US Patent:
20110114819, May 19, 2011
Inventors:
Sanjeev Malushte - Bethesda MD, US
Assignee:
Bechtel Power Corporation - Frederick MD
International Classification:
E04G 9/00
E04B 1/00
Abstract:
Systems and methods for constructing composite wall structures are described in which opposing faceplates are provided that define a transverse void. A plurality of through connector assemblies, which span the transverse void between the faceplates, are attached with the opposing faceplate. A connecting mechanism is applied to the through connector assemblies from an outside of at least one of the faceplates and attaches with portions of the through connector assemblies in the transverse void. The transverse void may be filled with a fill material after attaching the opposing faceplates with the plurality of through connector assemblies.