US Patent:
20020134408, Sep 26, 2002
Inventors:
Pamela Christison - Fort Collins CO, US
Lawrence Houdek - Loveland CO, US
John Pratt - Fort Collins CO, US
Russell Bjorlie - Loveland CO, US
William Hanna - Fort Collins CO, US
Perry Pierce - Fort Collins CO, US
International Classification:
B08B003/04
US Classification:
134/026000, 134/032000, 134/155000, 134/902000, 134/158000
Abstract:
An integrated circuit assembly cleaning apparatus and method allow a cleaning solution to completely fill spaces within an integrated circuit assembly. Such spaces include, for example, the thin space between the die and substrate of a flip-chip integrated circuit. The cleaning solution fills the space while the air initially occupying the space escapes. These actions are accomplished by first tilting the integrated circuit assembly from horizontal. The integrated circuit assembly is then immersed in the bath at a controllable rate to allow the cleaning solution to completely fill the space while the air in the space escapes.