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Sylvia Adae-Amoakoh

from Binghamton, NY
Age ~66
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Also known as:
Sylvia Adae Amoakoh, Sylvia Adae Asante, Sylvia Amoakoh Asante, Sylvia A Asante, Sylvia Adae Adae, Sylvia A Adae, Sylvia Adae H, Amoakoh Sylvia Adae, Sylvia H
Phone and address:
16 Hallam St, Binghamton, NY 13903
(607) 759-3546
Related to:
Diana Lee, 43Francis A Anderson, 61Seth Kofi Asante, 66Alexis Asante, 33
Connected to:
Josaih Adaelu, 39Helena P Adaes, 52Jaime Adaes, 56Charmaine N Adagio, 46Diane A Adah, 58Leslie I Adah, 71Raman Adaikkalavan, 46Mohammad Y Adaileh, 52Adolf B Adair, 74Adrianne N Adair, 41

Sylvia Adae-Amoakoh Phones & Addresses

  • 16 Hallam St, Binghamton, NY 13903 (607) 759-3546 (607) 724-2557
  • Corona, NY
  • Irvington, NJ

Work

Company: Ametek aerospace Dec 1, 2011 to Nov 14, 2016 Position: Quality manager

Education

Degree: Doctorates, Doctor of Philosophy School / High School: King's College London Specialities: Philosophy, Organic Chemistry

Skills

Six Sigma • Team Building • Engineering Management • Supply Management • Manufacturing Engineering • Systems Engineering • 5S • Pcb Design • Troubleshooting • Electronics • Test Equipment • Supply Chain Management • Supplier Quality • Green Belt • Iso 9000 • Materials • Engineering • Quality Assurance • Inspection • Quality System • Minitab • Process Control • Operations Management • Program Management • Testing • Design For Manufacturing • Iso 14001 • Cross Functional Team Leadership • Value Stream Mapping • Project Planning • Failure Analysis • Procurement • Operational Excellence • Aerospace • Semiconductors • Kaizen • Product Development • Quality Control • Kanban • Process Engineering • Spc • Metrology • Continuous Improvement • As9100 • Supply Chain • Capa • Dmaic • Mrp • R&D • Process Simulation

Public records

Vehicle Records

Sylvia Adae-Amoakoh

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Address:
16 Hallam St, Binghamton, NY 13903
Phone:
(607) 221-4193
VIN:
5FNYF4H59BB054376
Make:
HONDA
Model:
PILOT
Year:
2011

Resumes

Resumes

Sylvia Adae-Amoakoh Photo 1

Quality Manager

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Location:
16 Hallam St, Binghamton, NY 13903
Work:
Ametek Aerospace Dec 1, 2011 - Nov 14, 2016
Quality Manager
Sanmina Feb 1, 2010 - Nov 1, 2011
Lab Manager
Endicott Interconnect Technologies, Inc. Nov 1, 2002 - May 1, 2009
Supplier Quality Engineer
Ibm Jan 1, 1999 - Jan 1, 2002
Me Manager
Education:
King's College London
Doctorates, Doctor of Philosophy, Philosophy, Organic Chemistry University of London, Chelsea College
Bachelors, Bachelor of Science, Chemistry
Skills:
Six Sigma
Team Building
Engineering Management
Supply Management
Manufacturing Engineering
Systems Engineering
5S
Pcb Design
Troubleshooting
Electronics
Test Equipment
Supply Chain Management
Supplier Quality
Green Belt
Iso 9000
Materials
Engineering
Quality Assurance
Inspection
Quality System
Minitab
Process Control
Operations Management
Program Management
Testing
Design For Manufacturing
Iso 14001
Cross Functional Team Leadership
Value Stream Mapping
Project Planning
Failure Analysis
Procurement
Operational Excellence
Aerospace
Semiconductors
Kaizen
Product Development
Quality Control
Kanban
Process Engineering
Spc
Metrology
Continuous Improvement
As9100
Supply Chain
Capa
Dmaic
Mrp
R&D
Process Simulation

Publications

Us Patents

Capacitor Laminate For Use In Printed Circuit Board And As An Interconnector

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US Patent:
6370012, Apr 9, 2002
Filed:
Aug 30, 2000
Appl. No.:
09/652596
Inventors:
Sylvia Adae-Amoakoh - Binghamton NY
John M. Lauffer - Waverly NY
Michael D. Lowell - Endicott NY
Voya R. Markovich - Endwell NY
Joseph J. Sniezek - Endwell NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01G 4228
US Classification:
3613063, 361303, 361311
Abstract:
A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e. g. , chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layers outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.

