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William L Holtkamp

from San Jose, CA
Age ~64
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Also known as:
William Louis Holtkamp, Bill Holtkamp, William Kimball, William L Holtkamo, William L Schmidt
Phone and address:
5309 Rafton Dr, San Jose, CA 95124
Related to:
Kyle D Holtkamp, 26Randy R Kimball, 75Leslie A Holtkamp, 61Donna L Darling, 70Maria Holtkamp, 61Terri L Holtkamp, 61Gayle L Holtkamp, 61Larry L Oliver, 82
Connected to:
Christopher J Holtkamp, 60Koen Holtkamp, 46Linda J Holtkamp, 68Michael A Holtkamp, 63Sue C Holtkamp, 87Suzanne L Holtkamp, 56Amanda N Holtman, 43Brenda L Holtman, 65Chelsea M Holtman, 35Ellen D Holtman, 50

William Holtkamp Phones & Addresses

  • 5309 Rafton Dr, San Jose, CA 95124
  • Los Gatos, CA
  • 1305 Terra Bella Ave, Mountain View, CA 94043
  • 950 High School Way, Mountain View, CA 94041
  • 4978 Bonita Ridge Ave, Tucson, AZ 85750
  • Santa Clara, CA

Business Records

Name / Title
Company / Classification
Phones & Addresses
William Holtkamp
Marketing Director
Spectra-physics Lasers Inc
All Other Miscellaneous Electrical Equipment and Component M
1335 Terra Bella Ave #7, Mountain View, CA 94043
(650) 961-2550

Publications

Us Patents

Method For Depositing And/Or Removing Material On A Substrate

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US Patent:
6365025, Apr 2, 2002
Filed:
Nov 14, 2000
Appl. No.:
09/712052
Inventors:
Chiu H. Ting - Saratoga CA
William H. Holtkamp - San Jose CA
Assignee:
CuTek Research, Inc. - San Jose CA
International Classification:
C25D 500
US Classification:
205 80, 205640, 118300, 427299, 427331, 427444, 427402, 438758
Abstract:
A multiple station processing chamber used to deposit and/or remove a material on a semiconductor wafer is described. The multiple station processing chamber is comprised of two or more processing stations at which the wafer is exposed to a processing fluid. The processing stations are positioned within the chamber such that the wafer may be moved from station to station while remaining within the chamber. Each station of the multiple station processing chamber may have a fluid containment ring used for containment, disposal, and/or reuse of the electrolyte used to process the wafer at that particular processing station. The wafer is brought to the first processing station on a wafer support and exposed to a first processing fluid, which is then diverted into fluid containment ring for the first processing station. The wafer is then moved to a second processing chamber where the process is repeated with a second processing fluid.

Linearly Distributed Semiconductor Workpiece Processing Tool

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US Patent:
8398355, Mar 19, 2013
Filed:
May 26, 2006
Appl. No.:
11/442511
Inventors:
William Holtkamp - Newark CA, US
Izya Kremerman - Los Gatos CA, US
Christopher Hofmeister - Hampstead NH, US
Richard Pickreign - Harvard MA, US
Assignee:
Brooks Automation, Inc. - Chelmsford MA
International Classification:
H01L 21/677
US Classification:
414217, 414939
Abstract:
A substrate processing apparatus includes a transport chamber capable of holding an isolated atmosphere therein and communicably connected to a charging station for loading and unloading a substrate into the apparatus, a transport system inside the transport chamber for transporting the substrate and an array of processing chamber modules distributed alongside the transport chamber and communicably connected to the transport chamber to allow the substrate to be transferred therebetween.

Methods For Sealing And Unsealing Using A Magnetically Permeable Solid-Based Medium

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US Patent:
57046131, Jan 6, 1998
Filed:
Oct 7, 1996
Appl. No.:
8/729706
Inventors:
William H. Holtkamp - San Jose CA
International Classification:
F16J 1500
US Classification:
277 1
Abstract:
Devices and methods employ a solid-based medium that serves as a magnetic sealant, a lubricant, a bearing, an electrical or thermal conductor, singly or in combination. Included are devices wherein the solid-based medium is retained in a selected position using a magnetic field. In particular, the solid-based medium is either magnetically coupled to the magnetic field or is contained within a cavity sealed by a magnetic seal. In one group of embodiments, the solid-based medium comprises molecules having a molecular structure wherein one element of the structure is a cage or tube, as in fullerenes or met-cars. Such molecules are particularly useful in all of the devices of the present invention because of their exceptional stability and resilience. These properties ensure good performance in corrosive and/or vacuum environments and over a longer lifetime than is possible with conventional media.

