Uldis Artis Ziemins

6343974, Feb 5, 2002

Jun 26, 2000

09/603684

Raymond Khoury - Wappingers Falls NY
Jose M. Ocasio - Maybrook NY
Uldis A. Ziemins - Poughkeepsie NY

International Business Machines Corporation - Armonk NY

B24B 4900

451 9, 451 6, 451 10, 451 11, 451 56, 451443

A conditioning tool including a rotary conditioning pad; a lower shaft attached to the conditioning pad; an upper shaft having an upper end and a lower end, the lower end attached to the lower shaft via a flexible coupling; and a motor attached to the upper end of the upper shaft and adapted to rotate the shaft. The tool further includes a mechanism for measuring an angle of the conditioning pad relative to a reference plane. The conditioning tool may further include a conditioning arm, various control mechanisms, and a controller for receiving feedback from the angle measuring mechanism and the various control mechanisms and for controlling the various control mechanisms in response to the feedback. A chemical-mechanical polishing apparatus and a conditioning method for providing a uniform polishing surface of a chemical-mechanical polishing pad are also disclosed.

6467120, Oct 22, 2002

Sep 8, 1999

09/391439

Uldis Artis Ziemins - Poughkeepsie NY
Jose M. Ocasio - Maybrook NY
Raymond M. Khoury - Wappingers Falls NY
David Goodwin - Hyde Park NY

International Business Machines Corporation - Armonk NY

B08B 1100

15102, 15 971, 15 883

A wafer cleaning brush roller having uniform and non-uniform protrusions via compression. The protrusions are formed by an inner PVA sponge compressed through an outer sleeve formed of a resilient mesh that does not react with DI water or other CMP surfactants. Directional channeling of DI water is also provided to the protrusions. Edge cleaning of the wafer as accomplished by having a thicker brush extension at each end where the wafers edge would rub and provide added cleaning capability.

6620029, Sep 16, 2003

Jan 30, 2002

10/059775

Raymond M. Khoury - Wappingers Falls NY
Jose M. Ocasio - Maybrook NY
Uldis A. Ziemins - Poughkeepsie NY

International Business Machines Corporation - Armonk NY

B24B 100

451 6, 451 41, 451 67, 451242, 451285, 451398, 451443

An apparatus for performing semiconductor planarizing operations is disclosed. In an exemplary embodiment, the apparatus includes a carrier assembly for maintaining a workpiece therein in a face up orientation. A roller assembly includes a first cylindrical roller and a cylindrical second roller, the first and second rollers being linked to one another through a pair of arms. Each of the first and second rollers may be independently positioned with respect to a horizontal plane, the horizontal plane being substantially parallel to a top surface of the workpiece.

6622334, Sep 23, 2003

Mar 29, 2000

09/537206

Uldis A. Ziemins - Poughkeepsie NY
Donald J. Delehanty - Wappingers Falls NY
Raymond M. Khoury - Wappingers Falls NY
Jose M. Ocasio - Maybrook NY

International Business Machines Corporation - Armonk NY

B01B 1102

15 77, 15 971, 15 883, 15 882

An improvement is disclosed in a brush cleaning apparatus for cleaning a major surface of a wafer and including wafer guide wheels for transporting the wafer. The improvement includes a polish pad material disposed on a circumference of the guide wheels. The polish pad material is a material used in chemical-mechanical polishing of the wafer. The polish pad material contacts an edge portion of the wafer during cleaning thereof, thereby removing contaminants from the edge portion of the wafer, so that edge cleaning is performed in situ in addition to the brush cleaning of the major surface of the wafer.

6836329, Dec 28, 2004

Jul 9, 2003

10/604303

Uldis A. Ziemins - Poughkeepsie NY
Ray A. Reyes - New Windsor NY
David L. Schmoke - Verbank NY

International Business Machines Corporation - Armonk NY

G01B 1100

356399, 356615

An apparatus and method to align an invisible light beam sensor, such as an IR sensor, utilizing a visible light beam such as a visible LED or HeNe laser, and provide the ability to visually monitor when the sensor needs adjustment in real time and avoid off line adjustments. Various embodiments synchronize and position both the invisible light beam and the visible light beam to travel the same path to a common desired location.

6837777, Jan 4, 2005

Jun 30, 2003

10/610098

Uldis A. Ziemins - Poughkeepsie NY, US
Donald J. Delehanty - Wappingers Falls NY, US
Raymond M. Khoury - Wappingers Falls NY, US
Jose M. Ocasio - Maybrook NY, US

International Business Machines Corporation - Armonk NY

B24B 100
B08B 104

451 44, 451 57, 15 77, 15 881

An improvement is disclosed in a brush cleaning apparatus for cleaning a major surface of a wafer and including wafer guide wheels for transporting the wafer. The improvement includes a polish pad material disposed on a circumference of the guide wheels. The polish pad material is a material used in chemical-mechanical polishing of the wafer. The polish pad material contacts an edge portion of the wafer during cleaning thereof, thereby removing contaminants from the edge portion of the wafer, so that edge cleaning is performed in situ in addition to the brush cleaning of the major surface of the wafer.

6857434, Feb 22, 2005

Jan 24, 2002

10/056387

Kwong Hon Wong - Wappingers Falls NY, US
Karl E. Boggs - Hopewell Junction NY, US
Raphael Mitchell - Pine Bush NY, US
Uldis A. Ziemins - Poughkeepsie NY, US

International Business Machines Corporation - Armonk NY

C25F005/00

134 13, 438693

A method and structure polishes and cleans silicon wafers by mixing a marker with a slurry to form a slurry mixture, performs chemical mechanical polishing on a silicon wafer using the slurry mixture, rinses the slurry mixture from the silicon wafer, checks the silicon wafer for marker residue, and repeats the rinsing process if the checking process detects the marker residue on the wafer.

7103458, Sep 5, 2006

Apr 29, 2004

10/709351

Philip L. Campbell - Millbrook NY, US
Francis F. Szenher - Fishkill NY, US
Uldis A. Ziemins - Poughkeepsie NY, US

International Business Machines Corporation - Armonk NY

H04B 1/69
G06F 19/00

701 23, 375130

Communication between a controller and a set of automated vehicles is improved by use of an RF link that employs a high frequency spread spectrum modem that establishes a low noise link in a high noise industrial environment and also shares the relevant frequency range with a wireless telephone system.