Method Of Making A Parallel Capacitor Laminate

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US Patent:
6524352, Feb 25, 2003
Filed:
Jan 9, 2002
Appl. No.:
10/043830
Inventors:
Sylvia Adae-Amoakoh - Binghamton NY
John M. Lauffer - Waverly NY
Michael D. Lowell - Endicott NY
Voya R. Markovich - Endwell NY
Joseph J. Sniezek - Endwell NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01G 900
US Classification:
29 2503, 3613013, 3613063, 427 79
Abstract:
A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e. g. , chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layers outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.

Economical High Density Chip Carrier

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US Patent:
6753612, Jun 22, 2004
Filed:
Apr 5, 2001
Appl. No.:
09/827014
Inventors:
Sylvia Adae-Amoakoh - Binghamton NY
John S. Kresge - Binghamton NY
Voya R. Markovich - Endwell NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 2940
US Classification:
257774, 257690, 257758, 257778
Abstract:
A flip-chip joinable substrate having non-plated-on contact pads. The substrate has an external metal foil layer upon a dielectric layer upon a patterned internal metal layer having an internal contact area. An area of the external metal foil layer above the internal contact area is selected. A microvia cavity extending to the internal contact area is perforated centrally within the selected area and is filled with a mass of conductive paste forming an external contact pad. The external contact pad is used as an etch mask for removing the adjacent external metal foil.

Economical High Density Chip Carrier

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US Patent:
6998290, Feb 14, 2006
Filed:
Nov 18, 2003
Appl. No.:
10/715736
Inventors:
Sylvia Adae-Amoakoh - Binghamton NY, US
John S. Kresge - Binghamton NY, US
Voya R. Markovich - Endwell NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 21/44
US Classification:
438106, 438613
Abstract:
A method for forming a flip-chip joinable substrate having non-plated-on contact pads. The substrate has an external metal foil layer upon a dielectric layer upon a patterned internal metal layer having an internal contact area. An area of the external metal foil layer above the internal contact area is selected. A microvia cavity extending to the internal contact area is perforated centrally within the selected area and is filled with a mass of conductive paste forming an external contact pad. The external contact pad is used as an etch mask for removing the adjacent external metal foil.

Photographic Developing Compositions And Use Thereof In The Processing Of Photographic Elements

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US Patent:
57925984, Aug 11, 1998
Filed:
Mar 27, 1996
Appl. No.:
8/623344
Inventors:
Sylvia Adae-Amoakoh - Binghamton NY
Bruce Mel Resnick - Vestal NY
Assignee:
International Paper Company - Purchase NY
International Classification:
G03C 529
US Classification:
430440
Abstract:
Photographic developing compositions are provided that are free of dihydroxybenzene developing agents and are used in the processing of photographic elements. The developing compositions have a pH in the range of from 10. 1 to 10. 9 and comprise at least 0. 17 moles per liter of an ascorbic acid developing agent, 0. 3 to 0. 5 moles per liter of a sulfite and 0. 2 to 0. 4 moles per liter of a carbonate buffer. Also provided is an ecologically advantageous method for processing photographic elements which utilizes the non-toxic developing compositions.

Photographic Developing Compositions And Use Thereof In The Processing Of Photographic Elements

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US Patent:
55039669, Apr 2, 1996
Filed:
Jul 22, 1994
Appl. No.:
8/278736
Inventors:
Sylvia Adae-Amoakoh - Binghamton NY
Bruce M. Resnick - Vestal NY
Assignee:
International Paper Company - Purchase NY
International Classification:
G03C 5305
US Classification:
430492
Abstract:
Photographic developing compositions are provided that are free of dihydroxybenzene developing agents and are used in the processing of photographic elements. The developing compositions have a pH in the range of from 10. 1 to 10. 9 and comprise at least 0. 17 moles per liter of an ascorbic acid developing agent, 0. 3 to 0. 5 moles per liter of a sulfite and 0. 2 to 0. 4 moles per liter of a carbonate buffer. Also provided is an ecologically advantageous method for processing photographic elements which utilizes the non-toxic developing compositions.
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Sylvia Adae-Amoakoh from Binghamton, NY, age ~66 Get Report