Inventors:
Satoru Takase - Round Rock TX, US
Assignee:
Kabushiki Kaisha Toshiba - Tokyo
International Classification:
H03H 7/38
US Classification:
333 33, 257692, 257698, 257737
Abstract:
Systems and methods for improved semiconductor device performance are disclosed. In particular, presented are improved semiconductor systems and methods for configuring conductors to reduce impedance variation caused by proximity and/or density and/or operation of connection-bumps. The invention includes adding impedance-reducing conductive features which add no additional functionality to the semiconductor device. The added features may be arranged in areas of sparse connection-bump density. Impedance-reducing conductive features may include metal lines added between functional metal lines, where placement between adjacent functional lines may vary. Impedance-reducing conductive features may be added to any one or combination of conductive layers, and added features may act upon any one or combination of functional features. Further, added features may be electrically active and responsive to semiconductor device operation. Also, methods for determining connection-bump density, which methods may be automated.