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Troy Girrens Phones & Addresses

  • 23422 S Moonlight Rd, Spring Hill, KS 66083 (913) 547-4248
  • Shawnee, KS
  • 119 Kingston Rd, Kokomo, IN 46901 (765) 457-4378
  • 2105 Justice Ln, Kokomo, IN 46902 (765) 455-1538
  • 18415 W 193Rd St, Spring Hill, KS 66083 (765) 455-1538

Work

Company: Honeywell Mar 2018 Position: Senior technical manager

Education

Degree: Bachelors, Bachelor of Science School / High School: Wichita State University 1989 to 1990 Specialities: Electrical Engineering

Skills

Manufacturing • Value Stream Mapping • Manufacturing Engineering • Spc • Lean Manufacturing • Continuous Improvement • Six Sigma • Fmea • Root Cause Analysis • Manufacturing Operations Management • Process Improvement • Engineering • Operational Excellence • 5S • Dmaic • Engineering Management • Design of Experiments • Ppap • Kaizen • Electronics • Quality Management • Process Engineering • Dfmea • Design For Manufacturing • Manufacturing Operations • Toyota Production System • Ts16949 • Kanban • Automotive • Apqp • Iso • Gd&T • Quality System • Supplier Quality • Green Belt • Poka Yoke • Pfmea • Process Capability • Electronics Manufacturing • Smt • Jit • Iso/Ts 16949 • Industrial Engineering • Qs9000 • Geometric Dimensioning and Tolerancing • Iso Standards

Ranks

Certificate: Six Sigma Green Belt

Industries

Electrical/Electronic Manufacturing

Resumes

Resumes

Troy Girrens Photo 1

Senior Technical Manager

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Location:
Newton, KS
Industry:
Electrical/Electronic Manufacturing
Work:
Honeywell
Senior Technical Manager

Fairbanks Scales Dec 2015 - Jan 2018
Vice President of Manufacturing

Ec Manufacturing Sep 2012 - Dec 2015
Director of Manufacturing

Castle Creations Inc. Dec 2010 - Aug 2012
Director of Facilities and Manufactring

Delphi Oct 1, 1990 - Nov 1, 2010
Advanced Manufacturing Engineer
Education:
Wichita State University 1989 - 1990
Bachelors, Bachelor of Science, Electrical Engineering
Newton High School
Newton Senior High
Skills:
Manufacturing
Value Stream Mapping
Manufacturing Engineering
Spc
Lean Manufacturing
Continuous Improvement
Six Sigma
Fmea
Root Cause Analysis
Manufacturing Operations Management
Process Improvement
Engineering
Operational Excellence
5S
Dmaic
Engineering Management
Design of Experiments
Ppap
Kaizen
Electronics
Quality Management
Process Engineering
Dfmea
Design For Manufacturing
Manufacturing Operations
Toyota Production System
Ts16949
Kanban
Automotive
Apqp
Iso
Gd&T
Quality System
Supplier Quality
Green Belt
Poka Yoke
Pfmea
Process Capability
Electronics Manufacturing
Smt
Jit
Iso/Ts 16949
Industrial Engineering
Qs9000
Geometric Dimensioning and Tolerancing
Iso Standards
Certifications:
Six Sigma Green Belt

Publications

Us Patents

Circuit Board Assembly With Ic Device Mounted Thereto

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US Patent:
61543640, Nov 28, 2000
Filed:
Nov 19, 1998
Appl. No.:
9/197093
Inventors:
Troy M. Girrens - Kokomo IN
Robert Gordon Fessenden - Kokomo IN
Dianne K. Ruch - Rochester IN
Thomas P. Douglas - Kokomo IN
Timothy J. Guse - Kokomo IN
Billy R. Colwell - Greentown IN
Sidney T. Faulkner - Kokomo IN
Assignee:
Delco Electronics Corp. - Kokomo IN
International Classification:
H05K 720
US Classification:
361704
Abstract:
A process and circuit board assembly by which a single soldering operation produces a multicomponent stack capable of dissipating heat from a power IC chip (12) mounted to a substrate (10). The circuit board assembly generally includes a number of conductors (16) on the substrate (10), with the conductors (16) being spaced apart and substantially parallel to each other. A heat spreader (14) is soldered to at least some of the conductors (16), and the chip (12) is soldered to the heat spreader (14). With this structure, heat is conducted from the chip (12) through the heat spreader (14) and conductors (16) to the substrate (10). To maintain proper orientation of the components (12, 14, 16) relative to each other during a single soldering operation, the components (12, 14, 16) are equipped with complementary features.
Troy M Girrens from Spring Hill, KS, age ~58 Get Report