Inventors:
Richard B. Booth - Wappingers Falls NY
Robert H. Gephard - Poughkeepsie NY
Bradley S. Gremban - Lake Katrine NY
Janet E. Poetzinger - Rochester MN
David T. Shen - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 346
H05K 342
Abstract:
A multilayer, high yield and high density integrated circuit (IC) chips interposer and the method of manufacture therefore. A thin polyimide film is circuitized with copper on both sides. One side may be reserved for power or ground with the opposite side being a signal plane. Adhesive is laminated over both sides covering the circuit patterns. Vias are drilled through at least one adhesive surface, and through the polyimide film. Metal (copper) is blanket sputtered to coat the via walls. Polymer Metal Conductive (PMC) paste is screened to at least partially fill the vias. The Blanket metal is sub-etched using the screened PMC as a mask. Layers are stacked to form the interposer with the PMC bonding the stacked layers together and electrically interconnecting between layers.