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Ronald A Hellekson

from Veneta, OR
Age ~76

Ronald Hellekson Phones & Addresses

  • 87848 Huston Rd, Veneta, OR 97487 (541) 935-9671
  • 1995 Tigertail Rd, Eugene, OR 97405 (541) 687-2738
  • Milwaukie, OR
  • Lime, OR

Publications

Us Patents

Thin Film Microheaters For Assembly Of Inkjet Printhead Assemblies

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US Patent:
6460966, Oct 8, 2002
Filed:
Aug 23, 2001
Appl. No.:
09/938710
Inventors:
Ronald A. Hellekson - Eugene OR
Alfred I-Tsung Pan - Sunnyvale CA
Marshall Field - Corvallis OR
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
B41J 2175
US Classification:
347 20, 347 87
Abstract:
A method and apparatus for assembling an inkjet printhead is disclosed. The apparatus comprises one or more microheater resistors and a material, which can be reflowed by use of the heat generated by the microheater, disposed proximate to the heater resistor. The microheater resistor comprises a heater resistor with an input port and an output port. A first electrical conductor, coupled to the input port of the heater resistor, receives a first voltage and a second electrical conductor, coupled to the output port of the heater resistor, receives a second voltage. A curing effect in the adhesive is produced by heat generated in the heater resistor when electrical current flows through the resistor in response to an application of a first voltage to the first electrical conductor and a second voltage to the second electrical conductor.

Method Of Forming A Through-Substrate Interconnect

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US Patent:
6716737, Apr 6, 2004
Filed:
Jul 29, 2002
Appl. No.:
10/208363
Inventors:
Hubert Vander Plas - Palo Alto CA
Barry C. Snyder - Bend OR
Ronald A. Hellekson - Eugene OR
Ronnie J. Yenchik - Blodgett OR
Diane Lai - Corvallis OR
Samson Berhane - Corvallis OR
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
H01L 2144
US Classification:
438612, 438618, 438667
Abstract:
A method of forming a through-substrate interconnect for a circuit element in a microelectronics device is provided. The device is formed on a substrate having a frontside and a backside, and includes a circuit element formed on the frontside of the substrate connected to a contact pad formed on the backside of the substrate by the through-substrate interconnect. The method includes forming a first interconnect structure extending into the substrate from the frontside of the substrate, at least partially forming the circuit element such that the circuit element is in electrical communication with the first interconnect structure, and forming a second interconnect structure extending into the substrate from the backside of the substrate after forming the first interconnect structure such that the second interconnect structure is in electrical communication with the first interconnect structure.

Fluid Ejector Head Having A Planar Passivation Layer

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US Patent:
6767474, Jul 27, 2004
Filed:
Jul 19, 2002
Appl. No.:
10/198904
Inventors:
Kenneth E Trueba - Philomath OR
Ronnie J. Yenchik - Blodgett OR
Ronald A. Hellekson - Eugene OR
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B41J 204
US Classification:
216 27, 347 63, 347 64
Abstract:
A fluid ejector head, includes a fluid definition layer defining a chamber, the fluid definition layer having a substantially planar passivation surface. In addition, the fluid ejector head includes a sacrificial material filling the chamber that is planarized to the plane formed by the passivation surface. Further, the fluid ejector head includes a passivation layer, having substantially planar opposed major surfaces, formed on the planar passivation surface; and a resistive layer having substantially planar opposed major surfaces in contact with the passivation layer.

Printhead Nozzle Alignment In A Printing System

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US Patent:
6779869, Aug 24, 2004
Filed:
Jan 31, 2002
Appl. No.:
10/066065
Inventors:
Jeffrey T. Hendricks - Camas WA
Si-Lam Choy - Corvallis OR
Ronald A. Hellekson - Eugene OR
John M. Altendorf - Corvallis OR
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B41J 2300
US Classification:
347 37
Abstract:
The present invention relates to a carriage for use in a printing device, the carriage including a carriage body with a bearing structure configured to support such carriage body for movement along a reference track. The carriage also includes a printhead anchored to the carriage body, and aligned directly relative to the carriage bearing structure.

Fluid Ejector Head Having A Planar Passivation Layer

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US Patent:
6834942, Dec 28, 2004
Filed:
May 24, 2004
Appl. No.:
10/852894
Inventors:
Kenneth E Trueba - Philomath OR
Ronnie J. Yenchik - Blodgett OR
Ronald A. Hellekson - Eugene OR
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B41J 205
US Classification:
347 63
Abstract:
A fluid ejector head, includes a fluid definition layer defining a chamber, the fluid definition layer having a substantially planar passivation surface. In addition, the fluid ejector head includes a sacrificial material filling the chamber that is planarized to the plane formed by the passivation surface. Further, the fluid ejector head includes a passivation layer, having substantially planar opposed major surfaces, formed on the planar passivation surface; and a resistive layer having substantially planar opposed major surfaces in contact with the passivation layer.

Method Of Forming A Through-Substrate Interconnect

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US Patent:
6902872, Jun 7, 2005
Filed:
Jul 29, 2002
Appl. No.:
10/208163
Inventors:
Diane Lai - Corvallis OR, US
Samson Berhane - Corvallis OR, US
Barry C. Snyder - Bend OR, US
Ronald A. Hellekson - Eugene OR, US
Hubert Vander Plas - Palo Alto CA, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
G03F007/00
US Classification:
430322, 430323, 430324, 430325, 347 54, 347 55, 216 27
Abstract:
A method of manufacturing a microelectronics device is provided, wherein the microelectronics device is formed on a substrate having a frontside and a backside. The method comprises forming a circuit element on the frontside of the substrate from a plurality of layers deposited on the frontside of the substrate, wherein the plurality of layers includes an intermediate electrical contact layer, and forming an interconnect structure after forming the electrical contact layer. The interconnect structure includes a contact pad formed on the backside of the substrate, and a through-substrate interconnect in electrical communication with the contact pad, wherein the through-substrate interconnect extends from the backside of the substrate to the electrical contact layer.

Die Carrier With Fluid Chamber

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US Patent:
6917099, Jul 12, 2005
Filed:
Aug 27, 2003
Appl. No.:
10/650572
Inventors:
Ronald A. Hellekson - Eugene OR, US
Chien-Hua Chen - Corvallis OR, US
William R Boucher - Corvallis OR, US
Joshua W. Smith - Corvallis OR, US
David M Craig - Albany OR, US
Gary J. Watts - Albany OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
H01L023/02
US Classification:
257678, 257698, 257699, 257712, 257713, 257714, 257717, 257718, 257722
Abstract:
A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.

Mechanism To Aid Optical Beam Focusing On Optical Disc

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US Patent:
7103896, Sep 5, 2006
Filed:
Jan 8, 2003
Appl. No.:
10/339705
Inventors:
Michael A Pate - Corvallis OR, US
Ronald A. Hellekson - Eugene OR, US
Peter Guy Howard - Junction City OR, US
Andrew Koll - Albany OR, US
Andrew L. Van Brocklin - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
G11B 11/00
US Classification:
720718
Abstract:
An optical disc of one embodiment of the invention is disclosed that includes a first surface, a second surface, an optically writable label area, and an optically writable data area. The first and the second surfaces are oppositely situated to one another. The label area is on one of the first and the second surfaces. The data area is on one of the first and the second surfaces. The mechanism aids proper focusing of an optical beam of an optical disc device on the optically writable label area and on the optically writable data area.
Ronald A Hellekson from Veneta, OR, age ~76 Get Report