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Roger J Tietze

from The Woodlands, TX
Age ~70
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Also known as:
Roger Tieze, Roger Tietse, Rodger Tietze
Phone and address:
98 S Scribewood Cir, Spring, TX 77382
(281) 465-9685
Related to:
Tiffany A Tietze, 33Joan Stephanie Kobi, 69
Connected to:
Bruce E Tietze, 72Christopher C Tietze, 75Dustin Tietze, 34Frank Tietze, 100Harald Tietze, 58James Tietze, 66John L Tietze, 84Kief D Tietze, 46William B Tietze, 101Caitlin A Tieu, 29

Roger Tietze Phones & Addresses

  • 98 S Scribewood Cir, Spring, TX 77382 (281) 465-9685
  • The Woodlands, TX
  • Baldwin, NY
  • Denver, CO
  • 40 Acorn Rd, Brewster, NY 10509
  • 406 Driftway Ln, Brewster, NY 10509
  • Ridgewood, NY
  • Montgomery, TX

Work

Company: Huntsman corporation - The Woodlands, TX Apr 2003 Position: Lab manager

Education

School / High School: Long Island University- Brookville, NY 1984 Specialities: Bachelor of Science in Chemistry

Skills

Strategic Planning • projet management • Problem solving • Strong Interpersonnel skills

Resumes

Resumes

Roger Tietze Photo 1

Senior Technical Consultant

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Location:
Spring, TX
Industry:
Chemicals
Work:
Part Consulting
Senior Technical Consultant
Huntsman Advanced Materials Feb 1, 2004 - Feb 1, 2014
Lab Manager
Vantico 2001 - 2003
Senior Staff Chemist
Skills:
Polymers
Chemical Engineering
Coatings
Composites
Adhesives
Materials Science
R&D
Resin
Polymer Chemistry
Chemistry
Materials
Polymer Science
Additives
Polyurethane
Product Development
Manufacturing
Plastics
Process Engineering
Continuous Improvement
Six Sigma
Cross Functional Team Leadership
Raw Materials
Market Development
Organic Chemistry
Research and Development
Interests:
Poverty Alleviation
Roger Tietze Photo 2

Vice President Of Technology

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Location:
Spring, TX
Industry:
Chemicals
Work:
Part Consulting Llc
Vice President of Technology
Roger Tietze Photo 3

Roger Tietze The Woodlands, TX

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Work:
Huntsman Corporation
The Woodlands, TX
Apr 2003 to Feb 2014
Lab Manager
Ciba-Geigy Corporation
Ardsley, NY
Apr 1995 to Jun 2003
Chemist
Vantico Corporation
Brewster, NY
Jun 2001 to May 2003
Senior Staff Scientist
Ciba Specialty Corporation
Brewster, NY
Apr 1995 to Jun 2001
Staff Scientist
Gull Airborne Inc
Smithtown, NY
Aug 1985 to Jun 1986
Engineer
Education:
Long Island University
Brookville, NY
1984
Bachelor of Science in Chemistry
Skills:
Strategic Planning, projet management, Problem solving, Strong Interpersonnel skills

Publications

Us Patents

Phosphoric Acid Resistant Polymaleimide Prepolymer Compositions

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US Patent:
8445699, May 21, 2013
Filed:
Mar 16, 2010
Appl. No.:
13/256269
Inventors:
Roger Tietze - The Woodlands TX, US
Assignee:
Huntsman Advanced Materials Americas LLC - The Woodlands TX
International Classification:
C07D 207/452
US Classification:
548521
Abstract:
The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.

Boroxine Derivatives As Flame Retardant

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US Patent:
20100059174, Mar 11, 2010
Filed:
Feb 23, 2006
Appl. No.:
11/816923
Inventors:
Roger Tietze - The Woodlands TX, US
Dave Orser - Lodi NJ, US
Yefim Blyakhman - Brooklyn NY, US
Mark Bryant - The Woodlands TX, US
Ulrich Weidmann - Basel, CH
Assignee:
HUNTSMAN ADVANCED MATERIALS AMERICAS INC. - THE WOODLANDS
International Classification:
C07F 5/05
C08K 5/55
B32B 38/08
US Classification:
156278, 568 3, 524183
Abstract:
The instant invention relates to boroxine derived compounds, for example tripropargylboroxine, the preparation of said compounds and the use as flame retardant in polymeric resins, in particular in thermosetting polymeric resins.

