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Vladimir Ivanovich Vaganov

from Los Gatos, CA
Age ~85

Vladimir Vaganov Phones & Addresses

  • 129 El Porton, Los Gatos, CA 95032 (408) 376-3740
  • Cupertino, CA
  • Palm Springs, CA
  • Jersey City, NJ
  • Santa Clara, CA
  • Campbell, CA
  • 129 El Porton, Los Gatos, CA 95032 (562) 981-7420

Work

Company: Siantis Position: Chief executive officer

Education

Degree: Graduate or professional degree

Industries

Consumer Electronics

Resumes

Resumes

Vladimir Vaganov Photo 1

Chief Executive Officer

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Location:
Los Gatos, CA
Industry:
Consumer Electronics
Work:
Siantis
Chief Executive Officer

Business Records

Name / Title
Company / Classification
Phones & Addresses
Vladimir Vaganov
Principal, President
SIANTIS INC
Business Services at Non-Commercial Site
129 El Porton, Los Gatos, CA 95032
Vladimir Vaganov
Ecotech International LLC
Consulting and Ip Development · Ip Development and Consulting · Business Services at Non-Commercial Site · Nonclassifiable Establishments
129 El Porton, Los Gatos, CA 95032
Vladimir Vaganov
President, President, Secretary, Treasurer
MEGASENSE
Semiconductor and Related Device Manufacturing
1215 Bordeau Dr, Sunnyvale, CA 94089
1215 Bordeaux Dr, Sunnyvale, CA 94089
(408) 400-9700

Publications

Us Patents

Optical Switch

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US Patent:
6577793, Jun 10, 2003
Filed:
Jun 27, 2001
Appl. No.:
09/893308
Inventors:
Vladimir I. Vaganov - Los Gatos CA
Assignee:
MegaSense, Inc. - Los Gatos CA
International Classification:
G02B 642
US Classification:
385 52, 385 16, 385 31, 385 32, 385 17
Abstract:
An optical switch includes a plurality of transmitting devices with a plurality of optical fibers that each have a distal end. A plurality of focusing devices are included. Each distal end of a fiber is coupled to at least one focusing device. A plurality of receiving devices are provided. At least a portion of the distal ends of the optical fibers move in three orthogonal and at least two angular dimensions to direct output beams from the plurality of transmitting devices to the plurality of receiving devices.

Voa With A Movable Focusing Mirror

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US Patent:
6590697, Jul 8, 2003
Filed:
Oct 4, 2001
Appl. No.:
09/973169
Inventors:
Vladimir I. Vaganov - Los Gatos CA
Assignee:
Megasense - Sunnyvale CA
International Classification:
G02B 2600
US Classification:
359296, 359290, 359627
Abstract:
A variable optical attenuator, or VOA, includes a movable focusing mirror and an actuator integrated on a substrate or within a MEMS. The actuator moves the mirror within a range of motion to reflect, focus and steer a light beam. One embodiment further includes an input and an output photonic component, such as wave guides or optical fibers. The wave guides or optical fibers may have angled endfaces and be positioned to reduce the required operating range of motion of the mirror. The mirror may be a Fresnel mirror, a concave mirror, a diffractive mirror or a concave diffractive mirror. In certain embodiments the mirror is moved in at least two dimensions to steer the light beam to form a trajectory having at least two dimensions.

Voa Device And Attenuation Method With Improved Linearity

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US Patent:
6628882, Sep 30, 2003
Filed:
Sep 13, 2001
Appl. No.:
09/951859
Inventors:
Vladimir I. Vaganov - Los Gatos CA
Sebastiaan R. Int Hout - San Jose CA
Assignee:
MegaSense, Inc. - Sunnyvale CA
International Classification:
G02B 600
US Classification:
385140
Abstract:
A variable optical attenuator, or VOA, for attenuating an optical signal between two photonic components by changing an alignment of a light beam with an output photonic component in at least two dimensions. A first configuration of the invented VOA has an actuator and two optical fibers. The actuator moves one optical fiber to form a light beam trajectory on the remaining optical fiber, wherein the shape of the trajectory has at least two separate dimensional components. A second configuration of the invented VOA includes a mirror that the actuator moves within at least two degrees of freedom and thereby forms a two-dimensional trajectory of the reflected light beam on a photonic component. A third embodiment includes a mirror, a mirror actuator and a dual fiber collimator having a lens and two optical fibers. The VOA may be partially or wholly integrated on a substrate and/or incorporated as a MEMS-based device.

