Song Lin Phones & Addresses
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3 Centre St, Dover, MA 02030
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Hillsborough, NJ
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West Lebanon, NH
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Flushing, NY
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26 Rennie Rd, Hanover, NH 03755 (603) 643-2228
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Chattanooga, TN
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Norwich, VT
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Conyers, GA
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Queens, NY
Business Records
Name / Title
Company / Classification
Phones & Addresses
President
SZECHUAN CHEF'S, INC
Restaurant Specializing In Szechuan Cooking
Restaurant Specializing In Szechuan Cooking
6 Vinal Sq, North Chelmsford, MA 01863
North Chelmsford, MA 01863
(978) 251-9888
North Chelmsford, MA 01863
(978) 251-9888
EEOJIAN SEA FOOD MARKET, INC
40-48 Main St, Flushing, NY 11354
Publications
Us Patents
Apparatus And Methods For Radio Frequency Signal Limiting
View pageUS Patent:
20210399757, Dec 23, 2021
Filed:
Jun 18, 2020
Appl. No.:
16/946360
Inventors:
- Norwood MA, US
Song Lin - Burlington MA, US
Song Lin - Burlington MA, US
International Classification:
H04B 1/40
H03F 3/24
H03F 1/56
H03F 3/24
H03F 1/56
Abstract:
Apparatus and methods for radio frequency (RF) signal limiting are provided. In certain embodiments, an RF signal limiting system includes a cascade of a front limiter and a biased limiter. Additionally, the front limiter provides an initial amount of limiting to an RF signal, while the biased limiter serves to further limit the RF signal. The biased limiter is adaptively biased such that the amount of limiting provided to the RF signal increases in response to an increase in the RF signal level. Such an RF signal limiting system can be used in a variety of applications, including protecting an input of a low noise amplifier (LNA).
Coupled Line Structures For Wideband Applications
View pageUS Patent:
20210020589, Jan 21, 2021
Filed:
Jul 17, 2019
Appl. No.:
16/514444
Inventors:
- Co. Limerick, IE
Song Lin - Burlington MA, US
Xudong Wang - Colorado Springs CO, US
Song Lin - Burlington MA, US
Xudong Wang - Colorado Springs CO, US
International Classification:
H01L 23/66
H01L 23/528
H01L 23/522
H01P 5/02
H01P 5/12
H03F 3/68
H03F 3/195
H01L 23/528
H01L 23/522
H01P 5/02
H01P 5/12
H03F 3/68
H03F 3/195
Abstract:
Coupled line structures for wideband applications are provided herein. In certain embodiments, a coupled line structure includes one transmission line that is segmented in a metal layer and another that is substantially continuous in the metal layer, thereby allowing tighter spacing and higher coupling between the transmission lines relative to what is achievable if both transmission lines were continuous. The high coupling in turn aids in achieving wide bandwidth.
Transition Circuitry For Integrated Circuit Die
View pageUS Patent:
20200168567, May 28, 2020
Filed:
Feb 21, 2019
Appl. No.:
16/282170
Inventors:
- Norwood MA, US
Song Lin - Burlington MA, US
Song Lin - Burlington MA, US
International Classification:
H01L 23/66
H01P 3/08
H01P 3/00
H01P 3/08
H01P 3/00
Abstract:
An integrated circuit (IC) die having a first side and a second side opposite the first side is disclosed. The IC die can include a signal via through the IC die. The IC die can include processing circuitry. The IC die can include transition circuitry providing electrical communication between the processing circuitry and the signal via. The transition circuitry can comprise a first transmission line, a second transmission line, and a transition transmission line between the first and second transmission lines. In various embodiments, the first transmission line can comprise a microstrip (MS) line, and the second transmission line can comprise a grounded coplanar waveguide (CPW).
Matching Circuit For Integrated Circuit Die
View pageUS Patent:
20190371746, Dec 5, 2019
Filed:
Feb 21, 2019
Appl. No.:
16/282148
Inventors:
- Norwood MA, US
Peter J. Katzin - Arlington MA, US
Song Lin - Burlington MA, US
Peter J. Katzin - Arlington MA, US
Song Lin - Burlington MA, US
International Classification:
H01L 23/66
H01L 23/48
H03H 7/38
H01L 23/48
H03H 7/38
Abstract:
An integrated circuit (IC) die is disclosed. The IC die can include a signal via extending through the IC die. The IC die can include a transmission line extending laterally within the IC die in a direction non-parallel to the signal via, the transmission line configured to transfer an electrical signal to the signal via. The IC die can include a matching circuit disposed between the transmission line and the signal via. The matching circuit can include inductance and capacitance matching circuitry to compensate for parasitic inductance and capacitance introduced by transition from the IC die to an underlying carrier.
Functional Cell Surface Display Of Ligands For The Insulin And/Or Insulin Growth Factor 1 Receptor And Applications Thereof
View pageUS Patent:
20140342932, Nov 20, 2014
Filed:
Sep 18, 2012
Appl. No.:
14/345257
Inventors:
- Rahway NJ, US
Byung-Kwon Choi - Norwich VT, US
Song Lin - Hanover NH, US
Natarajan Sethuraman - Hanover NH, US
Hussam Shaheen - Lebanon NH, US
Terrance Stadheim - Lyme NH, US
Dongxing Zha - Etha NH, US
Byung-Kwon Choi - Norwich VT, US
Song Lin - Hanover NH, US
Natarajan Sethuraman - Hanover NH, US
Hussam Shaheen - Lebanon NH, US
Terrance Stadheim - Lyme NH, US
Dongxing Zha - Etha NH, US
International Classification:
G01N 33/74
US Classification:
506 9, 435 72, 435 732, 435 731, 435 721
Abstract:
Systems for making, identifying, and selecting recombinant cells that express a ligand for the insulin receptor (IR) or insulin growth factor I (IGF-1) receptor are described. In general, libraries of recombinant cells are constructed that are capable of displaying a plurality of ligand molecules on the cell surface. Recombinant cells that display a ligand in a form accessible for binding to the IR and/or IGF-1 receptor can be detected and the recombinant cells displaying said ligands can be selected and isolated using cell sorting technologies. In particular aspects, the system is useful for constructing and screening libraries of recombinant cells that express and displaying insulin analogue precursors molecules to identify and select recombinant cells in the library that bind the IR and/or IGF-1 receptor with a desired affinity and/or avidity.