Inventors:
Myoung-Soo Jeon - Fremont CA, US
Vicente D. Alcaria - Richmond CA, US
Assignee:
Silicon Bandwidth Inc. - Fremont CA
International Classification:
H05K 900
H01L 2904
US Classification:
257728, 257664, 257659, 257704, 257710, 257729, 257730, 257691, 257698, 257660, 257787, 257676, 257675, 257712, 257713, 361403, 361424, 361816, 361818, 174 35 R
Abstract:
A packaged semiconductor device that is fabricated with a plurality of conductive leads defined in a strip that beneficially includes a radio frequency shield box. The conductive contacts are located in a housing, beneficially by insert molding or by sandwiching between a bottom piece and a top piece. The housing can further include a cavity that receives a semiconductor device, and the radio frequency shield can receive another semiconductor device. Bonding conductors electrically connect at least one semiconductor device to another semiconductor device and/or to the conductive contacts. A conductive cover is disposed over the housing. The cavity beneficially includes a beveled wall and the conductive leads and the radio frequency shield are beneficially comprised of copper.