Science
Fremont, CA
Apr 2007 to Oct 2012
Sr. Polymer Scientist

Education:
Columbia University
Oct 2006
Ph.D.

East China University of Science and Technology
Jun 1998
B.S. in Polymer Science and Engineering

Skills:
Polymers, DOE, Roll-to-roll, Laminations, Formulations, Adhesives, Packaging Materials, Early Access Program Managements

Publications

Us Patents

One Part Epoxy Resin Including A Low Profile Additive

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US Patent:
20110253943, Oct 20, 2011
Filed:
Apr 19, 2010
Appl. No.:
12/762623
Inventors:
Yuhao Sun - Fremont CA, US
Hua Song - Fremont CA, US
Chin-Jen Tseng - Fremont CA, US
Hsiao Ken Chuang - Sunnyvale CA, US
Assignee:
TRILLION SCIENCE, INC. - Fremont CA
International Classification:
H01B 1/12
C09J 163/00
US Classification:
252500, 523436
Abstract:
An adhesive composition comprising: (i) a one part curable epoxy adhesive and (ii) a low profile additive (LPA), the low profile additive being a polymer that is compatible with the epoxy adhesive such that it forms a single phase when admixed with the adhesive composition and that separates from the adhesive to form a network of stress-absorbing nodules therein when the adhesive is cured, the low profile additive being present in an amount sufficient to prevent or reduce shrinkage and/or the formation of voids or cracks when the adhesive is cured. In one embodiment the LPA is a block copolymer including at least one flexible block and at least one rigid block that makes the low profile additive compatible with the epoxy adhesive such that a mixture of the uncured epoxy resin and the low profile additive forms a homogenous solution and as the epoxy resin is cured, the low profile additive forms a stress absorbing network of nodules in the cured epoxy resin matrix.

Microcavity Carrier Belt And Method Of Manufacture

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US Patent:
20130071636, Mar 21, 2013
Filed:
Sep 15, 2011
Appl. No.:
13/233360
Inventors:
Yuhao Sun - Fremont CA, US
Maung Kyaw Aung - Union City CA, US
Chin-Jen Tseng - Fremont CA, US
Chiapu Chang - Saratoga CA, US
Shuji Rokutanda - Fremont CA, US
Assignee:
TRILLION SCIENCE, INC. - Fremont CA
International Classification:
B32B 5/16
B32B 3/10
B65G 17/36
B32B 38/10
B32B 37/14
US Classification:
428206, 156247, 156258, 198701, 428221
Abstract:
A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while conveying a surface of an adhesive layer into contact with the surface of the rotating belt, transferring the conductive particles from the microcavities on the belt to the adhesive layer in predefined locations in the adhesive layer corresponding to the array of microcavities on the belt, and separating the adhesive layer from the surface of the belt. In one embodiment, the position of the microcavities is varied in a controlled manner.

One Part Epoxy Resin Including Acrylic Block Copolymer

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US Patent:
20130146816, Jun 13, 2013
Filed:
Feb 7, 2013
Appl. No.:
13/761703
Inventors:
Yuhao Sun - Fremont CA, US
Chin-Jen Tseng - Fremont CA, US
Assignee:
Trillion Science Inc. - Fremont CA
International Classification:
C09J 163/00
US Classification:
252500, 523434
Abstract:
An adhesive composition comprising a phenoxy resin, a latent hardener, an acrylic block co-polymer dispersant and a weak solvent wherein the dispersant enables the phenoxy resin to be dispersed in a weak solvent that does not attack the latent hardener thereby providing a composition with good shelf life. The compositions are useful in making anisotropic conductive films.

