Search

Vicente D Alcaria

from Manteca, CA
Age ~66

Vicente Alcaria Phones & Addresses

  • 2484 Donatello St, Manteca, CA 95337 (209) 825-7450
  • 2489 Donatello St, Manteca, CA 95337
  • 2680 Lancaster Dr, San Pablo, CA 94806
  • Milpitas, CA
  • Fremont, CA
  • Capitola, CA
  • San Joaquin, CA

Business Records

Name / Title
Company / Classification
Phones & Addresses
Vicente Alcaria
Principal
Reina Alcaria
Communication Services
2484 Donatello St, Manteca, CA 95337

Publications

Us Patents

Micro Grid Array Semiconductor Die Package

View page
US Patent:
6734546, May 11, 2004
Filed:
Feb 26, 2002
Appl. No.:
10/082174
Inventors:
Vicente D. Alcaria - Richmond CA
Myoung-Soo Jeon - Fremont CA
Assignee:
Silicon Bandwidth, Inc. - San Jose CA
International Classification:
H01L 2348
US Classification:
257692, 257704, 257720
Abstract:
A micro grid array semiconductor die package includes a housing defining a cavity for holding at least one semiconductor die, said housing including a plurality of insulative side walls, each of said side walls having a bottom surface and an interior wall including a top surface, and an end plate joined to said side walls; and a plurality of substantially straight conductive leads extending through at least one of said side walls, each of said conductive leads including an internal lead section extending into the cavity from the top surface of the interior wall and a external lead section extending externally from said at least one bottom surface of said side wall.

Packaged Semiconductor Device For Radio Frequency Shielding

View page
US Patent:
6847115, Jan 25, 2005
Filed:
Sep 6, 2001
Appl. No.:
09/946553
Inventors:
Myoung-Soo Jeon - Fremont CA, US
Vicente D. Alcaria - Richmond CA, US
Assignee:
Silicon Bandwidth Inc. - Fremont CA
International Classification:
H05K 900
H01L 2904
US Classification:
257728, 257664, 257659, 257704, 257710, 257729, 257730, 257691, 257698, 257660, 257787, 257676, 257675, 257712, 257713, 361403, 361424, 361816, 361818, 174 35 R
Abstract:
A packaged semiconductor device that is fabricated with a plurality of conductive leads defined in a strip that beneficially includes a radio frequency shield box. The conductive contacts are located in a housing, beneficially by insert molding or by sandwiching between a bottom piece and a top piece. The housing can further include a cavity that receives a semiconductor device, and the radio frequency shield can receive another semiconductor device. Bonding conductors electrically connect at least one semiconductor device to another semiconductor device and/or to the conductive contacts. A conductive cover is disposed over the housing. The cavity beneficially includes a beveled wall and the conductive leads and the radio frequency shield are beneficially comprised of copper.

Semiconductor Package

View page
US Patent:
20030042596, Mar 6, 2003
Filed:
Sep 6, 2001
Appl. No.:
09/946682
Inventors:
Stanford Crane - Santa Clara CA, US
Myoung-Soo Jeon - Fremont CA, US
Vicente Alcaria - Richmond CA, US
International Classification:
H01L023/48
US Classification:
257/690000, 257/678000, 257/723000, 257/728000
Abstract:
A semiconductor package having a molded body and a plurality of conductive pins that extend from the bottom of the molded body. The semiconductor package further includes a RF shield around a protected cavity that holds a first integrated circuit. The molded body can further include an unprotected plastic cavity for holding a second integrated circuit. The conductive pins form bonding pads that are used to electrically interconnect the first and second semiconductor devices to the external environment. A cover, beneficially comprised of copper, is disposed over the molded body. The plastic cavity beneficially includes a beveled wall that improves the routing of electrical conductors between the first integrated circuit and the second integrated circuit.

Flex Circuit Package

View page
US Patent:
20040042183, Mar 4, 2004
Filed:
Sep 4, 2002
Appl. No.:
10/233624
Inventors:
Vicente Alcaria - Manteca CA, US
Stanford Crane - San Jose CA, US
International Classification:
H05K005/00
H05K005/04
H05K005/06
US Classification:
361/752000
Abstract:
A device package having flexible leads on a flex circuit that is insert molded into a housing. The device package includes a die attach area within the housing. The flexible leads include external ends for connecting to an external circuit and internal ends for wire bonding to a device die on the die attach area. The housing includes walls that surround the die attach area such that a device die on the die attach area can be sealed with an encapsulant. The device package is beneficially implemented in a handling frame having frame members with break tabs that are insert molded to the device package. The break tabs enable easy separation of a device package from the handling frame. The handling frames are beneficially formed into an assembly chain.
Vicente D Alcaria from Manteca, CA, age ~66 Get Report