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Robert Gephard Phones & Addresses

  • 72 Oakdale Ave, Poughkeepsie, NY 12601 (845) 485-6439 (845) 454-3338
  • 70 Oakdale Ave, Poughkeepsie, NY 12601
  • Marlboro, NY
  • Bolingbrook, IL
  • 72 Oakdale Ave, Poughkeepsie, NY 12601

Work

Position: Executive, Administrative, and Managerial Occupations

Publications

Us Patents

Method Of Fabricating A Multi-Layer Integrated Circuit Chip Interposer

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US Patent:
53866274, Feb 7, 1995
Filed:
Nov 17, 1993
Appl. No.:
8/154225
Inventors:
Richard B. Booth - Wappingers Falls NY
Robert H. Gephard - Poughkeepsie NY
Bradley S. Gremban - Lake Katrine NY
Janet E. Poetzinger - Rochester MN
David T. Shen - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 346
H05K 342
US Classification:
29852
Abstract:
A multilayer, high yield and high density integrated circuit (IC) chips interposer and the method of manufacture therefore. A thin polyimide film is circuitized with copper on both sides. One side may be reserved for power or ground with the opposite side being a signal plane. Adhesive is laminated over both sides covering the circuit patterns. Vias are drilled through at least one adhesive surface, and through the polyimide film. Metal (copper) is blanket sputtered to coat the via walls. Polymer Metal Conductive (PMC) paste is screened to at least partially fill the vias. The Blanket metal is sub-etched using the screened PMC as a mask. Layers are stacked to form the interposer with the PMC bonding the stacked layers together and electrically interconnecting between layers.

Method For Replacing Ic Chip Package Interposer

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US Patent:
53849558, Jan 31, 1995
Filed:
Jan 5, 1994
Appl. No.:
8/179832
Inventors:
Richard B. Booth - Wappingers Falls NY
Robert H. Gephard - Poughkeepsie NY
Bradley S. Gremban - Lake Katrine NY
Janet E. Poetzinger - Rochester MN
David T. M. Shen - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 336
B23P 600
US Classification:
29830
Abstract:
A method of replacing IC chip package wiring having an interposer comprising removing an interposer having a plurality of adhesively laminated interposer layers from the package, delaminating and replacing at least one interposer layer with a corrected interposer layer, relaminating the interposer layers with adhesive thus producing a replacement interposer and remounting the replacement interposer to the IC chip package.

Parallel Process Interposer (Ppi)

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US Patent:
54040442, Apr 4, 1995
Filed:
Nov 17, 1993
Appl. No.:
8/154312
Inventors:
Richard B. Booth - Wappingers Falls NY
Robert H. Gephard - Poughkeepsie NY
Bradley S. Gremban - Lake Katrine NY
Janet E. Poetzinger - Rochester MN
David T. Shen - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 3902
US Classification:
257698
Abstract:
A multilayer, high yield and high density integrated circuit (IC) chips interposer and the method of manufacture therefore. A thin polyimide film is circuitized with copper on both sides. One side may be reserved for power or ground with the opposite side being a signal plane. Adhesive is laminated over both sides covering the circuit patterns. Vias are drilled through at least one adhesive surface, and through the polyimide film. Metal (copper) is blanket sputtered to coat the via walls. Polymer Metal Conductive (PMC) paste is screened to at least partially fill the vias. The Blanket metal is sub-etched using the screened PMC as a mask. Layers are stacked to form the interposer with the PMC bonding the stacked layers together and electrically interconnecting between layers.
Robert H Gephard from Poughkeepsie, NY, age ~82 Get Report