Robert E Mclean

6720203, Apr 13, 2004

Feb 26, 2003

10/374611

Peter Francis Carcia - Wilmington DE
Robert Scott McLean - Hockessin DE

E. I. du Pont de Nemours and Company - Wilmington DE

H01L 5140

438 99, 257 40, 313511

Flexible composite barrier structures are used to improve the resistance, to oxygen and moisture degradation, of an organic electronic device including at least one active layer comprising an organic material.

7005798, Feb 28, 2006

May 28, 2004

10/856512

Peter Francis Carcia - Wilmington DE, US
Robert Scott McLean - Hockessin DE, US

E. I. du Pont de Nemours and Company - Wilmington DE

H01J 1/62
H01L 21/56
H01L 31/12

313498, 313505, 313506, 313511, 313512, 428690, 428917, 428331, 438116, 438118, 438127, 257E31095

The present invention relates to a device having a flexible organic electronic device comprising in the order listed:.

7067843, Jun 27, 2006

Sep 24, 2003

10/669940

Peter Francis Carcia - Wilmington DE, US
Robert Scott McLean - Hockessin DE, US

E. I. du Pont de Nemours and Company - Wilmington DE

H01L 29/04

257 59

Transistors fabricated with transparent oxide semiconductors are provided. The semiconductors are metal oxides deposited without the intentional incorporation of additional doping elements, and enable the fabrication of transparent thin film transistors. The transparent transistors can be used to control pixels in a display, without significantly reducing the active area of the pixels.

7470607, Dec 30, 2008

Oct 10, 2003

10/527173

Peter Francis Carcia - Wilmington DE, US
Robert S. McLean - Hockessin DE, US

E.I. Du Pont De Nemours & Company - Wilmington DE

H01L 21/44

438609, 438608, 257E33064, 257E31126

This invention relates to novel, transparent oxide semiconductor thin film transistors (TFT's) and a process for making them.

8445937, May 21, 2013

Mar 26, 2008

12/055560

Peter Francis Carcia - Wilmington DE, US
Robert Scott McLean - Hockessin DE, US

E I du Pont de Nemours and Company - Wilmington DE

H01L 33/00

257100, 257E33059

Gas permeation barriers can be deposited on plastic or glass substrates by atomic layer deposition (ALD). The use of the ALD coatings can reduce permeation by many orders of magnitude at thicknesses of tens of nanometers with low concentrations of coating defects. These thin coatings preserve the flexibility and transparency of the plastic substrate. Such articles are useful in container, electrical and electronic applications.

8524003, Sep 3, 2013

Aug 31, 2009

12/550766

Peter Francis Carcia - Wilmington DE, US
Calixto Estrada - Middletown DE, US
Richard Dale Kinard - Wilmington DE, US
Robert Scott McLean - Hockessin DE, US
Kirstin H. Shilkitus - Landenberg PA, US

E I du Pont de Nemours and Company - Wilmington DE

C23C 16/00

118718, 118500

A cassette for supporting a film during a gaseous vapor deposition has first and second end plates. A rib on each end plate forms a spiral groove that edgewise receives a spiral wrapping of a film having a width greater than 300 mm. Spaces between turns of the film wrapping define a gas flow channel and spaces between adjacent turns of the rib define a plurality of inlet openings in one end plate that communicate with the channel. Each rib has a predetermined width dimension, a predetermined average thickness dimension, and a width-to-thickness aspect ratio of at least 2:1. The spacing between end plates is at least three hundred millimeters (300 mm) and is also greater than the width dimension of a film substrate at a gaseous deposition temperature. The width dimension of each rib is between about 0. 5% to about 2.

8529700, Sep 10, 2013

Aug 31, 2009

12/550832

Peter Francis Carcia - Wilmington DE, US
Richard Dale Kinard - Wilmington DE, US
Robert Scott McLean - Hockessin DE, US
Geoffrey Nunes - Swarthmore PA, US
Kirstin H. Shilkitus - Landenberg PA, US

E I Du Pont de Nemours and Company - Wilmington DE

C23C 16/00

118718, 118500

A vapor deposition apparatus includes an insert within which a material is deposited on the surface of a film. A cassette includes end plates each having a rib that edgewise receive a spiral wrapping of a film at least 300 mm wide. Spaces between turns of the wrapping define a gas flow channel and spaces between adjacent turns of one rib define inlet openings that communicate with the channel. Each rib has a predetermined width dimension, a predetermined average thickness dimension, and a width-to-thickness aspect ratio of at least 2:1. The spacing between end plates is at least 300 mm and is also greater than the film width at deposition temperature. The width dimension of each rib is between about 0. 5% to about 2. 0% of the end plate spacing.

8551249, Oct 8, 2013

Aug 31, 2009

12/550743

Peter Francis Carcia - Wilmington DE, US
Calixto Estrada - Middletown DE, US
Richard Dale Kinard - Wilmington DE, US
Robert Scott McLean - Hockessin DE, US
Kirstin H. Shilkitus - Landenberg PA, US

E I du Pont de Nemours and Company - Wilmington DE

C23C 16/00

118718, 118500

A cassette for supporting a film during a gaseous vapor deposition process includes a central shaft having first and second end plates. A rib on each end plate forms a spiral groove able to accept an edge of a film. Each rib has a cross sectional configuration having substantially linear major edges, a predetermined width dimension and a predetermined average thickness dimension, and a width-to-thickness aspect ratio of at least 2:1. The rib could be substantially rectangular with an optional flow spoiler at the free end or substantially wedge-shaped. The interspoke spacing between end plates is at least three hundred millimeters (300 mm) and is also greater than the width dimension of a film substrate at a gaseous deposition temperature. The width dimension of each rib is between about 0. 5% to about 2.