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Samuel Franklin Louke

from Portland, OR
Age ~68
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Also known as:
Samuel F Louke, Sam F Louke
Related to:
Jeremy LoukeEric W Richardson, 40Marissa D Richardson, 41Phyllis A Louke, 70
Connected to:
Gina L Loukedis, 67Mark C Loukedis, 57Mark M Loukhton, 77Houssine E Loukili, 66Dmitri Loukinov, 67Elaine Loukola, 80Steve A Loukopoulos, 67Daniel J Loukota, 65Joe J Loukota, 110Richard J Loukota, 59

Samuel Louke Phones & Addresses

  • Portland, OR
  • 16800 Siler Ridge Ln, Beaverton, OR 97007 (503) 579-6987
  • 17495 Sarala St, Beaverton, OR 97007
  • 1720 196Th Ave, Beaverton, OR 97006
  • 4070 188Th Ave, Beaverton, OR 97007

Publications

Us Patents

Orbital Motion Chemical-Mechanical Polishing Apparatus And Method Of Fabrication

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US Patent:
55540643, Sep 10, 1996
Filed:
Aug 6, 1993
Appl. No.:
8/103412
Inventors:
Joseph R. Breivogel - Aloha OR
Samuel F. Louke - Beaverton OR
Michael R. Oliver - Tigard OR
Leopoldo D. Yau - Portland OR
Christopher E. Barns - Portland OR
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
B24B 2900
B24B 722
US Classification:
451 41
Abstract:
A method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is fed through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during polishing. A substrate is pressed face down against the orbiting pad's surface and rotated to facilitate, along with the slurry, the polishing of the thin film formed on the substrate.

Orbital Motion Chemical-Mechanical Polishing Method And Apparatus

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US Patent:
60959045, Aug 1, 2000
Filed:
Feb 1, 1996
Appl. No.:
8/595182
Inventors:
Joseph R. Breivogel - Aloha OR
Samuel F. Louke - Beaverton OR
Michael R. Oliver - Tigard OR
Leopoldo D. Yau - Portland OR
Christopher E. Barns - Portland OR
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
B24B 722
US Classification:
451 41
Abstract:
A method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is fed through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during polishing. A substrate is pressed face down against the orbiting pad's surface and rotated to facilitate, along with the slurry, the polishing of the thin film formed on the substrate.
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Samuel Franklin Louke from Portland, OR, age ~68 Get Report