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Thomas R Homa

from Binghamton, NY
Age ~82

Thomas Homa Phones & Addresses

  • 432 Crocker Hill Rd, Binghamton, NY 13904 (607) 723-2207
  • 490 Crocker Hill Rd, Binghamton, NY 13904 (607) 723-2207
  • Endicott, NY
  • Ithaca, NY

Education

Degree: Graduate or professional degree

Professional Records

Medicine Doctors

Thomas Homa Photo 1

Thomas P. Homa

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Specialties:
Pediatrics, Adolescent Medicine
Work:
Pediatric Healthcare Associates
2600 Post Rd STE 1, Southport, CT 06890
(203) 452-8322 (phone), (203) 254-0358 (fax)

Pediatric Healthcare Associates
15 Corporate Dr, Trumbull, CT 06611
(203) 452-8322 (phone), (203) 452-8326 (fax)
Education:
Medical School
New York Medical College
Graduated: 1995
Procedures:
Destruction of Benign/Premalignant Skin Lesions
Hearing Evaluation
Psychological and Neuropsychological Tests
Pulmonary Function Tests
Vaccine Administration
Conditions:
Abdominal Hernia
Acute Pharyngitis
Acute Upper Respiratory Tract Infections
Attention Deficit Disorder (ADD)
Autism
Languages:
English
Spanish
Description:
Dr. Homa graduated from the New York Medical College in 1995. He works in Southport, CT and 1 other location and specializes in Pediatrics and Adolescent Medicine. Dr. Homa is affiliated with Bridgeport Hospital and St Vincents Medical Center.

Publications

Us Patents

Extension Of Fatigue Life For C4 Solder Ball To Chip Connection

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US Patent:
7119003, Oct 10, 2006
Filed:
Jun 8, 2005
Appl. No.:
11/148923
Inventors:
William E. Bernier - Endwell NY, US
Charles F. Carey - Endicott NY, US
Eberhard B. Gramatzki - Essex Junction VT, US
Thomas R. Homa - Binghamton NY, US
Eric A. Johnson - Greene NY, US
Pierre Langevin - Granby, CA
Irving Memis - Vestal NY, US
Son K. Tran - Endwell NY, US
Robert F. White - Essex Junction VT, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 21/44
US Classification:
438612, 257E21509
Abstract:
A method and structure for coupling a semiconductor substrate (e. g. , a semiconductor chip) to an organic substrate (e. g. , a chip carrier). The coupling interfaces a solder member (e. g. , a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0. 25 mm.

Extension Of Fatigue Life For C4 Solder Ball To Chip Connection

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US Patent:
20020195707, Dec 26, 2002
Filed:
Jun 20, 2001
Appl. No.:
09/885853
Inventors:
William Bernier - Endwell NY, US
Charles Carey - Endicott NY, US
Eberhard Gramatzki - Essex Junction VT, US
Thomas Homa - Binghamton NY, US
Eric Johnson - Greene NY, US
Pierre Langevin - Granby, CA
Irving Memis - Vestal NY, US
Son Tran - Endwell NY, US
Robert White - Essex Junction VT, US
Assignee:
International Business machines Corporation - Armonk NY
International Classification:
H01L021/44
H01L023/48
US Classification:
257/738000, 438/613000, 257/782000, 257/780000, 438/108000
Abstract:
A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.
Thomas R Homa from Binghamton, NY, age ~82 Get Report