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Timothy S Chamberlin

from Underhill, VT
Age ~55
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Also known as:
Timothy S Chamberlain, Timothy S Chamberlian, Tim Chamberlin, Timo Chamberlin
Phone and address:
28 Chamberlin Woods, Underhill Flats, VT 05489
(802) 899-5420
Related to:
Anne T Mackenzie
Connected to:
Aeriel M Chambers, 33Aleshia Chambers, 37Alethia M Chambers, 50Alissa S Chamberlain, 55Allen C Chamberlain, 43Alyce A Chamberlain, 62Amanda L Chamberland, 40Amy D Chamberlin, 52Amy Chambers, 43Angelic L Chambers, 49

Timothy Chamberlin Phones & Addresses

  • 28 Chamberlin Woods, Underhill, VT 05489 (802) 899-5420
  • 105 River Rd, Underhill, VT 05489 (802) 899-5420
  • Fairfax, VT
  • Cambridge, VT

Work

Company: Chamberlin's garden & farm market 2011 Position: Stage equipment assistant, and videographer for special events

Education

School / High School: Vermont Technical College- Randolph Center, VT May 1988 Specialities: Associates in Electrical & Electronics Engineering Technology

Resumes

Resumes

Timothy Chamberlin Photo 1

Timothy Chamberlin

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Timothy Chamberlin Photo 2

Timothy Chamberlin

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Timothy Chamberlin Photo 3

Timothy Chamberlin

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Location:
United States
Timothy Chamberlin Photo 4

Timothy Chamberlin Underhill, VT

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Work:
Chamberlin's Garden & Farm Market

2011 to 2000
Stage equipment assistant, and videographer for special events
Spare Time Video

2007 to 2000
Videographer and editor for weddings and special events
IBM Microelectronics

May 1988 to 2000
Process technician for Metal Etch, Metal Sputter, Research & Development
Chamberlin's Garden & Farm Market

1980 to 2000
Farm Hand
Greenmont Lumber

1985 to 1986
General Sawmill Laborer
Greenmont Lumber

1985 to 1986
Station attendant & minor auto repair mechanic
Education:
Vermont Technical College
Randolph Center, VT
May 1988
Associates in Electrical & Electronics Engineering Technology
Mount Mansfield Union High School
Jericho, VT
Jun 1986
Timothy Chamberlin Photo 5

Timothy Chamberlin

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Location:
United States

Business Records

Name / Title
Company / Classification
Phones & Addresses
Timothy J. Chamberlin
CHAMBERLIN CPA SERVICES, INC
Timothy Chamberlin
THE ENGELMAN AGENCY, INC

Publications

Us Patents

Slurry And Use Thereof For Polishing

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US Patent:
7052625, May 30, 2006
Filed:
Mar 28, 2001
Appl. No.:
09/819787
Inventors:
Timothy Scott Chamberlin - Fairfax VT, US
Michael J. MacDonald - Yorktown Heights NY, US
Mark P. Murray - Burlington VT, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B44C 1/22
US Classification:
216 88, 216 89, 438693, 252 791, 252 794
Abstract:
A slurry containing abrasive particles, an oxidizing agent having a low static etch rate on at least one acid or salt metal, and having a pH of about 5 to about 11 is especially useful for polishing surfaces, including both metal and silicon dioxide, such as present in microelectronics, at the same or substantially the same polishing rates.

Polish Pad Conditioner With Radial Compensation

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US Patent:
57855854, Jul 28, 1998
Filed:
Sep 18, 1995
Appl. No.:
8/529823
Inventors:
Paul Anthony Manfredi - Waterbury VT
Richard Alan Bartley - Newburgh NY
Raymond George Morris - Essex Junction VT
Timothy Scott Chamberlin - Fairfax VT
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B24B 500
US Classification:
451288
Abstract:
An apparatus for and method of conditioning a polishing pad suitable for in-situ use, is described. The apparatus consists of a wedge-shaped conditioning plate whose width varies as a function of its length and whose exact geometry is a function of the radial effects of the polishing process effecting conditioning of the polishing pad. The conditioning plate rests on the polishing pad and is surrounded by a loose-fitting frame that holds the conditioning plate stationary with respect to the rotating polishing table, preventing lateral movement of the conditioning plate, but allowing the plate to move in the vertical direction so that it can rest flat on the polishing pad. The bottom face of the conditioning plate has a roughened surface that serves to abrade the polishing pad and conditions it to an extent determined ostensibly by the downward force of the conditioning plate on the polishing pad, the roughness of the bottom surface of the conditioning plate, and the time the conditioning plate is in contact with the polishing pad surface.

Slurry Injection Technique For Chemical-Mechanical Polishing

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US Patent:
59973927, Dec 7, 1999
Filed:
Jul 22, 1997
Appl. No.:
8/898063
Inventors:
Timothy S. Chamberlin - Fairfax VT
Matthew K. Miller - Burlington VT
Erick G. Walton - So. Burlington VT
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B24B 5700
US Classification:
451446
Abstract:
An apparatus for polishing a semiconductor wafer is provided comprising a wafer carrier to provide a force against a wafer and a rotating polishing pad during the polishing operation and a polishing slurry distributor device disposed to provide a spray of the slurry on the polishing pad. The wafer is polished using less slurry than a conventional polishing apparatus while still maintaining the polishing rates and polishing uniformity of the prior art polishing apparatus. A preferred spraying means is a closed elongated tube having a plurality of openings which tube is positioned over at least one-half the diameter of the polishing pad and a polishing slurry under pressure is directed onto the surface of the pad, preferably in a substantially transverse spray stream.
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Timothy S Chamberlin from Underhill, VT, age ~55 Get Report