Rolling Mirror Apparatus And Method Of Use

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US Patent:
6700688, Mar 2, 2004
Filed:
Aug 24, 2001
Appl. No.:
09/939317
Inventors:
Vladimir Vaganov - Los Gatos CA
Assignee:
MegaSense, Inc. - Sunnyvale CA
International Classification:
G02B 2608
US Classification:
359223, 359871
Abstract:
A rolling micromirror is disclosed which comprises a micromirror guided in movement by a reference surface. The micromirror is suspended adjacent to the reference surface by a suspension element. An actuator moves the micromirror in relationship with a control signal. The suspension element provides a restoring force that returns the micromirror to an initial position when the actuator applies less than a minimal force to the micromirror. The micromirror optionally includes a stationary or movable pivot point about which the micromirror rotates and tilts. The preferred embodiment is integrated on a single substrate and is a micro-electro-mechanical device.

Method For Fabricating Microstructures With Deep Anisotropic Etching Of Thick Silicon Wafers

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US Patent:
6787052, Sep 7, 2004
Filed:
Jun 19, 2000
Appl. No.:
09/596837
Inventors:
Vladimir Vaganov - Los Gatos CA, 95032
International Classification:
C23F 100
US Classification:
216 57, 216 79, 216 99, 438704
Abstract:
A method for fabricating semiconductor microstructures with a combination of etching steps, i. e. local RIE, isotropic, etc. followed by deep anisotropic etching.

Three-Axis Integrated Mems Accelerometer

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US Patent:
7318349, Jan 15, 2008
Filed:
Jun 4, 2005
Appl. No.:
11/160004
Inventors:
Vladimir Vaganov - Los Gatos CA, US
Nickolai Belov - Los Gatos CA, US
International Classification:
G01P 15/08
US Classification:
7351433, 7351438
Abstract:
3D accelerometer for measuring three components of inertial force (or acceleration) vector with respect to an orthogonal coordinate system, which has high sensitivity due to a big proof mass located within a cavity beneath the surface of the sensor die. The size of the cavity and the size of the proof mass exceed the corresponding overall dimensions of the elastic element. The sensor structure occupies a very small area at the surface of the die increasing the area for ICs need to be integrated on the same chip.

System And Method For A Three-Axis Mems Accelerometer

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US Patent:
7367232, May 6, 2008
Filed:
Jan 24, 2005
Appl. No.:
11/042721
Inventors:
Vladimir Vaganov - Los Gatos CA, US
Nickolai Belov - Los Gatos CA, US
International Classification:
G01P 15/12
US Classification:
7351433
Abstract:
A system and method for inputting motion measurement data into a computationally based device are provided. In a first version three-axis accelerometer determines components of an inertial force vector with respect to an orthogonal coordinate system. The accelerometer includes a sensor die made of a semiconductor substrate having a frame element, a proof mass element, and an elastic element mechanically coupling the frame and the proof mass. The accelerometer also has three or more stress-sensitive IC components integrated into the elastic element adjacent to the frame element for electrical connectivity without metal conductor traversal of the elastic element.

Semiconductor Input Control Device

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US Patent:
7476952, Jan 13, 2009
Filed:
May 21, 2007
Appl. No.:
11/804954
Inventors:
Vladimir Vaganov - Los Gatos CA, US
Nickolai Belov - Los Gatos CA, US
International Classification:
H01L 23/04
H01L 23/48
H01L 23/52
H01L 23/28
US Classification:
257415, 257730, 257778, 257787, 257E23123, 257E23124
Abstract:
A force input control device suitable for high-volume applications such as cell phones, portable gaming devices and other handheld electronic devices is disclosed. The device comprises a force sensor die formed within semiconductor substrate and containing a force sensor providing electrical output signal in response to applied external force, connection elements for either flip chip mounting or wire bonding. Signal conditioning and processing integrated circuit is integrated within the device. A package enclosing at least a portion of the force sensor die and comprising a force-transferring element coupled to the sensor die for transferring an external force to the force sensor die. A button, which has multiple ergonomical designs, is mechanically coupled to the force-transferring element of the package for providing an interface with the external force.
Vladimir Ivanovich Vaganov from Los Gatos, CA, age ~85 Get Report