Inventors:
Mario J. Interrante - New Paltz NY
Brenda Peterson - Wappingers Falls NY
Sudipta K. Ray - Wappingers Falls NY
William E. Sablinski - Beacon NY
Amit K. Sarkhel - Endicott NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01R 909
US Classification:
174261, 439 65, 439 66, 439 75
Abstract:
The present invention relates generally to a new semiconductor chip carrier connections, where the chip carrier and the second level assembly are made by a surface mount technology. More particularly, the invention encompasses surface mount technologies, such as, Ball Grid Array (BGA), Column Grid Array (CGA), to name a few, where the surface mount technology comprises essentially of a non-solder metallic connection, such as, a copper connection. The present invention is also related to Column Grid Array structures and process thereof.