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Seyed Saeidi

from Irvine, CA
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Related to:
Mehdi ImaninejadMehdi Saeidi, 48Mehdi Imaninejad, 49Arian GhaffariElham M Ghaffari, 46
Connected to:
Belinda C Saeidi, 68Chiya Saeidi, 40Giti G Saeidian, 65Hooman Saeidi, 43Main H Saeidi, 47Ramin Saeidian, 56Sanaz Saeidi, 40Sima S Saeidi, 66Kanokkarn Saejueng, 45Pranorm Saejueng, 50

Seyed Saeidi Phones & Addresses

  • Irvine, CA

Publications

Us Patents

Hybrid Thermal Interface Material For Ic Packages With Integrated Heat Spreader

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US Patent:
20140061893, Mar 6, 2014
Filed:
Aug 29, 2012
Appl. No.:
13/598291
Inventors:
Seyed Mahdi Saeidi - Irvine CA, US
Sam Ziqun Zhao - Irvine CA, US
Assignee:
BROADCOM CORPORATION - Irvine CA
International Classification:
H01L 23/34
H01L 21/50
US Classification:
257712, 438122, 257E2308, 257E21499
Abstract:
Flip chip packages are described that include two or more thermal interface materials (TIMs). A die is mounted to a substrate by solder bumps. A first TIM is applied to the die, and has a first thermal resistance. A second TIM is applied to the die and/or the substrate, and has a second thermal resistance that is greater than the first thermal resistance. An open end of a heat spreader lid is mounted to the substrate such that the die is positioned in an enclosure formed by the heat spreader lid and substrate. The first TIM and the second TIM are each in contact with an inner surface of the heat spreader lid. A ring-shaped stiffener may surround the die and be connected between the substrate and heat spreader lid by the second TIM.

Flexural Plate Wave Device For Chip Cooling

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US Patent:
20120050989, Mar 1, 2012
Filed:
Jun 30, 2011
Appl. No.:
13/173456
Inventors:
Milind S. Bhagavat - Fremont CA, US
Seyed Mahdi Saeidi - Irvine CA, US
Tak Sang Yeung - Irvine CA, US
Assignee:
BROADCOM CORPORATION - Irvine CA
International Classification:
H05K 7/20
US Classification:
361694
Abstract:
Methods, systems, and apparatuses are described for cooling electronic devices. The electrical device includes an integrated circuit die (IC) having opposing first and second surfaces, a plurality of interconnects on the second surface of the IC die that enable the IC die to be coupled to a substrate, and a flexural plate wave device. The flexural plate wave device is configured to generate a stream of air to flow across the electrical device to cool the IC die during operation of the IC die.
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Seyed Saeidi from Irvine, CA Get Report