William P Minnear

6407411, Jun 18, 2002

Apr 13, 2000

09/548440

Robert J. Wojnarowski - Ballston Lake NY
Richard J. Uriarte - Clifton Park NY
Ferenc Horkay - Rockville MD
Pamela K. Benicewicz - Loudonville NY
William P. Minnear - Clifton Park NY

General Electric Company - Schenectady NY

H01L 3300

257 99, 257100, 257675, 257676

An improved LED lead frame packaging assembly includes a thermally conducting, electrically insulating material that enhances the thermal conduction and structural integrity of the assembly, a UV-resistant encapsulantmaterial, and an integral ESD material that reduces electrostatic discharge. The thermally conducting, electrically insulating material creates an electrically insulating, thermally conductive path in the lead frame assembly for dissipation of power and also acts as a mounting structure thus allowing for the use of a soft encapsulant material, preferably a silicone.

6417494, Jul 9, 2002

Jan 7, 2000

09/479784

Eugene R. Westerberg - Palo Alto CA
William P. Minnear - Clifton NY
Jay G. Romiti - Santa Clara CA

Quadlux, Inc. - Orinda CA

A47J 3734

219402, 219405, 219411

The present invention is a lightwave oven that includes an oven chamber, a food support within the oven chamber, and a lightwave cooking lamp moveably mounted within the oven chamber between a first position in which the lamp is positioned to direct radiant energy onto a first area of the food support and a second position in which the lamp is positioned to direct radiant energy onto a second, separate, area of the food support. The lamp is illuminated and made to scan, preferably multiple times, across the food so as to cook the food.

6452217, Sep 17, 2002

Jun 30, 2000

09/607700

Robert J. Wojnarowski - Ballston Lake NY
William P. Minnear - Clifton Park NY

General Electric Company - Schenectady NY

H01L 3300

257 99, 257 88, 257 98, 257100, 362555, 362294, 362297

High power LED lamps for use in lighting products, such as flashlights and the like, are formed of a plurality of LED die arranged in a multi-dimensional array, each of the LED die having a gallium nitride semiconductor layer and phosphor material for creation of white light. Each of the LED die emits light from the top, bottom and sides of the die and is arranged on the multi-dimensional array so that the emitted light from each of the die does not contact another die. A reflector gathers and focuses the light from each of the die to approximate a high power LED lamp. A thermally conducting, electrically insulating material or phase change material is incorporated into the lamp to act as a source of heat removal.

6483196, Nov 19, 2002

Apr 3, 2000

09/542037

Robert J. Wojnarowski - Ballston Lake NY
William P. Minnear - Clifton Park NY
Pamela K. Benicewicz - Loudonville NY

General Electric Company - Schenectady NY

H01L 2940

257778, 257432

A flip chip structure of a light-emitting device comprising a UV/blue light emitting diode (LED) is disclosed. The flip chip structure is optimized to produce unique light focusing and phosphor illumination out the bottom of the structure. The flip chip structure includes a substrate, a gallium nitride layer epitaxially grown on a top surface of the substrate, and one or more layers of lensing material deposited on a bottom surface of the substrate. The lensing material is preferably a polymer lensing material, an index matching material, or a mixture thereof. The gallium nitride layer is deposited in the form of one or more odd-sided polygons, for enhanced light extraction.

6867542, Mar 15, 2005

Mar 29, 2000

09/537192

Xiao-Dong Sun - Schenectady NY, US
William P. Minnear - Clifton Park NY, US

General Electric Company - Schenectady NY

H01J001/62
H01L033/00

313512, 313498, 313501, 313502, 257 79, 257 81, 257 98, 257 99, 257100, 362237, 362240, 362241

A solid state lamp includes a mounting area adapted to contain a light emitting diode (LED) chip and a suspension media which physically isolates the diode from the mounting area. The suspension media, while substantially optically transparent, includes suspended phosphor particles for down conversion and scattering of LED emissions. Additionally, the suspension media includes thermal conductivity additives to improve device thermal conductivity in higher power operations.

6974619, Dec 13, 2005

Dec 26, 2003

10/747724

Mohan Manoharan - Niskayuna NY, US
William Paul Minnear - Clifton Park NY, US
Reza Sarrafi-Nour - Clifton Park NY, US
Krishan Lal Luthra - Schenectady NY, US

General Electric Company - Niskayuna NY

B32B005/00

428 98, 428446, 428426, 428432, 4283044, 428689, 428697, 428698, 428704, 428702, 428457

A material and an article comprising the material are presented. The material comprises a plurality of structural components. The structural components are configured in a series of increasing structural component size classes. The series has a base unit size class and at least one modular size class, and a component of the at least one modular size class comprises a plurality of components of the next smaller size class in the series. The structural components of the base unit size class comprise at least one bulk phase, and the structural components are bonded together at interfaces. Mechanical damage originating within a modular size class structural component is energetically favored to propagate in a distributed fashion among the plurality of structural components contained within the modular size class structural component.

7175826, Feb 13, 2007

Dec 29, 2003

10/747838

John Patrick Lemmon - Schoharie NY, US
William Paul Minnear - Clifton Park NY, US
Luke Nathaniel Brewer - Albuquerque NM, US
Susan Holt Townsend - Niskayuna NY, US

General Electric Company - Niskayuna NY

C01B 6/04
B01J 23/02

423645, 4236582, 502100, 502340

Disclosed herein is a hydrogen storage composition comprising a catalyst composition disposed upon a storage composition; wherein the catalyst composition comprises an alloy of calcium, barium, platinum, palladium, nickel, titanium, chromium, manganese, iron, cobalt, copper, silicon, germanium, rhodium, rhodium, ruthenium, molybdenum, niobium, zirconium, yttrium, barium, lanthanum, hafnium, tungsten, rhenium, osmium, iridium, or a combination comprising at least one of the foregoing metals.

7576970, Aug 18, 2009

Dec 24, 2003

10/745354

William Paul Minnear - Clifton Park NY, US
Luke Nathaniel Brewer - Rexford NY, US

General Electric Company - Niskayuna NY

H01G 9/00

361502, 361503, 361504, 361512, 361303, 361305, 429 33, 429 40, 429 41

A hybrid capacitive storage system and method for storing electrical energy and hydrogen comprising at least a first dielectric layer, which dielectric layer is substantially impermeable to hydrogen. The hybrid storage system further comprises at least a first catalytic electrode layer disposed on at least a portion of a first surface of said first dielectric layer, which first catalytic electrode layer converts molecular hydrogen into atomic hydrogen, an electrode layer disposed on at least a portion of a second surface of said first dielectric layer, which electrode layer is selectively electrically connected to said first catalytic electrode layer; and at least one field generator for selectively applying a field to said storage system. Upon introduction of hydrogen to the storage system and activation of the at least one field generator, the hydrogen is converted to protons and electrons, wherein the electrons are permitted to flow through electrical connection to the electrode layer and the protons remain at the first catalytic electrode layer.