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Xuan Shu

from San Francisco, CA
Age ~42
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Connected to:
Bernadette Shu, 48Cecilia Y Shu, 71Chao C Shu, 74Dan Z Shu, 56Elena Shu, 81Han J Shu, 59Jasmine L Shu, 29Jeanne Y Shu, 48Karina B Shu, 44Kenneth H Shu, 70

Xuan Shu Phones & Addresses

  • 2300 Webster St, San Francisco, CA 94115 (415) 563-8130
  • Burlingame, CA
  • 2300 Webster St APT 401, San Francisco, CA 94115

Work

Company: Palm Jan 2018 Position: Principal industrial designer

Education

Degree: Masters School / High School: Academy of Art University 2005 to 2008 Specialities: Fine Art, Industrial Design

Skills

Design Strategy • Hypershot • Industrial Design • Experience Design • Concept Development • Design Thinking • Product Design

Industries

Design

Resumes

Resumes

Xuan Shu Photo 1

Principal Industrial Designer

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Location:
Berkeley, CA
Industry:
Design
Work:
Palm
Principal Industrial Designer
Smartisan Technology Co., Ltd. Nov 2015 - Jan 2018
Chief Industrial Designer
Ammunition Aug 2010 - Oct 2015
Senior Designer
Ammunition May 2008 - Aug 2010
Designer
Education:
Academy of Art University 2005 - 2008
Masters, Fine Art, Industrial Design Beihang University 2001 - 2005
Bachelors, Industrial Design
Skills:
Design Strategy
Hypershot
Industrial Design
Experience Design
Concept Development
Design Thinking
Product Design

Publications

Us Patents

Faceplate For A Dispenser

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US Patent:
D631146, Jan 18, 2011
Filed:
Mar 5, 2010
Appl. No.:
29/357034
Inventors:
Xuan Shu - San Francisco CA, US
Victoria Slaker - San Francisco CA, US
Assignee:
S.C. Johnson & Son, Inc. - Racine WI
International Classification:
2899
US Classification:
D23366

Audio Listening System

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US Patent:
D637998, May 17, 2011
Filed:
Jan 4, 2010
Appl. No.:
29/353184
Inventors:
Robert Brunner - San Francisco CA, US
Xuan Shu - San Francisco CA, US
Assignee:
Beats Electronics, LLC - Santa Monica CA
International Classification:
1401
US Classification:
D14205

End Counter Display Unit

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US Patent:
D664791, Aug 7, 2012
Filed:
Dec 21, 2010
Appl. No.:
29/381593
Inventors:
Vince Voron - Duluth GA, US
Chrissy Naples - Atlanta GA, US
Victoria Slaker - San Francisco CA, US
Xuan Shu - San Francisco CA, US
Assignee:
The Coca-Cola Company - Atlanta GA
International Classification:
0606
US Classification:
D 6470

Audio Speaker System

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US Patent:
D687016, Jul 30, 2013
Filed:
Jan 9, 2012
Appl. No.:
29/410580
Inventors:
Robert Brunner - San Francisco CA, US
Eric Fields - San Francisco CA, US
Xuan Shu - San Francisco CA, US
Assignee:
Beats Electronics, LLC - Santa Monica CA
International Classification:
1403
US Classification:
D14216

Full Grip Cookware Handle

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US Patent:
D693634, Nov 19, 2013
Filed:
Jan 22, 2013
Appl. No.:
29/443768
Inventors:
Tim Tan - San Francisco CA, US
Victoria Slaker - San Francisco CA, US
Xuan Shu - San Francisco CA, US
Assignee:
Williams-Sonoma, Inc. - San Francisco CA
International Classification:
0702
US Classification:
D 7394

Full Grip Cookware Handle

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US Patent:
D693635, Nov 19, 2013
Filed:
Jan 22, 2013
Appl. No.:
29/443774
Inventors:
Tim Tan - San Francisco CA, US
Victoria Slaker - San Francisco CA, US
Xuan Shu - San Francisco CA, US
Assignee:
Williams-Sonoma, Inc. - San Francisco CA
International Classification:
0702
US Classification:
D 7394

Packaging For Headphones, Packaged Headphones, And Related Methods

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US Patent:
20130118944, May 16, 2013
Filed:
Nov 15, 2012
Appl. No.:
13/678394
Inventors:
Mark T. Niiro - Park City UT, US
Xuan Shu - San Francisco CA, US
Joshua Brent Poulsen - Park City UT, US
Kevin Sze - Salt Lake City UT, US
Assignee:
SKULLCANDY, INC. - Park City UT
International Classification:
B65D 73/02
B65B 5/02
US Classification:
206471, 53467
Abstract:
Packaging inserts for headphones include a unitary body having two or more integral portions configured to fold relative to one another so as to partially enclose, support, and retain a headphone within the folded unitary body between the integral portions. Methods of packaging headphones include positioning a headphone on such a unitary body, and folding the unitary body around at least a portion of the headphones. Packaged headphone assemblies include a headphone, and such a packaging insert folded around at least a portion of the headphone.

Accessory Clip For An Electronic Device

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US Patent:
D618244, Jun 22, 2010
Filed:
Oct 19, 2009
Appl. No.:
29/345601
Inventors:
Kenneth Sweet - San Francisco CA, US
Xuan Shu - San Francisco CA, US
Assignee:
Barnes & Noble, Inc. - New York NY
International Classification:
1402
US Classification:
D14432, D14299
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Xuan Shu from San Francisco, CA, age ~42 Get Report