Uwe Hermes from 11707 SW 19Th Ave, Portland, OR 97219, age 51

Resumes

President

View page

Location:

Portland, OR

Industry:

Semiconductors

Work:

Memc Electronic Materials
Automation Engineer
Compview Medical Oct 2010 - May 2011
Director of International Services
Hermes Bros Oct 2010 - May 2011
President
Sole Proprietor Mar 2009 - Nov 2010
Consultant
Nds Surgical Imaging Aug 2008 - Feb 2009
Product Manager

Education:

Portland State University Sep 1999 - Apr 2001
Master of Business Administration, Masters, Management Portland State University Aug 1996 - Sep 1997
Master of Science, Masters, Physics University of Konstanz Oct 1993 - 1996
Bachelors, Bachelor of Science, Mathematics, Physics

Skills:

Product Development
Product Management
Product Marketing
Cross Functional Team Leadership
Project Management
Management
Program Management
Marketing
Sales
Medical Devices
New Business Development
Start Ups
Market Analysis
Account Management
Marketing Strategy
Medical Imaging
Channel Partners
Business Development
Software Development

Uwe Hermes

View page

Business Records

Name / Title

Company / Classification

Phones & Addresses

Uwe Hermes
Member

Hermes Bros LLC
Contractors - General

2267 NW Overton St APT B, Portland, OR 97210
(503) 662-8345

Uwe Hermes
Principal

Hermes Bros. LLC
Real Estate · Business Services at Non-Commercial Site · Nonclassifiable Establishments · Architect · Home Builders · Interior Designers · Property Management · Real Estate Agents

2267 NW Overton St SUITE B, Portland, OR 97210
2267 NW Overton St Apt B, Portland, OR 97210
(503) 662-8345

Publications

Us Patents

Method And Device For Measuring The Diffusion Length Of Minority Carriers In A Semiconductor Sample

View page

US Patent:

20050237080, Oct 27, 2005

Filed:

May 15, 2003

Appl. No.:

10/514665

Inventors:

Uwe Hermes - Portland OR, US

International Classification:

G01R031/26

US Classification:

324766000, 324752000

Abstract:

It is the goal of the invention to provide an improved method and an improved apparatus to measure the diffusion length of minority charge carriers in semiconductors. In particular, the method should be easy to implement. The method should yield higher measurement accuracy. The data analysis should be easy. The apparatus should be easy to use. This goal is achieved using the following procedure steps: Application of periodically alternating light of different wavelengths (λ) to the semiconductor sample (); Detection of the surface potential modulation caused by the application of the light, Adjustment of at least one of the light intensities (I) in such a manner that the surface potential modulation disappears; and Determination of the diffusion length (L) of the minority charge carriers from the adjusted light intensities. An apparatus consists of a first and a second monochromatic light source () with different wavelengths (λ), means () to periodically apply the light of the first and second light source () to the sample (), means () to detect the surface potential of the sample (), means () to detect the modulation of the surface potential of the sample, means () to adjust the intensity of the light of at least one of the light sources () in such a manner that the modulation of the surface potential disappears and means to determine the diffusion length (L) of the minority charge carriers from the adjusted light intensities of the first and second light source.

Methods And System For Controlling A Surface Profile Of A Wafer

View page

US Patent:

20190270222, Sep 5, 2019

Filed:

May 16, 2019

Appl. No.:

16/414238

Inventors:

- Hsinchu, TW
Carlos Zavattari - Varallo Pombia, IT
Sumeet S. Bhagavat - St. Charles MO, US
Vandan Tanna - O'Fallon MO, US
Uwe Hermes - Portland OR, US

International Classification:

B28D 5/00
B28D 1/00
B23D 57/00
G05B 19/402
G05B 19/042
B28D 5/04

Abstract:

Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. Based on the measured amount of displacement of the sidewall, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.

Methods And System For Controlling A Surface Profile Of A Wafer

View page

US Patent:

20180056545, Mar 1, 2018

Filed:

Aug 25, 2016

Appl. No.:

15/247099

Inventors:

- Singapore, SG
Carlo Zavattari - Varallo Pombia, IT
Sumeet S. Bhagavat - St. Charles MO, US
Vandan Tanna - O'Fallon MO, US
Uwe Hermes - Portland OR, US

International Classification:

B28D 5/00
B28D 5/04
G05B 19/042
G05B 19/29

Abstract:

Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. The measured amount of displacement of the sidewall is stored as displacement data. Based on the stored data, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.

Videos & Images