Wen Jia Zhou

61564087, Dec 5, 2000

Aug 29, 1997

8/920441

Wen Xu Zhou - Schaumburg IL
Daniel Roman Gamota - Palatine IL
Sean Xin Wu - Palatine IL
Karl W. Wyatt - Cary IL
Chowdary Ramesh Koripella - Albuquerque NM

Motorola, Inc. - Schaumburg IL

B32B 310

428131

The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elements, and affixing a reinforcement having apertures to accommodate solder joints to the top surface of the circuit board to facilitate solder attachment of the connection pads to the electronic elements wherein the reinforcement constrains deformation of the circuit board to provide reliable solder joints and facilitates attachment and removal of electronic elements from the circuit board.

60343338, Mar 7, 2000

Nov 21, 1997

8/975720

Andrew F. Skipor - Glendale Heights IL
Daniel Roman Gamota - Palatine IL
Karl W. Wyatt - Cary IL
Wen Xu Zhou - Atlanta GA

Motorola, Inc. - Schaumburg IL

H05K 116

174260

A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34), not in direct contact with the board (14), and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16). The frame (18) is affixed to the printed circuit board (14) within the polymeric encapsulant (16) to provide increased mechanical strength for the microelectronic assembly (10).

57201005, Feb 24, 1998

Dec 29, 1995

8/581695

Andrew F. Skipor - Glendale Heights IL
Daniel Roman Gamota - Palatine IL
Karl W. Wyatt - Cary IL
Wen Xu Zhou - Atlanta GA

Motorola, Inc. - Schaumburg IL

H05K 334

29840

A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34) and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16). The frame (18) is affixed to the printed circuit board (14) within the polymeric encapsulant (16) to provide increased mechanical strength for the microelectronic assembly (10).

58959769, Apr 20, 1999

Jun 3, 1996

8/657216

Michelle J. Morrell - Glen Ellyn IL
Steven C. Machuga - Deisenhofen, DE
Grace M. O'Malley - Hoffman Estates IL
George A. Carson - Elk Grove Village IL
Andrew Skipor - Glendale Heights IL
Wen Xu Zhou - Atlanta GA
Karl W. Wyatt - Cary IL

Motorola Corporation - Schaumburg IL

H01L 2348

257778

A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).