Non-Random Array Anisotropic Conductive Film (Acf) And Manufacturing Processes

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US Patent:
20100101700, Apr 29, 2010
Filed:
Oct 29, 2009
Appl. No.:
12/608955
Inventors:
Jerry Chung - Mountain View CA, US
Chinjen Tseng - Fremont CA, US
Shuji Rokutanda - Fremont CA, US
Yuhao Sun - Newark CA, US
Assignee:
Trillion Science Inc. - Fremont CA
International Classification:
B32B 38/00
B32B 37/00
B32B 38/04
US Classification:
156 731, 156293, 156 736, 156281, 1562722, 1562726, 1562728
Abstract:
Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.

Fixed-Array Anisotropic Conductive Film Using Conductive Particles With Block Copolymer Coating

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US Patent:
20170004901, Jan 5, 2017
Filed:
Jul 15, 2016
Appl. No.:
15/211042
Inventors:
Rong-Chang Liang - Cupertino CA, US
Yuhao Sun - Fremont CA, US
Zhiyao An - Los Altos CA, US
Assignee:
Trillion Science, Inc. - Fremont CA
International Classification:
H01B 3/44
H05K 1/02
H01B 3/28
H01L 23/00
H01B 3/30
Abstract:
Structures and manufacturing processes of an ACF array and more particularly a non-random particles are transferred to the array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles surface-treated with a block copolymer composition onto a substrate or carrier web comprising a predetermined array of microcavities. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film.

Fixed-Array Anisotropic Conductive Film Using Conductive Particles With Block Copolymer Coating

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US Patent:
20150072109, Mar 12, 2015
Filed:
Sep 10, 2013
Appl. No.:
14/022791
Inventors:
Rong-Chang Liang - Cupertino CA, US
Yuhao Sun - Fremont CA, US
Zhiyao An - Los Altos CA, US
Assignee:
TRILLION SCIENCE, INC. - Fremont CA
International Classification:
H01B 7/40
H01B 3/30
H01B 3/28
H01B 3/44
H01B 7/00
H01B 7/02
US Classification:
428144, 252500
Abstract:
Structures and manufacturing processes of an ACF array and more particularly a non-random particles are transferred to the array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles surface-treated with a block copolymer composition onto a substrate or carrier web comprising a predetermined array of microcavities. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film.

Non-Random Array Anisotropic Conductive Film (Acf) And Manufacturing Processes

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US Patent:
20140312501, Oct 23, 2014
Filed:
May 20, 2014
Appl. No.:
14/282590
Inventors:
Rong-Chang Liang - Cupertino CA, US
Jerry Chung - Los Altos CA, US
Chin-Jen Tseng - Fremont CA, US
Shuji Rokutanda - Fremont CA, US
Yuhao Sun - Fremont CA, US
Assignee:
TRILLION SCIENCE INC. - Fremont CA
International Classification:
H05K 1/02
H05K 3/00
H01L 23/48
US Classification:
257773, 174250, 174254, 264104
Abstract:
Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, of selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.

Fixed Array Acfs With Multi-Tier Partially Embedded Particle Morphology And Their Manufacturing Processes

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US Patent:
20140141195, May 22, 2014
Filed:
Nov 16, 2012
Appl. No.:
13/678935
Inventors:
Rong-Chang Liang - Cupertino CA, US
Maung Kyaw Aung - Union City CA, US
Yuhao Sun - Fremont CA, US
An-Yu Ma - Fremont CA, US
International Classification:
H01B 7/00
US Classification:
428 98, 427 58
Abstract:
An anisotropic conductive film (ACF) comprising: (a) an adhesive layer having a substantially uniform thickness; and (b) a plurality of conductive particles individually adhered to the adhesive layer, wherein the conductive particles include a first non-random array of particle sites partially embedded at a first depth within the adhesive layer and a second fixed non-random array or dispersion of conductive particles partially embedded at a second depth or a dispersion of conductive particles fully embedded within the adhesive layer, wherein the first depth and the second depth are distinctly different. The ACF may be supplied as a sheet, a continuous film or as a roll and the multi-tier morphology may be present throughout the length of the product or in select areas.
Yuhao Te Sun from Saratoga, CA, age ~48 Get Report