Introducing And Reclaiming Liquid In A Wafer Processing Chamber

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US Patent:
61799823, Jan 30, 2001
Filed:
Oct 30, 1998
Appl. No.:
9/183611
Inventors:
Chiu H. Ting - Saratoga CA
William H. Holtkamp - Santa Clara CA
Richard W. Brodowski - Fremont CA
Joseph B. Wytman - Los Gatos CA
Assignee:
Cutek Research, Inc. - San Jose CA
International Classification:
C25D 500
C25D 1700
C25F 330
C25F 700
US Classification:
205 80
Abstract:
A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field, and in which the electrolyte is introduced and/or evacuated from a closely confined containment region. A hollow sleeve is utilized to form a containment chamber for holding the electrolyte. A wafer residing on a support is moved vertically upward to engage the sleeve to form an enclosing floor for the containment chamber. One electrode is disposed within the containment chamber while the opposite electrode is comprised of several electrodes distributed around the circumference of the wafer. The electrodes are also protected from the electrolyte when the support is raised and engaged to the sleeve. In one embodiment, the support and the sleeve are stationary during processing, while in another embodiment, both are rotated or oscillated during processing.

Method And Apparatus For The Disposal Of Processing Fluid Used To Deposit And/Or Remove Material On A Substrate

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US Patent:
61836117, Feb 6, 2001
Filed:
Jul 17, 1998
Appl. No.:
9/118362
Inventors:
Chiu H. Ting - Saratoga CA
William H. Holtkamp - San Jose CA
Assignee:
CuTek Research, Inc. - San Jose CA
International Classification:
C25B 900
US Classification:
2042751
Abstract:
A fluid containment ring for use in a processing chamber used to deposit a material onto a semiconductor wafer and/or remove material from a wafer by subjecting the wafer to an electric field and an electrolyte is described. The fluid containment ring is located at the base of the processing chamber in close proximity to the outside edge of the wafer being processed in the processing chamber. After each processing step is completed, the used electrolyte is diverted from the processing chamber into the fluid containment ring for containment such that no electrolyte contacts the unprocessed side (or back) of the wafer. One or more drains coupled to the fluid containment ring provide means for disposal and/or recirculation of the electrolyte.

Apparatus And Method Utilizing An Electrode Adapter For Customized Contact Placement On A Wafer

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US Patent:
60224657, Feb 8, 2000
Filed:
Jun 1, 1998
Appl. No.:
9/088319
Inventors:
Chiu H. Ting - Saratoga CA
William H. Holtkamp - San Jose CA
Wen C. Ko - San Jose CA
Assignee:
Cutek Research, Inc. - San Jose CA
International Classification:
C25D 502
US Classification:
205118
Abstract:
An apparatus and method for customizing electrode contact placement on a semiconductor wafer while depositing and/or removing a material on a semiconductor wafer. The present invention is a adapter having at least one opening through which at least one electrode contacts the semiconductor wafer. The adapter may be designed to have multiple openings at specified locations on the adapter, thus allowing multiple electrode contacts with the semiconductor wafer at pre-specified locations. A conductive sheet may couple with the adapter to carry an electrical current from an electrical conductor to the electrode contacts placed within the openings of the adapter.

Integrated Vacuum And Plating Cluster System

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US Patent:
60178205, Jan 25, 2000
Filed:
Jul 17, 1998
Appl. No.:
9/118982
Inventors:
Chiu H. Ting - Saratoga CA
William H. Holtkamp - San Jose CA
Assignee:
Cutek Research, Inc. - San Jose CA
International Classification:
H01L 2144
US Classification:
438689
Abstract:
An apparatus and method for providing an integrated processing system allowing for the isolation of non-compatible processes used to deposit a material onto a semiconductor wafer and/or remove material from a wafer is described. The integrated processing system of the present invention is comprised of a first processing chamber for processing a substrate in a first environment coupled to a second processing chamber for processing a substrate in a second environment. A connecting interface coupled to the first and second processing chambers allows the first and second processing chambers to be isolated from each other as needed. Further, the connecting interface allows a wafer to be transferred from the first processing chamber to the second processing chamber within a controlled environment. The first and second processing chambers may be or may include cluster tools.

Devices Employing A Liquid-Free Medium

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US Patent:
56603975, Aug 26, 1997
Filed:
Sep 23, 1994
Appl. No.:
8/311081
Inventors:
William H. Holtkamp - San Jose CA
International Classification:
F16J 1553
US Classification:
277 80
Abstract:
Devices and methods employ a solid-based medium that serves as a magnetic sealant, a lubricant, a bearing, an electrical or thermal conductor, singly or in combination. Included are devices wherein the solid-based medium is retained in a selected position using a magnetic field. In particular, the solid-based medium is either magnetically coupled to the magnetic field or is contained within a cavity sealed by a magnetic seal. In one group of embodiments, the solid-based medium comprises molecules having a molecular structure wherein one element of the structure is a cage or tube, as in fullerenes or met-cars. Such molecules are particularly useful in all of the devices of the present invention because of their exceptional stability and resilience. These properties ensure good performance in corrosive and/or vacuum environments and over a longer lifetime than is possible with conventional media.
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William L Holtkamp from San Jose, CA, age ~64 Get Report