Halogen-Free Benzoxazine Based Curable Compositions For High Tg Applications

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US Patent:
20100330287, Dec 30, 2010
Filed:
Feb 20, 2009
Appl. No.:
12/918433
Inventors:
Roger Tietze - The Woodlands TX, US
Assignee:
Huntsman Advanced Materials Americas LLC - The Woodlands TX
International Classification:
B05D 3/02
C08K 5/205
C08K 5/21
C08L 63/00
US Classification:
427386, 524201, 524211, 523400
Abstract:
The present invention provides a halogen-free curable composition including a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.

Benzoxazine Compounds Derivated From Phenolphtalein Having Flame-Retardant Properties And A Process For Their Preparation

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US Patent:
20110152453, Jun 23, 2011
Filed:
Sep 27, 2005
Appl. No.:
11/663879
Inventors:
Roger Tietze - Brewster NY, US
Dave Orser - Brewster NY, US
Yeflm Blyakhman - Brewster NY, US
Mark Bryant - Brester NY, US
Assignee:
Huntsman Advanced Materials Americas Inc. - The Woodlands TX
International Classification:
C08L 79/04
C07D 413/14
C08G 73/06
US Classification:
524879, 544 73, 528354
Abstract:
The instant invention relates to 3,3′-bis(3,4-dihydro-3-phenyl-2H-1,3-benzoxazin-6-yl)-1(3H)-isobenzofuranone and analogues based on phenolphthalein, formaldehyde and a primary amine. Such compounds are, when cured to form polymeric networks, difficultly inflammable and resistant to high temperatures. Such compounds may especially be used in the production of printed wiring boards.

Liquid Monobenzoxazine Based Resin System

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US Patent:
20120046388, Feb 23, 2012
Filed:
May 14, 2010
Appl. No.:
13/266476
Inventors:
Roger Tietze - The Woodlands TX, US
Mark Bryant - The Woodlands TX, US
Assignee:
Huntsman Advanced Materials Americas LLC - The Woodlands TX
International Classification:
C08L 79/00
B29C 45/14
C08G 73/00
US Classification:
523400, 528421, 528393, 264257
Abstract:
The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.

Low Dielectric Loss Thermoset Resin System At High Frequency For Use In Electrical Components

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US Patent:
20120318571, Dec 20, 2012
Filed:
Mar 2, 2011
Appl. No.:
13/580179
Inventors:
Roger Tietze - The Woodlands TX, US
Assignee:
Huntsman Advanced Materials Americas LLC - The Woodlands TX
International Classification:
C09D 163/00
C08K 5/3492
C08K 5/53
H05K 1/00
B05D 3/02
B32B 27/04
B32B 15/092
C08K 5/5333
B05D 7/24
US Classification:
174258, 523400, 523451, 427386, 442117, 428418, 442228
Abstract:
The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.

Halogen Free Thermoset Resin System For Low Dielectric Loss At High Frequency Applications

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US Patent:
20140057086, Feb 27, 2014
Filed:
May 9, 2012
Appl. No.:
14/110522
Inventors:
Roger Tietze - The Woodlands TX, US
Assignee:
Huntsman Advanced Materials Americas LLC - The Woodlands TX
International Classification:
C08L 71/08
H05K 1/03
US Classification:
428196, 525152, 524130, 524508, 427 58, 442 59, 442180, 428458, 442172
Abstract:
The present disclosure provides a thermosetting resin composition including a polymaleimide prepolymer and a poly(arylene ether) prepolymer characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards, semiconductor devices and radome composites for aerospace applications.

Flame Retardant Polyimide System

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US Patent:
52409813, Aug 31, 1993
Filed:
Jun 3, 1991
Appl. No.:
7/709905
Inventors:
Benjamin G. Chin - Croton-on-Hudson NY
Roger Tietze - Baldwin NY
Assignee:
Ciba-Geigy Corporation - Ardsley NY
International Classification:
C08K 504
C08K 516
C08K 520
US Classification:
524234
Abstract:
The present invention relates to a polyimide resin composition and products, especially storage stable polyimide pre-pregs, manufactured therefrom with improved processing properties comprising (A) the reaction product of a polyimide, an alkenylphenol or an alkenylphenol ether, and tribromophenyl-maleimide, (B) an ionic or free-radical polymerization catalyst and (C) phenothiazine derivatives.
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Roger J Tietze from The Woodlands, TX, age ~70 Get Report