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Sabir Ahmed Majumder

from Harrisburg, NC
Age ~67
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Also known as:
Sabir A Majumder, Sabir Ahmed Dr Majumder, Sabir Hamida Majumder, Sabir K Majumder, Sabir A Majunder, Ahmed Majumder Sabir, Sabir A Majumber, Majumder Sabir, Sabir V, Kelly Stephens
Related to:
Bradt Nabilah Majumder, 35
Connected to:
Anjan K Majumder, 74Arnab Majumder, 62Atreyee Majumder, 39Avijit Majumder, 34Dipmalya Majumder, 42Gourab Majumder, 47Indira Majumder, 82Jaydip Majumder, 37Mohammed B Majumder, 68Neela Majumder, 65

Sabir Majumder Phones & Addresses

  • Harrisburg, NC
  • Charlotte, NC
  • Halfmoon, NY
  • 940 Sunrise Dr, Fremont, CA 94539 (510) 687-0609
  • 43964 Cerro Ct, Fremont, CA 94539 (510) 687-0609
  • 43965 Cerro Ct, Fremont, CA 94539
  • San Luis Obispo, CA
  • Albuquerque, NM
  • San Jose, CA
  • Alameda, CA

Publications

Us Patents

Apparatus And Method For Distributing A Polishing Fluid

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US Patent:
7040970, May 9, 2006
Filed:
Jul 15, 2004
Appl. No.:
10/892428
Inventors:
Simon McClatchie - Fremont CA, US
Sabir Majumder - Fremont CA, US
Ren Zhou - Fremont CA, US
Xuyen Pham - Fremont CA, US
Tuan A. Nguyen - San Jose CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B 1/00
US Classification:
451 60, 451285
Abstract:
An apparatus and method for evenly distributing a polishing fluid onto a polishing pad during a chemical mechanical planarization process, wherein the polishing fluid is dispersed by way of a spray being emitted from a spray nozzle. The pattern of polishing fluid applied to the polishing pad can be modified by adjustment of geometric parameters of the spray nozzle. The apparatus is configured with actuating mechanisms for translating and rotating the spray nozzle relative to the polishing pad in order to adjust a pattern of distribution of the polishing fluid. The method of dispersing polishing fluid onto the polishing pad produces an even distribution of polishing fluid across a width of the polishing pad.

Pre-Planarization System And Method

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US Patent:
8403727, Mar 26, 2013
Filed:
Mar 31, 2004
Appl. No.:
10/816417
Inventors:
Fred C. Redeker - Fremont CA, US
John M. Boyd - Atascadero CA, US
Yezdi Dordi - Palo Alto CA, US
Sabir A. Majumder - Fremont CA, US
Simon McClatchie - Fremont CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B 1/00
B24B 7/19
B24B 7/30
US Classification:
451 57, 451 41
Abstract:
A method for producing a normalized surface on a substrate for a chemical mechanical planarization process is provided. The method initiates with grinding a surface of the substrate with a first surface associated with a first planarization length. The method includes planarizing the surface of the substrate with a second surface associated with a second planarization length. Here, the second planarization length being less than the first planarization length. A system for processing a semiconductor substrate is also provided.

Methods For Reducing Slurry Usage In A Linear Chemical Mechanical Planarization System

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US Patent:
6953391, Oct 11, 2005
Filed:
Jul 28, 2004
Appl. No.:
10/901678
Inventors:
Sabir A. Majumder - Fremont CA, US
Zhefei Chen - Los Altos CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B001/00
US Classification:
451 60, 451446, 451 36
Abstract:
Methods for dispensing slurry in a linear chemical mechanical planarization (CMP) system are provided. One method involves the use of a pulsing flow of slurry instead of a continuous flow of slurry. Another method involves spraying a mist of slurry onto the polishing pad. Yet another method involves controlling the gap between the nozzles from which the slurry is dispensed and the top surface of the polishing pad. Each of these methods reduces the amount of slurry used during a CMP operation.
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Sabir Ahmed Majumder from Harrisburg, NC, age ~67 Get Report