Inventors:
- Santa Clara CA, US
Juan DOMINGUEZ - Chandler AZ, US
Ankur AGRAWAL - Chandler AZ, US
Kenneth BROWN - Tempe AZ, US
Yi LI - Chandler AZ, US
Jing CHEN - Chandler AZ, US
Aditi MALLIK - Cupertino CA, US
Xiaoyu HONG - Fremont CA, US
Thomas LILJEBERG - San Jose CA, US
Andrew C. ALDUINO - San Jose CA, US
Ling LIAO - Fremont CA, US
David HUI - Santa Clara CA, US
Harinadh POTLURI - Milpitas CA, US
Hari MAHALINGAM - San Jose CA, US
Lobna KAMYAB - San Jose CA, US
Sasanka KANUPARTHI - Fremont CA, US
Sushrutha Reddy GUJJULA - Chandler AZ, US
Saeed FATHOLOLOUMI - Los Gatos CA, US
Priyanka DOBRIYAL - Santa Clara CA, US
Boping XIE - San Ramon CA, US
Abiola AWUJOOLA - Pleasanton CA, US
Vladimir TAMARKIN - Huntingdon Valley PA, US
Keith MEASE - Gibbstown NJ, US
Stephen KEELE - Allentown PA, US
David SCHWEITZER - Collegeville PA, US
Brent ROTHERMEL - Barto PA, US
Ning TANG - Santa Clara CA, US
Suresh POTHUKUCHI - Chandler AZ, US
Srikant NEKKANTY - Chandler AZ, US
Zhichao ZHANG - Chandler AZ, US
Kaiyuan ZENG - Santa Clara CA, US
Baikuan WANG - Folsom CA, US
Donald TRAN - Phoenix AZ, US
Ravindranath MAHAJAN - Chandler AZ, US
Baris BICEN - Chandler AZ, US
Grant SMITH - Bryn Athyn PA, US
International Classification:
H01L 25/18
H01L 23/473
H01R 12/71
Abstract:
Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.