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Rusty H Winzenread

from San Jose, CA
Age ~63
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Also known as:
Rusty W Winzenread, Marvin R Winzenread
Phone and address:
1588 Trevor Dr, San Jose, CA 95118
(408) 445-2161
Related to:
Russell P Silk, 28Hollie P Winzenread, 62Marvin R Winzenread, 87Lisa S Silk, 62Johanna W Winzenread, 83
Connected to:
Nicole Winzenried, 39Richard M Winzent, 59Donnetta M Winzer, 47Erica Winzer, 44Jeremy B Winzer, 34Margaret A Winzer, 60Dexter A Winzey, 61Allen A Winzler, 45Walter B Winzurk, 62Diana M Wion, 61

Rusty Winzenread Phones & Addresses

  • 1588 Trevor Dr, San Jose, CA 95118 (408) 445-2161
  • Eden Mills, VT
  • Sunnyvale, CA
  • 1588 Trevor Dr, San Jose, CA 95118

Work

Company: On semiconductor Position: Llsp bu director of operations and special projects

Industries

Semiconductors

Public records

Vehicle Records

Rusty Winzenread

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Address:
1588 Trevor Dr, San Jose, CA 95118
Phone:
(408) 445-2161
VIN:
3VWPL7AJ6BM647053
Make:
VOLKSWAGEN
Model:
JETTA
Year:
2011

Resumes

Resumes

Rusty Winzenread Photo 1

Llsp Bu Director Of Operations And Special Projects

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Location:
San Jose, CA
Industry:
Semiconductors
Work:
On Semiconductor
Llsp Bu Director of Operations and Special Projects

Publications

Us Patents

Edge Seals For Semiconductor Packages

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US Patent:
20190363124, Nov 28, 2019
Filed:
Aug 9, 2019
Appl. No.:
16/537149
Inventors:
- Phoenix AZ, US
Kyle THOMAS - San Francisco CA, US
David T. PRICE - Gresham OR, US
Rusty WINZENREAD - San Jose CA, US
Bruce GREENWOOD - Gresham OR, US
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC - Phoenix AZ
International Classification:
H01L 27/146
Abstract:
Implementations of semiconductor packages may include: a digital signal processor having a first side and a second side and an image sensor array, having a first side and a second side. The first side of the image sensor array may be coupled to the second side of the digital signal processor through a plurality of hybrid bond interconnect (HBI) bond pads and an edge seal. One or more openings may extend from the second side of the image sensor array into the second side of the digital signal processor to an etch stop layer in the second side of the digital signal processor. The one or more openings may form a second edge seal between the plurality of HBI bond pads and the edge of the digital signal processor.

Edge Seals For Semiconductor Packages

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US Patent:
20180219038, Aug 2, 2018
Filed:
Feb 1, 2017
Appl. No.:
15/421505
Inventors:
- Phoenix AZ, US
Kyle THOMAS - San Francisco CA, US
David T. PRICE - Gresham OR, US
Rusty WINZENREAD - San Jose CA, US
Bruce GREENWOOD - Gresham OR, US
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC - Phoenix AZ
International Classification:
H01L 27/146
Abstract:
Implementations of semiconductor packages may include: a digital signal processor having a first side and a second side and an image sensor array, having a first side and a second side. The first side of the image sensor array may be coupled to the second side of the digital signal processor through a plurality of hybrid bond interconnect (HBI) bond pads and an edge seal. One or more openings may extend from the second side of the image sensor array into the second side of the digital signal processor to an etch stop layer in the second side of the digital signal processor. The one or more openings may form a second edge seal between the plurality of HBI bond pads and the edge of the digital signal processor.
Control profile
Rusty H Winzenread from San Jose, CA, age ~63 Get Report