Rodman A Mogle

48882470, Dec 19, 1989

Aug 27, 1986

6/900984

Carl H. Zweben - Devon PA
Rodman A. Mogle - Clinton NY
Benjamin T. Rodini - Wayne PA
Charles L. Thaw - Phoenixville PA

General Electric Company - King of Prussia PA

B32B 516

428105

Heat conducting laminates and laminated heat conducting devices having at least one layer of metal and at least one layer of polymer matrix composite material having low-thermal-expansion reinforcing material distributed throughout and embedded therein. The coefficient of thermal expansion and the thermal conductivity of the laminated heat conducting devices are defined by the metal in combination with the polymer matrix material and the low-thermal-expansion reinforcing material in the laminate. The coefficient of thermal expansion and thermal conductivity of a heat conducting device can be controlled by bonding at least one layer of metal to at least one layer of polymer matrix composite material having low-thermal-expansion reinforcing material distributed throughout and embedded therein. In one embodiment, the laminated heat conducting device comprises a plurality of alternating layers of aluminum and epoxy resin having graphite fibers distributed throughout the epoxy resin.

43132626, Feb 2, 1982

Dec 17, 1979

6/103984

Norman S. Barnes - Whitesboro NY
Rodman A. Mogle - Clinton NY

General Electric Company - Utica NY

H05K 334

29840

An improved multilayered circuit is disclosed comprising a molybdenum substrate with alternating layers of dielectric and conducting thick film materials deposited thereon. The molybdenum substrate has the advantages of being its own chassis, having a coefficient of thermal expansion that is well matched to the thick film materials and component ceramic chip carriers, and having a high thermal conductivity so as to act as its own heat sink.