Stephen A Yao

20170331316, Nov 16, 2017

May 16, 2016

15/156225

- Cupertino CA, US
Makiko K. Brzezinski - Santa Clara CA, US
Christopher S. Graham - San Francisco CA, US
Stephen E. Yao - San Mateo CA, US

Apple Inc. - Cupertino CA

H02J 7/02
H01F 38/14
H01F 27/28

This application relates to inductive charging coil configurations. In particular, the wireless charging coil configurations are arranged in a shape and size suitable for utilizing available space within a device housing. In some embodiments, wires making up the charging coil have varying diameters configured to optimize the size and shape of the charging coil so that available space can be fully utilized.

20160351324, Dec 1, 2016

Aug 12, 2016

15/236001

- Cupertino CA, US
Eric S. Jol - Cupertino CA, US
Makiko K. Brzezinski - Cupertino CA, US
Paul J. Thompson - Cupertino CA, US
Stephen E. Yao - Cupertino CA, US

H01F 27/28
H02J 50/80
H01F 38/14
H02J 7/02
H01F 41/064
H02J 50/12

An inductor coil for an inductive energy transfer system includes multiple layers of a single wire having windings that are interlaced within at least two of the multiple layers such that both an input end and an output end of the wire enter and exit the coil on a same side of the coil. The input end and the output end of the wire may abut one another at the location where the input and output wires enter and exit the inductor coil. The wire can include one or more bundles of strands and the strands in each bundle are twisted around an axis extending along a length of the wire, and when there are at least two bundles, the bundles may be twisted around the axis. At least one edge of the inductor coil can be formed into a variety of shapes, such as in a curved shape.

20160064141, Mar 3, 2016

Sep 2, 2015

14/843687

- Cupertino CA, US
Karl Ruben F. Larsson - Cupertino CA, US
Paul J. Thompson - Cupertino CA, US
Eric S. Jol - Cupertino CA, US
John S. Mosy - Cupertino CA, US
Albert J. Golko - Cupertino CA, US
Stephen E. Yao - Cupertino CA, US
Makiko K. Brzezinski - Cupertino CA, US

H01F 27/36
H01F 27/24
H01F 1/147
H01F 1/153

In some embodiments, an electronic device includes an electronic component that is at least partially encapsulated by an adhesive doped with soft magnetic material that functions as an EMI shield for the electronic component. In various embodiments, an electronic device includes a first magnetic component separated from a second magnetic component by a gap within which is positioned an adhesive doped with soft magnetic material. The doped adhesive is positioned in a magnetic path between the first and second magnetic components and aids in magnetically coupling the first and second magnetic components and/or guides magnetic flux between the first and second magnetic components.

20150348697, Dec 3, 2015

May 30, 2014

14/291024

- Cupertino CA, US
Eric S. Jol - Cupertino CA, US
Makiko K. Brzezinski - Cupertino CA, US
Paul J. Thompson - Cupertino CA, US
Stephen E. Yao - Cupertino CA, US

Apple Inc. - Cupertino CA

H01F 27/28
H01F 41/04

An inductor coil for an inductive energy transfer system includes multiple layers of a single wire having windings that are interlaced within at least two of the multiple layers such that both an input end and an output end of the wire enter and exit the coil on a same side of the coil. The input end and the output end of the wire may abut one another at the location where the input and output wires enter and exit the inductor coil. The wire can include one or more bundles of strands and the strands in each bundle are twisted around an axis extending along a length of the wire, and when there are at least two bundles, the bundles may be twisted around the axis. At least one edge of the inductor coil can be formed into a variety of shapes, such as in a curved shape.

20150308470, Oct 29, 2015

Apr 25, 2014

14/262455

- Cupertino CA, US
Stephen E. Yao - Cupertino CA, US
Eric S. Jol - Cupertino CA, US
Makiko K. Brzezinski - Cupertino CA, US

Apple Inc. - Cupertino CA

F16B 1/00

A first component is coupled to a second component by one or more joints. Magnetic force between at least a first magnetic and second magnetic unit preloads the joint by placing the joint in compression. The first and second magnetic units may be respectively coupled to the first and second components. The magnetic force acts as a retentive force between coupled components and/or the joint and operates to resist one or more tensile and/or other opposing forces. In some cases, the first magnetic unit may be a shield, such as a direct current shield, that protects one or more components from a magnetic field of the second magnetic unit.

20150280483, Oct 1, 2015

Mar 25, 2015

14/668551

- Cupertino CA, US
Eric S. Jol - Cupertino CA, US
Christopher S. Graham - Cupertino CA, US
Paul J. Thompson - Cupertino CA, US
Jeffrey M. Alves - Cupertino CA, US
Stephen E. Yao - Cupertino CA, US
Makiko K. Brzezinski - Cupertino CA, US
Todd K. Moyer - Cupertino CA, US
Daniel Wagman - Cupertino CA, US
Micah Lewis-Kraus - Cupertino CA, US

H02J 7/02
H02J 7/00

A thermal management system for an electromagnetic induction-power transfer system. The system may include a charging apparatus including a housing that defines an interface surface. An accessory or induction-power consuming apparatus may be positioned proximate to the interface surface. The housing of the charging apparatus may include a power source and a power-transferring coil coupled to the power source and positioned below the interface surface. A thermal mass may be positioned within the housing and spaced apart from the interface surface. The housing may include a thermal path that is configured to conduct heat from the interface surface to the thermal mass.

20150270046, Sep 24, 2015

Mar 24, 2015

14/666556

- Cupertino CA, US
Eric S. Jol - Cupertino CA, US
Christopher S. Graham - Cupertino CA, US
Paul J. Thompson - Cupertino CA, US
Jeffrey M. Alves - Cupertino CA, US
Daniel Wagman - Cupertino CA, US
Stephen E. Yao - Cupertino CA, US
Makiko K. Brzezinski - Cupertino CA, US

H01F 7/02
H01F 38/14

A first and second electronic device each including a connection surface and a magnetic element. The first and second devices may be in contact along the respective connection surfaces. The magnetic elements may be configured to align the first and second devices by moving either or both of the first and second devices relative to each other to achieve an aligned position. The magnetic element may also be operative to resist disconnection of first and second electronic devices when in the aligned position.

20150270058, Sep 24, 2015

Mar 24, 2015

14/666793

- Cupertino CA, US
Eric S. Jol - Cupertino CA, US
Christopher S. Graham - Cupertino CA, US
Stephen E. Yao - Cupertino CA, US
Makiko K. Brzezinski - Cupertino CA, US
Daniel Wagman - Cupertino CA, US
Paul J. Thompson - Cupertino CA, US
Nagarajan Kalyanasundaram - Cupertino CA, US

H01F 27/36
H01F 38/14

A first electronic device connects with an second electronic device. The first electronic device may include a first connection surface and an inductive power transfer receiving coil and a first magnetic element positioned adjacent to the first connection surface. The second electronic device may similarly include a second connection surface and an inductive power transfer transmitting coil and second magnetic element positioned adjacent to the second connection surface. In the aligned position, alignment between the electronic devices may be maintained by magnetic elements and the inductive power coils may be configured to exchange power. The magnetic elements and/or the inductive power coils may include a shield that is configured to minimize or reduce eddy currents caused in the magnetic elements by the inductive power coils.